-
公开(公告)号：US09582693B2
公开(公告)日：2017-02-28
申请号：US14192894
申请日：2014-02-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Hirokazu Yazaki
CPC classification number: G06K7/10178 , G06K19/07794 , H01Q1/243 , H01Q1/36 , H01Q7/00 , H01Q7/06 , H01Q7/08
Abstract: An antenna device includes a power feed coil antenna connected to a power feed circuit, and a booster coil antenna including wound coil conductors and disposed so as to be electromagnetically coupled to the power feed coil antenna. The power feed coil antenna includes a first coil antenna and a second coil antenna each including a coil conductor, and the coil conductors of the first and second coil antennas are connected in phase with each other. The first coil antenna is disposed such that the winding axis of the coil conductor of the first coil antenna extends perpendicularly or substantially perpendicularly to the winding axis of the booster coil antenna, and such that at least a portion of the first coil antenna overlaps the coil conductor of the booster coil antenna as viewed in plan. The second coil antenna is disposed in the vicinity of the coil conductors such that the winding axis of the coil conductor of the second coil antenna extends in parallel with the winding axis of the booster coil antenna, and such that at least a portion of a coil opening of the second coil antenna does not overlap the coil conductors of the booster coil antenna as viewed in plan.
Abstract translation: 天线装置包括连接到馈电电路的馈电线圈天线和包括缠绕线圈导体并且被布置为与馈电线圈天线电磁耦合的升压线圈天线。 馈电线圈天线包括第一线圈天线和第二线圈天线，每个包括线圈导体，并且第一和第二线圈天线的线圈导体彼此同相连接。 第一线圈天线布置成使得第一线圈天线的线圈导体的绕轴垂直或基本上垂直于升压线圈天线的绕轴延伸，并且使得第一线圈天线的至少一部分与线圈重叠 升压线圈天线的导体如图所示。 第二线圈天线设置在线圈导体附近，使得第二线圈天线的线圈导体的绕轴与升压线圈天线的绕轴平行延伸，并且使得线圈的至少一部分 第二线圈天线的开口与计划中所示的升压线圈天线的线圈导体不重叠。
-
公开(公告)号：US08760242B2
公开(公告)日：2014-06-24
申请号：US13871200
申请日：2013-04-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Ikuo Tamaru , Hiroshi Masuda , Hirokazu Yazaki
CPC classification number: H03H7/12 , H03H7/0115 , H03H7/09 , H03H7/1708 , H03H7/1775 , H03H2001/0085
Abstract: A multilayer bandpass filter includes a first capacitor electrode of a first stage LC parallel resonator, a second capacitor electrode of a second stage LC parallel resonator, and a third capacitor electrode of a third stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the first stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the second stage LC parallel resonator. Via electrodes and a line electrode define an inductor electrode of the third stage LC parallel resonator. The inductor electrodes of the three LC parallel resonators are arranged so loop planes thereof are disposed about a center axis extending in a stacking direction of dielectric layers. This permits setting of electromagnetic coupling between the LC parallel resonators of an input and an output stage, and allows a filter's attenuation characteristics to be freely set.
Abstract translation: 多层带通滤波器包括第一级LC并联谐振器的第一电容器电极，第二级LC并联谐振器的第二电容器电极和第三级LC并联谐振器的第三电容器电极。 通过电极和线电极限定第一级LC并联谐振器的电感器电极。 通过电极和线电极限定第二级LC并联谐振器的电感器电极。 通过电极和线电极限定第三级LC并联谐振器的电感器电极。 三个LC并联谐振器的电感器电极被布置成使得其环形平面围绕在电介质层的层叠方向上延伸的中心轴设置。 这允许在输入和输出级的LC并联谐振器之间设置电磁耦合，并允许滤波器的衰减特性自由设定。
-
公开(公告)号：US11973281B2
公开(公告)日：2024-04-30
申请号：US17097637
申请日：2020-11-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
CPC classification number: H01Q9/26 , G06K19/077 , H01Q1/002 , H01Q1/38
Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, an antenna pattern provided on the base material, and an expansion member. The expansion member is disposed adjacent to the antenna pattern and has a coefficient of linear expansion that is higher than coefficients of linear expansion of the antenna pattern. When the RFID tag is subjected to an electromagnetic wave heating microwave, and thus the temperature of each portion rises, the antenna pattern breaks at a position of the expansion member. With this configuration, ignition and combustion are able to be prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while being attached to the food item.
