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公开(公告)号：US20210399699A1
公开(公告)日：2021-12-23
申请号：US17221845
申请日：2021-04-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunitoshi HANAOKA , Kiyoshi AIKAWA
Abstract: A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.
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公开(公告)号：US20250038773A1
公开(公告)日：2025-01-30
申请号：US18910105
申请日：2024-10-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroyuki KANI , Yoshihiro YOSHIMURA , Kiyoshi AIKAWA , Takahiro YAMASHITA , Yuusuke SUZUKI , Hidetaka TAKAHASHI , Takanori ITO , Takuma KUROYANAGI
Abstract: A radio frequency module includes a mounting board, a first acoustic wave filter including a first support disposed at a first main surface of the mounting board, a second acoustic wave filter including a second support disposed on the first acoustic wave filter, and a shield electrode. The shield electrode covers at least a part of the resin layer. The first acoustic wave filter and the second acoustic wave filter pass signals to perform simultaneous communication. A main surface of the second acoustic wave filter on an opposite side from a first acoustic wave filter side is in contact with the shield electrode. A ground electrode of the mounting board is connected to a functional electrode of the first acoustic wave filter.
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公开(公告)号：US20250007496A1
公开(公告)日：2025-01-02
申请号：US18826217
申请日：2024-09-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takuma KUROYANAGI , Yoshihiro YOSHIMURA , Kiyoshi AIKAWA , Takahiro YAMASHITA , Yuusuke SUZUKI
Abstract: An acoustic wave device includes a first transmission filter; and a second transmission filter stacked on the first transmission filter so that a first functional surface of the first transmission filter and a second functional surface of the second transmission filter face each other at a predetermined distance. The first transmission filter includes a first input terminal and a first acoustic wave resonator. The second transmission filter includes a second input terminal and a second acoustic wave resonator. The first acoustic wave resonator includes a first functional electrode formed on the first functional surface. The second acoustic wave resonator includes a second functional electrode formed on the second functional surface. In a plan view along a thickness direction of the first and second transmission filters, a first formation region of the first functional electrode and a second formation region of the second functional electrode do not overlap each other.
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公开(公告)号：US20240030201A1
公开(公告)日：2024-01-25
申请号：US18477747
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori UEJIMA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H01L25/162 , H04B1/38
Abstract: A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface, the third main surface facing the second main surface, multiple electronic components that are disposed between the second main surface and the third main surface, on or along the first main surface, and on or along the fourth main surface, and a LC component that is disposed in the module substrate and that is an inductor or a capacitor. A relative dielectric constant of the module substrate is higher than a relative dielectric constant of the module substrate.
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公开(公告)号：US20240030166A1
公开(公告)日：2024-01-25
申请号：US18477798
申请日：2023-09-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromichi KITAJIMA , Takanori UEJIMA , Kiyoshi AIKAWA , Yoshihiro DAIMON , Takashi YAMADA
CPC classification number: H01L23/66 , H04B1/525 , H01L24/16 , H03F3/213 , H03F1/565 , H01L23/293 , H01L25/0652 , H03F2200/294 , H03F2200/451 , H01L2223/6677 , H01L2223/6655 , H01L2223/6672 , H01L2224/16155 , H01L2224/16225 , H01L2924/14215 , H01L2924/1205 , H01L2924/1206
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier via a switch; a second electronic component including a filter coupled to the power amplifier via the switch; and a third electronic component including the switch. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.
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Patent Agency Ranking
公开(公告)号：US20240015914A1
公开(公告)日：2024-01-11
申请号：US18473336
申请日：2023-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihiro DAIMON , Takashi YAMADA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takanori UEJIMA
CPC classification number: H05K7/026 , H05K7/1427 , H05K1/181 , H05K1/0237 , H05K1/144 , H05K7/209 , H03F3/245
Abstract: A radio-frequency module includes a module substrate having major surfaces; a module substrate having major surfaces, the major surface being disposed facing the major surface; and plural electronic components disposed between the major surfaces, on the major surface, and on the major surface. The plural electronic components include: a first electronic component including the power amplifier; a second electronic component including a low-noise amplifier; a switch that switches connection and disconnection between a first filter and the power amplifier; and a third electronic component including a PA controller to control the power amplifier or a switch controller to control the switch. The first to third electronic components are separately disposed on the major surface, between the major surfaces, and on the major surface.
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公开(公告)号：US20240014834A1
公开(公告)日：2024-01-11
申请号：US18474279
申请日：2023-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Takanori UEJIMA
CPC classification number: H04B1/036 , H04B1/0078
Abstract: A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.
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公开(公告)号：US20230344460A1
公开(公告)日：2023-10-26
申请号：US18342743
申请日：2023-06-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masanari MIURA , Kiyoshi AIKAWA , Hiroyuki NAGAMORI , Takanori UEJIMA , Yuji TAKEMATSU , Takahiro YAMASHITA , Ryo WAKABAYASHI , Yoshihiro YOSHIMURA , Takashi HIROSE
IPC: H04B1/40 , H05K1/18 , H05K9/00 , H01L25/16 , H01L23/552
CPC classification number: H04B1/40 , H05K1/181 , H05K9/0022 , H01L25/16 , H01L23/552 , H05K2201/1006 , H05K2201/10015 , H05K2201/1003 , H05K2201/10053 , H05K2201/10371
Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.
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公开(公告)号：US20210159133A1
公开(公告)日：2021-05-27
申请号：US17142611
申请日：2021-01-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Takafumi KUSUYAMA
IPC: H01L23/14 , H01L23/31 , H01L23/66 , H01L23/498 , H01L25/18
Abstract: A circuit module includes a first wiring substrate having a first main surface and a plurality of first components mounted on the first main surface. The plurality of first components includes a multilayer component formed as a single chip by being sealed using resin members. The multilayer component includes a second wiring substrate having a second main surface and a third main surface that face each other, a second component mounted on the second main surface, and a third component mounted on the third main surface.
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公开(公告)号：US20190103843A1
公开(公告)日：2019-04-04
申请号：US16142079
申请日：2018-09-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA
CPC classification number: H03F1/565 , H03F3/189 , H03F2200/111 , H03F2200/165 , H03F2200/222 , H03F2200/294 , H03F2200/387 , H04B1/006 , H04B1/18
Abstract: A high-frequency circuit includes a first signal path transmitting a high-frequency signal in a first frequency band group, a second signal path transmitting a high-frequency signal in a second frequency band group, a switch including a common terminal and selection terminals, a first low noise amplifier including an input terminal connected to the first signal path and an output terminal connected to a first selection terminal, a second low noise amplifier including an input terminal connected to the second signal path and an output terminal connected to a second selection terminal, and an output-side impedance matching circuit that matches impedance at the output side of the first low noise amplifier or impedance at the output side of the second low noise amplifier with a predetermined impedance with a conductive state between the a third selection terminal and the common terminal.
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