公开(公告)号：US5951368A

公开(公告)日：1999-09-14

申请号：US864906

申请日：1997-05-29

申请人： Katsuhide Watanabe ,  Noburu Shimizu ,  Ichiju Satoh

发明人： Katsuhide Watanabe ,  Noburu Shimizu ,  Ichiju Satoh

IPC分类号： B24B1/00

CPC分类号： F16C32/044

摘要： The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

摘要翻译： 抛光装置可以控制顶环相对于抛光装置的转盘表面的姿态，以便在整个抛光表面上提供均匀的抛光表面压力。 抛光装置包括具有研磨表面的转盘，用于保持待抛光物体的顶环，用于在转动转台和顶环的同时使物体表面与研磨表面保持移动接触，用于支撑旋转的磁轴承组件 通过推力轴承装置和至少一个径向轴承装置的顶环的轴以及用于通过磁轴承组件控制顶环相对于转台的定向的姿态控制器。

公开(公告)号：US5374170A

公开(公告)日：1994-12-20

申请号：US907035

申请日：1992-07-01

申请人： Noburu Shimizu ,  Kiyoshi Yanagisawa

发明人： Noburu Shimizu ,  Kiyoshi Yanagisawa

IPC分类号： F04C18/16 ,  F04C23/00 ,  F04C25/02 ,  F04C29/12

CPC分类号： F04C29/12 ,  F04C18/16

摘要： To provide a screw vacuum pump which is compact and yet capable of attaining a high degree of vacuum. A screw vacuum pump having a pair of male and female rotors 7 and 7A rotating in mesh with each other around two parallel axes, respectively, and a casing 1 for accommodating the two rotors 7 and 7A, the casing 1 having a suction port 8b and a discharge port 9b, the screw vacuum pump further having a process of sucking a gas from the suction port 8b into a space defined between the rotors 7 and 7A, a process of transferring the gas, a process of compressing the gas, and a process of discharging the gas from the discharge port 9b, wherein the suction port 8b is closed early, thereby providing an expansion process between the suction and transfer processes.

摘要翻译： 提供紧凑且能够获得高真空度的螺杆真空泵。 螺杆式真空泵具有分别围绕两个平行的轴线彼此啮合的一对阳转母和转子7和7A，以及用于容纳两个转子7和7A的壳体1，壳体1具有吸入口8b和 排出口9b，螺杆式真空泵还具有从吸入口8b吸入气体到转子7和7A之间的空间的过程，转移气体的过程，压缩气体的过程以及过程 从排出口9b排出气体，其中吸入口8b被早期关闭，从而在抽吸和转移过程之间提供膨胀过程。

公开(公告)号：US5314320A

公开(公告)日：1994-05-24

申请号：US907033

申请日：1992-07-01

申请人： Noburu Shimizu ,  Kiyoshi Yanagisawa

发明人： Noburu Shimizu ,  Kiyoshi Yanagisawa

IPC分类号： F04C25/02 ,  F04C18/16 ,  F04C23/00 ,  F04C29/12 ,  F01C1/16 ,  F01C1/24

CPC分类号： F04C29/12 ,  F04C18/16

摘要： A screw vacuum pump is designed so that it is possible to reduce the load on the pump at the time of starting and evacuation of a gas under atmospheric pressure. The screw vacuum pump has male and female rotors rotating in mesh with each other around two parallel axes, respectively, and a casing for accommodating the rotors, the casing having a suction port and a discharge port, wherein the discharge port is formed so that V.sub.1 /V.sub.2 is in the range of 1.5 to 0.51, where V.sub.1 is a groove volume defined by the casing and the male and female rotors immediately after a gas has been trapped, and V.sub.2 is a groove volume immediately before the gas is discharged.

摘要翻译： 螺杆式真空泵设计成能够在大气压下开始排气时减少泵上的负荷。 螺杆式真空泵分别具有围绕两个平行的轴线彼此啮合的阳和阴转子，以及用于容纳转子的壳体，壳体具有吸入口和排出口，其中排出口形成为V1 / V2在1.5至0.51的范围内，其中V1是在气体被捕获之后立即由壳体和公和母转子限定的槽体积，V2是在气体排出之前的槽体积。

公开(公告)号：US08398811B2

公开(公告)日：2013-03-19

申请号：US13216576

申请日：2011-08-24

申请人： Tatsuya Sasaki ,  Naoshi Yamada ,  Yoshifumi Katsumata ,  Noburu Shimizu ,  Seiryo Tsuno ,  Takashi Mitsuya

发明人： Tatsuya Sasaki ,  Naoshi Yamada ,  Yoshifumi Katsumata ,  Noburu Shimizu ,  Seiryo Tsuno ,  Takashi Mitsuya

IPC分类号： B24B49/00

CPC分类号： B24B49/03 ,  B24B37/042 ,  H01L21/3212

摘要： A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.

