公开(公告)号：US20120218737A1

公开(公告)日：2012-08-30

申请号：US13404587

申请日：2012-02-24

申请人： Izuru Komatsu ,  Daigo Suzuki

发明人： Izuru Komatsu ,  Daigo Suzuki

IPC分类号： F21V9/16 ,  F21V7/00

CPC分类号： F21V7/00 ,  F21K9/232 ,  F21V3/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

摘要： A lighting apparatus includes a base unit and a light emitting unit. The light emitting unit includes a substrate, a light emitting device and a reflective layer. The substrate is provided around a first axis which is along a direction from the base unit toward the light emitting unit. The substrate includes a portion having a tubular configuration opening downward from above. The tubular portion includes a plurality of light emission side surfaces disposed alternately around the first axis with a plurality of reflection side surfaces. The light emitting device is provided on each of the plurality of light emission side surfaces. The reflective layer is provided on each of the plurality of reflection side surfaces. The reflective layers are configured to reflect at least a portion of light emitted from the light emitting devices.

摘要翻译： 照明装置包括基座单元和发光单元。 发光单元包括基板，发光器件和反射层。 基板沿着从基部单元朝向发光单元的方向设置的第一轴线设置。 衬底包括具有从上方向下开口的管状构件的部分。 管状部分包括多个发光侧表面，多个发光侧表面以多个反射侧表面交替设置在第一轴线周围。 发光装置设置在多个发光侧表面中的每一个上。 反射层设置在多个反射侧表面中的每一个上。 反射层被配置为反射从发光器件发射的光的至少一部分。

公开(公告)号：US07604154B2

公开(公告)日：2009-10-20

申请号：US11756714

申请日：2007-06-01

申请人： Kazutaka Matsumoto ,  Masahiro Tadauchi ,  Izuru Komatsu

发明人： Kazutaka Matsumoto ,  Masahiro Tadauchi ,  Izuru Komatsu

IPC分类号： B23K31/02 ,  B23K35/34

CPC分类号： H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/40 ,  H05K3/3489 ,  H05K2201/10977

摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

摘要翻译： 本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料， 铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香 ，和丙烯酸改性松香。 焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

公开(公告)号：US20050218525A1

公开(公告)日：2005-10-06

申请号：US11058323

申请日：2005-02-16

申请人： Toshihide Takahashi ,  Kazutaka Matsumoto ,  Izuru Komatsu ,  Masahiro Tadauchi

发明人： Toshihide Takahashi ,  Kazutaka Matsumoto ,  Izuru Komatsu ,  Masahiro Tadauchi

IPC分类号： B23K1/19 ,  B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  B23K101/40 ,  B32B15/01 ,  C22C5/02 ,  C22C5/06 ,  C22C13/00 ,  H01L21/52 ,  H01L21/60 ,  H05K3/34 ,  H01L21/44 ,  H01L29/40

CPC分类号： B23K35/262 ,  B23K35/007 ,  H01L24/29 ,  H01L24/80 ,  H01L2224/29111 ,  H01L2224/83101 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/157 ,  H05K3/3463 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： The soldered material relating to the present invention comprises a first metallic material to be soldered; a second metallic material to be soldered; and a soldering layer containing tin and a high melting point metal, interposed between the first metallic material and the second metallic material to solder both metallic materials together, wherein the second metallic material is materials selected from the groups consisting of copper, gold, silver, a gold and palladium based alloy containing gold and palladium as main constituents, and a silver and palladium based alloy containing silver and palladium as main constituents, and the soldering layer has a plurality of granular intermetallic compound phase composed of constituent elements for the second metallic material and tin being dispersed in a cross-sectional microstructure.

摘要翻译： 涉及本发明的焊接材料包括待焊接的第一金属材料; 待焊接的第二金属材料; 以及包含锡和高熔点金属的焊接层，插入在第一金属材料和第二金属材料之间以将两种金属材料焊接在一起，其中第二金属材料是选自由铜，金，银， 以金和钯为主要成分的金和钯基合金以及以银和钯为主要成分的银和钯基合金，并且焊接层具有由第二金属材料的构成元素组成的多个颗粒状金属间化合物相 锡分散在横截面微观结构中。

公开(公告)号：US06464122B1

公开(公告)日：2002-10-15

申请号：US09645595

申请日：2000-08-25

申请人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

发明人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

IPC分类号： B23K3700

CPC分类号： B23K1/06 ,  B23K35/262 ,  B23K2101/40

摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

摘要翻译： 公开了一种用于焊接基材的方法和装置。 制备基本上由锡和可与锡形成共晶合金并且不含铅的金属组成的二元焊料。 其他金属成分的含量为0.1重量％以下，氧含量为100ppm以下。 二元焊料在非氧化环境中熔化，并在氧含量为2,000ppm以下的气氛中分配到基材，以用二元焊料来焊接基材。 焊接装置包括用于向基材提供频率为15KHz至1MHz的振荡波能量的振荡器。 焊接装置也可以以焊接喷嘴或烙铁的形式实现。