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公开(公告)号：US20080029398A1
公开(公告)日：2008-02-07
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。
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公开(公告)号：US20050145482A1
公开(公告)日：2005-07-07
申请号：US10973350
申请日：2004-10-27
申请人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
发明人： Hidenao Suzuki , Koji Mishima , Hiroyuki Kanda , Kazufumi Nomura , Kunihito Ide , Kazuyuki Yahiro , Hiroshi Toyoda , Tetsuo Matsuda
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D21/10 , H01L21/288 , H01L21/3205 , H01L21/68 , H01L21/683
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/06
摘要： An apparatus and a method for processing substrate are generally used for apparatuses for wet-type process of substrate, such as an electrolytic processing apparatus for use in forming interconnects by embedding a metal such as copper (Cu) or the like in fine interconnect patterns (recesses) that are formed in a substrate such as a semiconductor wafer and for use in forming bumps for electrical connections. The substrate processing apparatus includes: a substrate holder for holding a substrate; a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate; a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode, wherein the substrate holder is designed to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.
摘要翻译： 用于处理衬底的装置和方法通常用于衬底的湿式处理装置，例如通过将金属（例如铜）（Cu）等嵌入到精细互连图案中而形成互连件的电解处理装置 凹部），其形成在诸如半导体晶片的基板中，并且用于形成用于电连接的凸块。 基板处理装置包括：用于保持基板的基板保持件; 第一电极，用于接触所述衬底以向所述衬底的处理表面供电; 第二电极，其设置成面对由所述基板保持器保持的所述基板的处理表面; 以及处理液体供应部分，用于将处理液体供应到由基板保持器保持的基板的处理表面与第二电极之间的空间中，其中基板保持器设计成在加工期间使基板旋转， 重复减速和/或正常旋转和反向旋转。
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公开(公告)号：US20050077173A1
公开(公告)日：2005-04-14
申请号：US10930823
申请日：2004-09-01
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Brett Baker , Hariklia Deligianni , Phillipe Vereecken
IPC分类号： C25D17/14 , C25D7/12 , C25D17/00 , H01L21/288
CPC分类号： C25D7/123 , C25D17/001 , C25D17/004 , C25D17/008 , H01L21/2885
摘要： The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, including: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate; an anode vertically moveable disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member disposed between the plating solution impregnated material and the surface, to be plated, of the substrate; wherein the plating solution impregnated material is constructed of a plurality of separate members.
摘要翻译： 本发明提供了一种用于基板的电镀装置，其能够在保持多孔构件的整个表面与基板的被镀表面接触的同时，在均匀的压力下对基板进行平板化，而不增加要施加的载荷。 一种基板电镀装置，包括：用于保持基板的基板支架; 阴极单元，具有密封构件，该密封构件以水密方式邻接并密封被基板保持件保持的基板的待镀表面的周边部分，以及与基板保持件接触的阴极电极 所述基板向所述基板提供电流; 可垂直移动的阳极，其被布置成与所述基板的要被电镀的表面相对; 电镀溶液浸渍材料，其设置在阳极和要被电镀的表面之间，所述电镀液浸渍材料由保水材料制成; 以及设置在所述电镀溶液浸渍材料和要被电镀的所述表面的多孔构件之间; 其中所述电镀溶液浸渍材料由多个分开的构件构成。
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公开(公告)号：US5974871A
公开(公告)日：1999-11-02
申请号：US49468
申请日：1998-03-27
申请人： Hiroyuki Kanda , Takeshi Kuwahara
发明人： Hiroyuki Kanda , Takeshi Kuwahara
CPC分类号： G01M13/005
摘要： An impact and a vibration are applied to a portion of a piston ring on which a belt body is wound, and a vibration is also applied to the belt body. A position where a desired tension can be obtained is obtained by using a master gauge having an outer diameter equal to the inner diameter of a cylinder, and the like. When measuring the tension, a measuring mechanism is moved to this position. The frictional force between the piston ring and the belt body can be considerably decreased, and a closed gap need not be measured every time measurement is performed. Accordingly, the tension of the piston ring can be stably measured at high precision within a short period of time.