摘要翻译： 抛光装置具有：抛光部（302），被配置为对基板进行抛光;以及测量部（307），被配置为测量形成在基板上的膜的厚度。 抛光装置还具有被配置为输入形成在待抛光的基板上的膜的期望厚度的接口（310）和被配置为在其中至少一个过去的基板上存储抛光速率数据的存储装置（308a）。 抛光装置包括运算单元（308b），其通过使用加权平均法来计算抛光速率和基于抛光速率数据和期望厚度的最佳抛光时间，该加权平均法将抛光速率数据加权到最近抛光的基底上。

公开(公告)号：US06595831B1

公开(公告)日：2003-07-22

申请号：US09560562

申请日：2000-04-28

申请人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Noburu Shimizu

发明人： Kazuto Hirokawa ,  Hirokuni Hiyama ,  Yutaka Wada ,  Hisanori Matsuo ,  Noburu Shimizu

IPC分类号： B24B100

CPC分类号： H01L21/67161 ,  B08B1/04 ,  B24B37/042 ,  B24B37/245 ,  H01L21/67219 ,  H01L21/67745

摘要： A polishing method and apparatus can concurrently establish a stable removal rate, a small step height reduction rate, and reduction of detects on the polished surface for various kinds of polished subjects, while providing less environmental problems and requiring less processing costs. The method for polishing a surface of a semiconductor device wafer comprises first polishing a surface of the semiconductor wafer by a first fixed abrasive polishing method; and finish polishing the polished surface of the semiconductor wafer by a second fixed abrasive polishing method different from the first fixed abrasive polishing method.

摘要翻译： 抛光方法和装置可以同时建立各种抛光对象的抛光表面的稳定的去除率，小的台阶降低率和减少对抛光表面的检测，同时提供较少的环境问题并且需要更少的处理成本。 用于抛光半导体器件晶片的表面的方法包括：通过第一固定研磨抛光方法对半导体晶片的表面进行抛光; 并且通过与第一固定研磨抛光方法不同的第二固定研磨抛光方法来对半导体晶片的抛光表面进行抛光。

公开(公告)号：US06343978B1

公开(公告)日：2002-02-05

申请号：US09566624

申请日：2000-05-08

申请人： Noburu Shimizu ,  Norio Kimura

发明人： Noburu Shimizu ,  Norio Kimura

IPC分类号： B24B100

CPC分类号： B08B1/04 ,  B24B37/042 ,  B24B37/105 ,  H01L21/67173 ,  H01L21/67219

摘要： A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

公开(公告)号：US06183342B2

公开(公告)日：2001-02-06

申请号：US09276154

申请日：1999-03-25

申请人： Katsuhide Watanabe ,  Noburu Shimizu ,  Ichiju Satoh

发明人： Katsuhide Watanabe ,  Noburu Shimizu ,  Ichiju Satoh

IPC分类号： B24B100

CPC分类号： F16C32/044

摘要： The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

摘要翻译： 抛光装置可以控制顶环相对于抛光装置的转盘表面的姿态，以便在整个抛光表面上提供均匀的抛光表面压力。 抛光装置包括具有研磨表面的转盘，用于保持待抛光物体的顶环，用于在转动转台和顶环的同时使物体表面与研磨表面保持移动接触，用于支撑旋转的磁轴承组件 通过推力轴承装置和至少一个径向轴承装置的顶环的轴以及用于通过磁轴承组件控制顶环相对于转台的定向的姿态控制器。

公开(公告)号：US5954570A

公开(公告)日：1999-09-21

申请号：US656643

申请日：1996-05-31

申请人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Noburu Shimizu

发明人： Hiroyuki Yano ,  Katsuya Okumura ,  Norio Kimura ,  Noburu Shimizu

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  H01L21/304 ,  B24B29/00

CPC分类号： B24B53/017 ,  B24B53/12

摘要： A conditioner assembly for a polishing machine includes a carrier, a conditioning element attached to the carrier, and an elastic element arranged between the conditioning element and the carrier. The conditioner assembly improves the polishing uniformity across the surface of a workpiece.

摘要翻译： 用于抛光机的调节器组件包括载体，附着到载体的调节元件和布置在调节元件和载体之间的弹性元件。 调节器组件改善了穿过工件表面的抛光均匀性。

公开(公告)号：US5827115A

公开(公告)日：1998-10-27

申请号：US684941

申请日：1996-07-19

申请人： Noburu Shimizu

发明人： Noburu Shimizu

IPC分类号： B24B37/04 ,  B24D9/00 ,  B24B7/00

CPC分类号： B24D9/00 ,  B24B37/04 ,  B24B37/042

摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a rotary drum provided on a surface thereof with a polishing pad. A stand supports the workpiece to be polished. A controlling device controls reciprocation of the drum and rotation of the workpiece to obtain a relationship: V/.omega.>L in which V represents velocity of reciprocation of the drum reciprocating on the workpiece to polish an entire surface of the workpiece, .omega. represents rotational angular velocity of the workpiece, and L represents a distance from the rotational center of the workpiece to a radially outermost point on the workpiece.

摘要翻译： 用于将诸如半导体晶片的工件抛光到平面镜面抛光的抛光装置包括在其表面上设置有抛光垫的旋转滚筒。 支架支撑待抛光的工件。 控制装置控制滚筒的往复运动和工件的旋转以获得关系：V /ω> Lin其中V表示在工件上往复运动的滚筒的往复运动速度，以抛光工件的整个表面，ω表示旋转角速度 的工件，L表示从工件的旋转中心到工件的径向最外点的距离。