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公开(公告)号：US20170255001A1
公开(公告)日：2017-09-07
申请号：US15602396
申请日：2017-05-23
Applicant: OLYMPUS CORPORATION , PANASONIC CORPORATION
Inventor： Tomokazu YAMASHITA , Takatoshi IGARASHI , Noriyuki FUJIMORI , Yoshiki TAKAYAMA , Yutaka HARADA
CPC classification number: G02B23/2484 , A61B1/0011 , A61B1/051 , G02B23/2469 , H04N5/2253 , H04N5/2256 , H04N5/2257 , H04N5/335 , H04N2005/2255
Abstract: An imaging unit includes: a flexible substrate including one end connected to a light receiving surface of a solid state image sensor, the flexible substrate extending to a surface side opposite to the light receiving surface; a multi-layer substrate connected to a surface of the flexible substrate, the surface of the flexible substrate being a surface to which the solid state image sensor is connected, the multi-layer substrate including a plurality of electronic components mounted thereon; and a connection layer configured to electrically and mechanically connect to connection members provided on the surface of the flexible substrate and a surface of the multi-layer substrate facing the surface of the flexible substrate.
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22.发明申请公开(公告)号：US20170086660A1
公开(公告)日：2017-03-30
申请号：US15374459
申请日：2016-12-09
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
CPC classification number: A61B1/051 , A61B1/0011 , G02B23/2484 , H04N5/2253 , H04N2005/2255 , H05K1/117 , H05K1/147 , H05K3/32 , H05K3/361 , H05K2201/10121 , H05K2201/10446 , H05K2201/10962 , H05K2201/2009
Abstract: An image pickup unit includes: an image pickup device on which an image pickup section is formed; a circuit board having a main surface on which a connection terminal electrically connected with the image pickup section is disposed; an intermediate wiring board including a substrate, an adhesive layer and a wiring pattern, in which a first electrode of the wiring pattern is electrically connected with the connection terminal; a cable having a core wire; and a holding substrate configured to hold the core wire with a second electrode and fixed to the intermediate wiring board by the adhesive layer in a state that the core wire and the second electrode are electrically connected by being in close contact.
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公开(公告)号：US20160205296A1
公开(公告)日：2016-07-14
申请号：US15078062
申请日：2016-03-23
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
CPC classification number: H04N5/2253 , A61B1/0008 , A61B1/00114 , A61B1/005 , A61B1/051 , H04N5/2254 , H04N5/378 , H04N2005/2255
Abstract: An imaging unit includes: an image sensor having an electrode pad and a light-receiving surface; a flexible printed circuit board having an inner lead connected to the electrode pad and extending from the image sensor in a direction opposite to where the light-receiving surface is provided; and one or more electronic components mounted on a first surface of the flexible printed circuit board, the first surface being on a side where the image sensor is provided. The flexible printed circuit board includes: an insulating base material; a first wiring layer on the base material on a side of the first surface; a first film for insulating the first wiring layer; a second wiring layer on the base material on a side of a second surface opposite to the first surface; and a second film for insulating the second wiring layer. The inner lead extends from the first wiring layer.
Abstract translation: 成像单元包括：具有电极焊盘和受光面的图像传感器; 柔性印刷电路板，其具有连接到所述电极焊盘并且与所述图像传感器在与所述光接收表面相对的方向上延伸的内引线; 以及安装在柔性印刷电路板的第一表面上的一个或多个电子部件，第一表面位于设置有图像传感器的一侧。 柔性印刷电路板包括绝缘基材; 在所述第一表面的一侧的所述基材上的第一布线层; 用于绝缘第一布线层的第一膜; 在与所述第一表面相对的第二表面的一侧的所述基材上的第二布线层; 以及用于绝缘第二布线层的第二膜。 内引线从第一布线层延伸。
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公开(公告)号：US20160037029A1
公开(公告)日：2016-02-04
申请号：US14885291
申请日：2015-10-16
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI
CPC classification number: H04N5/2252 , A61B1/00124 , A61B1/051 , G02B23/2476 , H04N5/2251 , H04N5/2253 , H04N5/2254 , H04N7/18 , H04N2005/2255 , H05K1/14 , H05K1/185 , H05K2201/10356
Abstract: An image pickup apparatus includes a laminated substrate on which a plurality of electronic components configuring a driving circuit of a solid-state image pickup device are mounted and in which a plurality of conductor layers and a plurality of vias are formed, electronic component connection lands provided on a surface of the laminated substrate, any one of the plurality of electronic components being electrically connected to the electronic component connection lands, and a cable connection land provided on the surface of the laminated substrate, a plurality of signal cables being electrically connected to the cable connection land. At least one of the plurality of electronic components is embedded in a position superimposed on the electronic component connection lands or the cable connection land on an inside of the laminated substrate.
