公开(公告)号：US20230170670A1

公开(公告)日：2023-06-01

申请号：US17540440

申请日：2021-12-02

Applicant: MELLANOX TECHNOLOGIES, LTD. ,  BAR-ILAN UNIVERSITY

Inventor： Dimitrios Kalavrouziotis ,  Paraskevas Bakopoulos ,  Elad Mentovich ,  Anna Sandomirsky ,  Boaz Atias ,  Doron Naveh ,  Eilam Zigi Ben Smolinsky ,  Adi Levi ,  Rana Darweesh

IPC: H01S5/10 ,  H01S5/026 ,  H01S5/068

CPC classification number: H01S5/1014 ,  H01S5/026 ,  H01S5/068

Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.

公开(公告)号：US11630266B2

公开(公告)日：2023-04-18

申请号：US17421389

申请日：2019-01-17

Applicant: MELLANOX TECHNOLOGIES, LTD. ,  YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY LTD.

Inventor： Eran Aharon ,  Dan Mark Marom ,  Dimitrios Kalavrouziotis ,  Paraskevas Bakopoulos ,  Elad Mentovich

IPC: G02B6/35

Abstract: An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

公开(公告)号：US11561352B2

公开(公告)日：2023-01-24

申请号：US16928037

申请日：2020-07-14

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Dimitrios Kalavrouziotis ,  Donald Becker ,  Boaz Atias ,  Paraskevas Bakopoulos ,  Elad Mentovich

IPC: G02B6/42 ,  H04B10/25 ,  G02B6/38 ,  G02B6/02

Abstract: A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

公开(公告)号：US20220091341A1

公开(公告)日：2022-03-24

申请号：US17421389

申请日：2019-01-17

Applicant: MELLANOX TECHNOLOGIES, LTD. ,  YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY LTD.

Inventor： Eran Aharon ,  Dan Mark Marom ,  Dimitrios Kalavrouziotis ,  Paraskevas Bakopoulos ,  Elad Mentovich

IPC: G02B6/35

Abstract: An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

公开(公告)号：US12114416B2

公开(公告)日：2024-10-08

申请号：US17517693

申请日：2021-11-03

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Elad Mentovich ,  Anna Sandomirsky ,  Dimitrios Kalavrouziotis

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/38 ,  H05K1/18 ,  H05K3/30 ,  H01L23/13 ,  H10N10/13

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/38 ,  H05K1/0298 ,  H05K1/183 ,  H05K3/30 ,  H01L23/13 ,  H10N10/13

Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

公开(公告)号：US11990935B2

公开(公告)日：2024-05-21

申请号：US17568441

申请日：2022-01-04

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Paraskevas Bakopoulos ,  Elad Mentovich ,  Tali Septon ,  Dimitrios Syrivelis ,  Ioannis (Giannis) Patronas ,  Dimitrios Kalavrouziotis ,  Moshe Oron

IPC: H04B10/11 ,  H04B10/70

CPC classification number: H04B10/11 ,  H04B10/70

Abstract: An apparatus comprises a support structure and one or more first optical components on the support structure that communicatively couple with a first endpoint. The one or more first optical components are configured to output and receive optical signals that travel over a free space medium to establish a secure link between the first endpoint and a second endpoint.

公开(公告)号：US11921662B2

公开(公告)日：2024-03-05

申请号：US17636484

申请日：2019-08-21

Applicant: Mellanox Technologies, Ltd.

Inventor： Dotan Levi ,  Elad Mentovich ,  Ran Ravid ,  Roee Shapiro ,  Avraham Ganor ,  Paraskevas Bakopoulos ,  Dimitrios Kalavrouziotis

IPC: G06F13/40 ,  G06F13/42

CPC classification number: G06F13/4004 ,  G06F13/42

Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

公开(公告)号：US11906873B2

公开(公告)日：2024-02-20

申请号：US17694159

申请日：2022-03-14

Applicant: Mellanox Technologies, Ltd.

Inventor： Nikos Argyris ,  Paraskevas Bakopoulos ,  Dimitrios Kalavrouziotis ,  Elad Mentovich

IPC: G02F1/21 ,  G02F1/225 ,  H04B10/50

CPC classification number: G02F1/212 ,  G02F1/225 ,  H04B10/505

Abstract: Embodiments are disclosed for providing a serializer and/or a deserializer with redundancy using optical modulators. An example system includes an MZM structure that comprises a first waveguide interferometer arm structure and a second waveguide interferometer arm structure. The first waveguide interferometer arm structure comprises a first segmented electrode associated with at least a first electrode and a second electrode. The second waveguide interferometer arm structure comprises a second segmented electrode associated with at least a third electrode and a fourth electrode. The MZM structure is configured to convert an optical input signal into an optical output signal through application of a digital data signal to the first electrode and the third electrode, and application of a redundant digital data signal to the second electrode and the fourth electrode.

公开(公告)号：US20240053542A1

公开(公告)日：2024-02-15

申请号：US17900490

申请日：2022-08-31

Applicant: Mellanox Technologies, Ltd.

Inventor： Dimitrios Kalavrouziotis ,  Elad Mentovich ,  Paraskevas Bakopoulos

IPC: G02B6/293 ,  H04B10/50 ,  H04B10/532

CPC classification number: G02B6/29302 ,  H04B10/501 ,  H04B10/532 ,  G02B6/29395 ,  G02B6/29344

Abstract: Optical communication devices and associated methods of manufacturing are provided. An example optical communication device includes a substrate defining a first end and a second end. The optical communication device also includes a primary optical communication medium attached to the second end and a secondary optical communication medium attached to the second end. The optical communication device further includes a signal preclusion component supported by the substrate that selectively preclude signal transmission of optical signals received via the first end to either the primary optical communication medium or the secondary optical communication medium.

公开(公告)号：US11789203B2

公开(公告)日：2023-10-17

申请号：US17362405

申请日：2021-06-29

Applicant: Mellanox Technologies, Ltd.

Inventor： Dimitrios Kalavrouziotis ,  Yaakov Gridish ,  Paraskevas Bakopoulos ,  Anders Gösta Larsson ,  Elad Mentovich

IPC: G02B6/26 ,  G02B6/42 ,  G02B6/14 ,  G02B6/122 ,  H01S3/067

CPC classification number: G02B6/268 ,  G02B6/262 ,  G02B6/421 ,  G02B6/1228 ,  G02B6/14 ,  H01S3/06745

Abstract: Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.