摘要翻译： 对卷绕有皮带主体的活塞环的一部分施加冲击和振动，并且也对皮带体施加振动。 通过使用具有等于圆筒内径的外径的母尺等来获得可以获得期望的张力的位置。 测量张力时，将测量机构移至该位置。 活塞环和带体之间的摩擦力可以大大降低，并且每次进行测量时都不需要测量闭合间隙。 因此，可以在短时间内以高精度稳定地测量活塞环的张力。
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公开(公告)号：US5168398A
公开(公告)日：1992-12-01
申请号：US557082
申请日：1990-07-25
申请人： Hiroyuki Kanda , Yasumasa Kawai
发明人： Hiroyuki Kanda , Yasumasa Kawai
CPC分类号： G11B5/59627
摘要： In a servo system for a hard disk drive, an integrating circuit for eliminating an offset of a head has its capacitor charged to an extent corresponding to an offset amount, at a time of a track following control operation, before an integral action is done. The integrating circuit performs the integral action through the utilization of the charged capacity to eliminate the offset amount of the head. A CPU retrieves an initially prepared offset table for one of voltage level data corresponding to the offset amount which is determined in accordance with a head's destination track. A D/A converter converts the voltage level data which comes from CPU to a voltage and supplies it to the capacitor in the integrating circuit.
摘要翻译： 在用于硬盘驱动器的伺服系统中，用于消除头部的偏移的积分电路在完成积分动作之前，在跟踪控制操作时，将电容器充电到与偏移量相对应的程度。 积分电路通过利用充电容量来执行积分动作以消除头部的偏移量。 CPU根据头的目的地轨道确定与偏移量相对应的电压电平数据之一，检索最初准备的偏移表。 D / A转换器将来自CPU的电压电平数据转换为电压，并将其提供给积分电路中的电容器。
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公开(公告)号：US09866601B2
公开(公告)日：2018-01-09
申请号：US14617381
申请日：2015-02-09
IPC分类号： G06F15/173 , H04L29/06 , H04L29/08 , H04N21/226 , H04N21/442 , H04N21/458
CPC分类号： H04L65/4038 , H04L67/32 , H04N21/2265 , H04N21/44209 , H04N21/4586
摘要： A communication system is provided that includes a communication terminal that stores at least one program and a plurality of update apparatuses that provide update data for updating the program to the communication terminal. The communication terminal includes a memory that stores update apparatus information associated with communication bandwidth information, and processing circuitry that calculates an actual bandwidth obtained from a previous downloading of previous update data, determines an update apparatus for downloading next update data based on the calculated actual bandwidth and the update apparatus information stored in the memory, and downloads the next update data from the determined update apparatus.
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公开(公告)号：US08365950B2
公开(公告)日：2013-02-05
申请号：US11597266
申请日：2005-05-18
申请人： Shoji Yuyama , Hiroyuki Kanda
发明人： Shoji Yuyama , Hiroyuki Kanda
CPC分类号： G07F11/42 , G07F11/165 , G07F17/0092
摘要： A medicine dispensing device has a device body (1), shelf members (2) arranged in the vertical directions in the device body (1), and a medicine conveyance member (3) for conveying medicines (D), received in the shelf members (2), on one by one basis from the front face side of the device body (1). A shelf member (2) has cassettes (26) in which medicines (D) are received in line, a pusher (31) for pushing the medicines in the cassettes (26) toward the front face side of the device body (10), and a constant load spring (32) for applying a constant load to the medicines (D) received in the cassettes (26) through the pusher (31). To fill the cassettes (26) with the medicines (D), the shelf member (2) can be pulled out from the front face side of the device body (1) and then positioned by pivoting the shelf member (2) so as to face obliquely downward.