-
公开(公告)号：US11916316B2
公开(公告)日：2024-02-27
申请号：US17132105
申请日：2020-12-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
IPC: H01Q9/26 , H01Q1/22 , H01Q1/38 , G06K19/077
CPC classification number: H01Q9/26 , H01Q1/2225 , H01Q1/38 , G06K19/07779 , G06K19/07798
Abstract: An RFID tag is provided for transmitting and receiving a communication signal. The RFID tag includes a base material, an antenna pattern disposed on the base material, and a high-loss member. The high-loss member is disposed adjacent to the antenna pattern and has a high loss at a frequency higher than a frequency of the communication signal, compared with the antenna pattern and the base material. When the RFID tag is subjected to an electromagnetic wave heating microwave, the high-loss member generates heat and the antenna pattern is cut at a position of the high-loss member.
-
公开(公告)号：US11166386B2
公开(公告)日：2021-11-02
申请号：US16522704
申请日：2019-07-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito Yonemori , Hirokazu Yazaki , Takanori Tsuchiya , Koji Kamada
Abstract: An interposer substrate includes a dielectric portion, a magnetic portion, and a first principal surface and a second principal surface opposite to each other. Connection terminal electrodes are each provided on a corresponding one of first principal surfaces of the dielectric portion and the magnetic portion, and are connected to a cable. Circuit-board terminal electrodes are provided on a second principal surface of the dielectric portion and connected to a circuit board. Wiring electrodes are provided inside a base body, and connecting the connection terminal electrodes to the circuit-board terminal electrodes in a predetermined connection pattern. The wiring electrodes include a first wiring electrode passing through only the dielectric portion, and a second wiring electrode passing through the magnetic portion.
-
Patent Agency Ranking
公开(公告)号：US11032904B2
公开(公告)日：2021-06-08
申请号：US16438519
申请日：2019-06-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Keito Yonemori , Takanori Tsuchiya , Koji Kamada , Takashi Noma
IPC: H05K1/00 , H05K1/18 , H05K7/00 , H05K1/11 , H01R12/62 , H05K1/02 , H05K1/14 , H05K3/46 , H05K3/36
Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.
-
公开(公告)号：US20210125017A1
公开(公告)日：2021-04-29
申请号：US17143461
申请日：2021-01-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Hirokazu Yazaki
IPC: G06K19/077 , G06K19/07
Abstract: An RFID tag is providing for transmitting and receiving a communication signal. The RFID tag includes a base material, antenna patterns formed on the base material, and an RFIC package connected to the antenna patterns. The antenna patterns are defined by conductor patterns. The whole of the antenna patterns resonate at a communication frequency, and each of the plurality of conductor patterns has a line length that does not cause resonance at a frequency in a microwave band for electromagnetic wave heating higher than the communication frequency.
-
公开(公告)号：US20210111493A1
公开(公告)日：2021-04-15
申请号：US17132105
申请日：2020-12-23
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
Abstract: An RFID tag is provided for transmitting and receiving a communication signal. The RFID tag includes a base material, an antenna pattern disposed on the base material, and a high-loss member. The high-loss member is disposed adjacent to the antenna pattern and has a high loss at a frequency higher than a frequency of the communication signal, compared with the antenna pattern and the base material. When the RFID tag is subjected to an electromagnetic wave heating microwave, the high-loss member generates heat and the antenna pattern is cut at a position of the high-loss member.
-
公开(公告)号：US10791659B2
公开(公告)日：2020-09-29
申请号：US16443932
申请日：2019-06-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki
Abstract: An electronic module includes a substrate, electronic components mounted on the substrate, a magnetic body provided on the substrate so as to cover the electronic components, and a metal shield provided on the magnetic body. An electronic circuit is defined using the electronic components. The electronic circuit includes a signal circuit. The metal shield includes ground connection portions connected to a ground electrode of the substrate, and a circuit connection portion connected to the signal circuit at a position different from the ground connection portions.
-
公开(公告)号：US20200014425A1
公开(公告)日：2020-01-09
申请号：US16568722
申请日：2019-09-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu Yazaki , Noriyuki Ueki , Noboru Kato
Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, antenna patterns provided on the base material, an RFIC package that is a feeding circuit connected to the antenna patterns, and an ignition protection member provided on the base material or the antenna patterns. Moreover, the ignition protection member contains moisture, such that ignition and combustion can be prevented even in a situation where the RFID tag is subjected to high-frequency power for heating a food item while attached to the food item or the like.
-
-
-
-
-
-
-
-
-
Search Results
45
records
(took 0.021 seconds)
