公开(公告)号：US11412113B2

公开(公告)日：2022-08-09

申请号：US17079628

申请日：2020-10-26

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: H04N5/225 ,  H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus includes: a first member, in which a plurality of optical members are laminated; a second member including an image pickup device; and a third member including a spacer and a frame, a first through-hole that penetrates through the spacer and a second through-hole that has a larger sectional area in a direction that perpendicularly intersects an optical axis than a sectional area of the first through-hole and that penetrates through the frame are provided in the third member, the third member is glued to the first member, the second member is disposed in the second through-hole, and a front surface of the second member abuts on a second main surface of the spacer, and the frame is a frame body that shields light that is incident on the second through-hole from an image pickup side surface that is a side surface of the second member.

公开(公告)号：US20210257400A1

公开(公告)日：2021-08-19

申请号：US17238299

申请日：2021-04-23

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus for endoscope includes a resin member in which an outer dimension of a third main surface is equal to an outer dimension of a second main surface, an image pickup member having a light receiving surface smaller than the second main surface, and having a first external electrode on a back surface covered by the resin member, a fan-out wiring provided to extend between an inside and an outside of an extension space, the extension space being an extension of the image pickup member in an optical axis direction, a first through wiring penetrating through the resin member, and provided in the inside of the extension space, a first bonding electrode connected with the external electrode through the first through wiring and the fan-out wiring and forming the fan-out wiring provided on the third main surface, and an electric cable bonded to the first bonding electrode.

公开(公告)号：US11000184B2

公开(公告)日：2021-05-11

申请号：US16656788

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Takahiro Shimohata ,  Takuro Suyama

IPC: A61B1/005 ,  A61B1/05 ,  A61B1/00 ,  G06T7/00 ,  G02B23/24 ,  H01L27/146 ,  H04N5/225 ,  A61B1/06

Abstract: An image pickup module includes a stacked element in which an external electrode is disposed on a rear surface, a first wiring board where a front electrode connected to the external electrode by an interconnecting bonding section and a first electrode are disposed, and a first signal cable connected to the first electrode by a cable bonding section, in which the first wiring board is flexible and includes a bent section in a space defined by extending a first region out of the first region and a second region obtained by dividing the rear surface into two regions in an optical axis direction, and a length of the first wiring board from the interconnecting bonding section to the cable bonding section is longer than a length of the stacked element from the interconnecting bonding section to an end side in the first region.

公开(公告)号：US10930696B2

公开(公告)日：2021-02-23

申请号：US16352954

申请日：2019-03-14

Applicant: OLYMPUS CORPORATION

Inventor： Takahiro Shimohata ,  Takatoshi Igarashi

IPC: H01L27/146 ,  A61B1/05 ,  H01L27/14 ,  H04N5/369 ,  A61B1/00 ,  H04N5/225

Abstract: An image pickup unit includes: an image pickup device; a device laminate in which a plurality of semiconductor devices are laminated; and a signal cable having a lead wire and a shield lead wire. The plurality of semiconductor devices have cutouts. A groove in parallel with an optical axis direction is configured on a side surface of the device laminate by a plurality of the cutouts which communicate with one another. On cutout surfaces of the semiconductor devices, side electrodes are arranged. The lead wire and the shield lead wire are housed in the respective cutouts which have diameters in accordance with respective diameters of the lead wire and the shield lead wire. The lead wire is bonded to the side electrode and the shield lead wire is bonded to the side electrode.

公开(公告)号：US10191270B2

公开(公告)日：2019-01-29

申请号：US14931070

申请日：2015-11-03

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: G02B23/24 ,  H04N13/00 ,  H04N5/225 ,  A61B1/05 ,  H05K1/02 ,  H05K1/11

Abstract: An imaging unit includes: a solid state image sensor configured to receive light and perform photoelectric conversion on the light to generate an electric signal; a substrate extending from the solid state image sensor in an optical axis direction of the solid state image sensor; and a multi-layer substrate formed on a surface of the substrate, the multi-layer substrate having a plurality of electronic components mounted thereon and having a plurality of conductor layers and a plurality of via holes formed therein. At least one of the plurality of electronic components is embedded inside the multi-layer substrate. The plurality of via holes is formed on an outer side of the at least one of the plurality of electronic components embedded inside the multi-layer substrate along an optical axis direction of the multi-layer substrate.

公开(公告)号：US09820637B2

公开(公告)日：2017-11-21

申请号：US14666699

申请日：2015-03-24

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi ,  Noriyuki Fujimori

IPC: A61B1/05 ,  H01L31/0203 ,  H01L27/146

CPC classification number: A61B1/051 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/13

Abstract: An image pickup apparatus includes a substrate, on a first surface of which a light receiving section and a peripheral circuit section are formed, a multilayer wiring layer stacked on the first surface and including a plurality of metal layers and insulating layers, a translucent cover located on the multilayer wiring layer, and a side surface sealing member which extends from a peripheral section of a surface in the translucent cover to the substrate side while having a frame shape, and protects outer peripheral side surfaces of the multilayer wiring layer.

公开(公告)号：US09123618B2

公开(公告)日：2015-09-01

申请号：US14557021

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L21/66 ,  H01L27/146 ,  H01L25/04 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 将多个图像拾取芯片之间的间隙填充到密封构件的处理; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US11540707B2

公开(公告)日：2023-01-03

申请号：US16662362

申请日：2019-10-24

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi

IPC: A61B1/05 ,  A61B1/00 ,  H01L23/00 ,  H01L27/146

Abstract: An endoscope includes an image pickup module, and the image pickup module includes: an image pickup device an external electrode being disposed on a back surface of the image pickup device; a wiring element provided with a through-hole passing through a first main surface and a second main surface, a first electrode on the first main surface being bonded with the external electrode; a signal cable bonded with a second electrode on the second main surface of the wiring element; and a first resin that seals a first bump bonding the first electrode and the external electrode and a second bump bonding the second electrode and the signal cable, and fills the through-hole.

公开(公告)号：US10660511B2

公开(公告)日：2020-05-26

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga ,  Yoshiro Nishimura

IPC: A61B1/04 ,  A61B1/05 ,  H01L23/00 ,  A61B1/00 ,  A61B1/045 ,  H01L23/31 ,  H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  H01L23/48 ,  H01L23/538 ,  H04N5/369 ,  H01L21/768

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US10574866B2

公开(公告)日：2020-02-25

申请号：US15078062

申请日：2016-03-23

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi Igarashi

IPC: H04N5/225 ,  H04N5/378 ,  A61B1/005 ,  A61B1/00 ,  A61B1/05

Abstract: An imaging unit includes: an image sensor having an electrode pad and a light-receiving surface; a flexible printed circuit board having an inner lead connected to the electrode pad and extending from the image sensor in a direction opposite to where the light-receiving surface is provided; and one or more electronic components mounted on a first surface of the flexible printed circuit board, the first surface being on a side where the image sensor is provided. The flexible printed circuit board includes: an insulating base material; a first wiring layer on the base material on a side of the first surface; a first film for insulating the first wiring layer; a second wiring layer on the base material on a side of a second surface opposite to the first surface; and a second film for insulating the second wiring layer. The inner lead extends from the first wiring layer.