摘要翻译： 一种药剂分配装置，具有装置主体（1），在装置本体（1）中沿垂直方向配置的搁架构件（2），以及用于输送药品（D）的药剂输送构件（3） （2），从装置本体（1）的前表面一个接一个地。 搁架构件（2）具有盒（26），其中药品（D）成对接收，推动器（31）用于将盒（26）中的药物朝向装置主体（10）的正面侧推动， 以及用于通过推动器（31）对容纳在盒（26）中的药物（D）施加恒定负载的恒定负载弹簧（32）。 为了用药物（D）填充盒（26），搁架构件（2）可以从装置主体（1）的正面侧拉出，然后通过摆动搁架构件（2）定位，以便 面向下倾斜。
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公开(公告)号：US08029653B2
公开(公告)日：2011-10-04
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译： 电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。 电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的 电镀电流。
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公开(公告)号：US07686184B2
公开(公告)日：2010-03-30
申请号：US11597004
申请日：2005-05-18
IPC分类号： B23Q7/04
CPC分类号： G07F11/42 , G07F11/165 , G07F17/0092
摘要： A medicine dispensing device capable of appropriately dispensing medicines independent of their form and having a compact structure. The medicine dispensing device has a device body (1) and a medicine conveyance member (3) for conveying, on one by one basis, medicines (D) arranged in rows in the device body (1). The medicine conveyance member (3) has a medicine holding member (40) reciprocatingly moving in the horizontal and vertical directions. The medicine holding member (40) has a support member (42), a forwardly/backwardly moving member (43) reciprocatingly moving in the forward and backward direction of the device body (1) while being supported by the support member(42), and a holding member (44) supported by the forwardly/backwardly moving member (43) so as to swing between a vertical position and a horizontal position and having a pair of holding sections (54) capable of holding a medicine (D).
摘要翻译： 一种药物分配装置，其能够独立于其形式适当地分配药物并具有紧凑的结构。 药剂分配装置具有装置主体（1）和药物输送部件（3），用于一个接一个地输送在装置主体（1）中排成行的药物（D）。 药剂输送部件（3）具有沿水平方向和垂直方向往复移动的药剂保持部件（40）。 药物保持部件（40）具有支撑部件（42），向前/向后移动的部件（43），其在由支撑部件（42）支撑的同时沿着装置主体（1）的前后方向往复移动， 以及由所述向前/向后移动构件（43）支撑以在垂直位置和水平位置之间摆动并具有能够容纳药物（D）的一对保持部（54）的保持构件（44）。
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公开(公告)号：US20090045067A1
公开(公告)日：2009-02-19
申请号：US12232516
申请日：2008-09-18
申请人： Koji Mishima , Kunihito Ide , Hidenao Suzuki , Kazufumi Nomura , Hiroyuki Kanda
发明人： Koji Mishima , Kunihito Ide , Hidenao Suzuki , Kazufumi Nomura , Hiroyuki Kanda
CPC分类号： C25D17/002 , C25D17/001 , C25D21/04 , H01L21/2885
摘要： A method and apparatus are set forth capable of processing a substrate with a high uniformity within the surface area even for a thin feeding layer. The method comprises arranging a counter electrode and the substrate to confront each other; providing a membrane between the counter electrode and the substrate to define a substrate side region and a counter electrode side region. The substrate side region and the counter electrode side region are capable of accommodating respective electrolytes. The substrate side region and the counter electrode side region are supplied with respective electrolytes having different specific resistances. A processing current is also supplied between the substrate and the counter electrode.
摘要翻译： 提出了一种方法和装置，即使对于薄的进料层，也能够在表面积内处理高均匀性的基板。 该方法包括布置对置电极和基板以彼此面对; 在对电极和基板之间提供膜以限定基板侧区域和对电极侧区域。 基板侧区域和对置电极侧区域能够容纳各种电解质。 向基板侧区域和对电极侧区域供给具有不同比电阻的各电解质。 在基板和对置电极之间也提供处理电流。
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