Abstract translation: 一种图像拾取装置包括其上安装有构成固态图像拾取装置的驱动电路的多个电子部件并且其中形成有多个导体层和多个通孔的层叠基板，设置有电子部件连接焊盘 在所述层叠基板的表面上，所述多个电子部件中的任一个电连接到所述电子部件连接台面，以及设置在所述层叠基板的表面上的电缆连接台面，多个信号电缆电连接到 电缆连接用地。 多个电子部件中的至少一个被嵌入叠加在层叠基板的内侧上的电子部件连接台面或电缆连接台面上的位置。
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公开(公告)号：US20150207965A1
公开(公告)日：2015-07-23
申请号：US14676045
申请日：2015-04-01
Applicant: OLYMPUS CORPORATION
Inventor： Noriyuki FUJIMORI , Takatoshi IGARASHI
CPC classification number: H04N5/2251 , A61B1/051 , H01L27/14618 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H04N5/2253 , H04N2005/2255 , H01L2924/00014 , H01L2924/00
Abstract: An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.
Abstract translation: 一种图像拾取装置，包括允许连接电极暴露于第二主表面侧的空闲空间部分，所述空间空间部分形成在与所述连接电极至少重叠的位置处，在所述图像拾取装置被观察的状态下 从厚度方向A的平面图，暴露于第二主表面侧的连接电极在空间部分的位置处与基板电连接，在图像拾取装置为 从厚度方向看平面图。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20150085094A1
公开(公告)日：2015-03-26
申请号：US14556831
申请日：2014-12-01
Applicant: OLYMPUS CORPORATION
Inventor： Noriyuki FUJIMORI , Takatoshi IGARASHI , Kazuhiro YOSHIDA
IPC: H01L27/146 , H01L23/31 , H01L23/00 , H04N5/369
CPC classification number: H01L27/14636 , H01L23/3114 , H01L24/32 , H01L25/042 , H01L27/14618 , H01L27/14683 , H01L2224/32225 , H01L2924/0002 , H01L2924/12042 , H04N5/369 , H01L2924/00
Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.
Abstract translation: 一种图像拾取装置包括：图像拾取芯片，包括在第一主面上的光接收部分和电极焊盘以及多个连接电极，每个连接电极通过多个通孔中的每一个连接到每个电极焊盘 在第二主面上的孔互连; 具有比图像拾取芯片更大的平面视图尺寸的透明盖玻璃; 将图像拾取芯片的第一主面和盖玻璃接合的透明粘合剂层; 以及覆盖图像拾取芯片的侧面和粘合剂层的侧面的密封构件，并且由具有与盖玻璃相同的平面尺寸的绝缘材料制成。
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公开(公告)号：US20220368816A1
公开(公告)日：2022-11-17
申请号：US17868929
申请日：2022-07-20
Applicant: OLYMPUS CORPORATION
Inventor： Takuro SUYAMA , Ken YAMAMOTO , Takatoshi IGARASHI
Abstract: An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.
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公开(公告)号：US20190260917A1
公开(公告)日：2019-08-22
申请号：US16403782
申请日：2019-05-06
Applicant: OLYMPUS CORPORATION
Inventor： Ken YAMAMOTO , Takuro SUYAMA , Takahiro SHIMOHATA , Takatoshi IGARASHI , Hiroshi KOBAYASHI
IPC: H04N5/225 , A61B1/05 , H01L27/146
Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
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公开(公告)号：US20190175002A1
公开(公告)日：2019-06-13
申请号：US16281184
申请日：2019-02-21
Applicant: OLYMPUS CORPORATION
Inventor： Takatoshi IGARASHI , Kensuke SUGA , Kazuhiro YOSHIDA
Abstract: An endoscope includes: an insertion section including a rigid distal end portion in which a first through hole and a second through hole are formed; an image pickup unit inserted in the first through hole, the image pickup unit including a first block and a second block having an area in a direction orthogonal to an optical axis that is smaller than an area of the first block in the direction orthogonal to the optical axis; and a water feeding and air feeding tube having a distal end portion that is inserted in the second through hole, a part of the tube being arranged in an accommodation space in which a space obtained by extending the first block in an optical axis direction and a space obtained by extending the second block in the direction orthogonal to the optical axis are superimposed on each other.
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30.发明申请公开(公告)号：US20190079280A1
公开(公告)日：2019-03-14
申请号：US16185087
申请日：2018-11-09
Applicant: OLYMPUS CORPORATION
Inventor： Kazuhiro YOSHIDA , Takatoshi IGARASHI , Kazuya MAEDA
IPC: G02B23/24 , H04N5/225 , A61B1/05 , A61B1/00 , H01L27/146
Abstract: A manufacturing method of the optical unit for endoscope includes: a process of fabricating a bonded wafer by laminating a plurality of optical element wafers, each of the plurality of optical element wafers including a plurality of optical elements; a groove forming process of forming a groove on the bonded wafer along a cutting line for segmentation such that the groove has a bottom surface in the optical element wafer laminated at a lowermost part of the bonded wafer; and a cutting process of cutting the bonded wafer along the cutting line with a cutting margin narrower than a width of the groove and segmenting the bonded wafer, and the manufacturing method further includes a process of disposing a reinforcing member in the groove.
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