公开(公告)号：US20190315923A1

公开(公告)日：2019-10-17

申请号：US16448387

申请日：2019-06-21

Applicant: SABIC Global Technologies B.V.

Inventor： Chen Xu ,  Hao Zhou ,  Wei Zhao

IPC: C08G73/10 ,  C08L81/06 ,  C08K3/04 ,  H05K1/03 ,  C08L79/08 ,  C08L71/00 ,  C09D179/08 ,  C08K3/28

Abstract: A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C., and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

公开(公告)号：US20190194459A1

公开(公告)日：2019-06-27

申请号：US16301601

申请日：2017-05-11

Applicant: SABIC Global Technologies B.V

Inventor： Chen Wan ,  Hao Zhou ,  Raghavendra Raj Maddikeri

IPC: C08L83/10 ,  C08J3/20

CPC classification number: C08L83/10 ,  C08G77/448 ,  C08J3/201 ,  C08L25/12 ,  C08L51/04 ,  C08L55/02 ,  C08L2203/20 ,  C08L2205/02 ,  C08L2205/035 ,  C08L2205/06 ,  C08L53/00 ,  C08L69/005 ,  C08L79/08

Abstract: A thermoplastic composition includes a poly(etherimide), a poly(ester-carbonate), a poly(carbonate-siloxane), a flow promoter, and a hydrogenated block copolymer of an alkenyl aromatic compound and a conjugated diene. The flow promoter includes units derived from styrene and acrylonitrile, preferably an acrylonitrile-butadiene-styrene, a styrene-acrylonitrile, a high rubber graft acrylonitrile-styrene-acrylate copolymer, or a combination including at least one of the foregoing. A method of making the thermoplastic composition and an article including the thermoplastic composition are also disclosed.

公开(公告)号：US10005902B2

公开(公告)日：2018-06-26

申请号：US15110477

申请日：2015-01-12

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Paul Dean Sybert ,  Mark Adrianus Johannes Van Der Mee ,  Roland Sebastian Assink ,  Robert Dirk Van De Grampel ,  Aditya Narayanan ,  Feng Cao ,  Kapil Chandrakant Sheth ,  Hao Zhou ,  Xiaoyu Sun ,  Remco Wirtz

IPC: C08L69/00 ,  C08L79/08 ,  B32B27/08 ,  C08J5/00 ,  C25D11/02 ,  C08K3/22

CPC classification number: C08L69/00 ,  B32B27/08 ,  C08J5/00 ,  C08J2369/00 ,  C08J2469/00 ,  C08J2479/08 ,  C08K3/22 ,  C08K5/526 ,  C08K2003/2241 ,  C08L69/005 ,  C08L79/08 ,  C08L2201/08 ,  C08L2203/12 ,  C08L2203/14 ,  C08L2205/02 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/06 ,  C08L2207/04 ,  C25D11/02

Abstract: A thermoplastic composition comprises, based on the total weight of the thermoplastic composition, 10 to 45 wt. % of a poly(etherimide); 35 to 90 wt. % of a poly(carbonate-siloxane); 0.5 to 20 wt. % of compatibilizer polycarbonate component comprising a poly(carbonate-arylate ester); up to 15 wt. % of an ultraviolet light stabilizer; and 0 to 30 wt. % of TiO2; wherein a sample of the composition has a notched Izod impact energy of at least 200 J/m at 23° C. measured in accordance to ASTM D256; and an at least 50% higher notched Izod impact energy value compared to the composition without the compatibilizer component measured in accordance to ASTM D256.

公开(公告)号：US20170362386A1

公开(公告)日：2017-12-21

申请号：US15538827

申请日：2015-12-22

Applicant: SABIC Global Technologies B.V.

Inventor： Chen Xu ,  Hao Zhou ,  Wei Zhao

IPC: C08G73/10 ,  C08K3/04 ,  H05K1/03 ,  C09D179/08 ,  C08L79/08 ,  C08K3/28 ,  C08K3/38

CPC classification number: C08G73/1071 ,  C08G73/1064 ,  C08K3/04 ,  C08K3/28 ,  C08K2003/385 ,  C08L71/00 ,  C08L79/08 ,  C08L81/06 ,  C09D179/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209

Abstract: A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.