公开(公告)号：US12089384B2

公开(公告)日：2024-09-10

申请号：US17436357

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojong Kim ,  Changhwan Jin ,  Jonghun Choi ,  Byungchul Lee ,  Jaeyoung Huh ,  Hyunchul Hong ,  Jaeuk Ryu

IPC: G01R15/04 ,  G01R19/10 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K9/0028 ,  G01R15/04 ,  G01R19/10 ,  H05K1/0216

Abstract: An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.

公开(公告)号：US11588220B2

公开(公告)日：2023-02-21

申请号：US17162110

申请日：2021-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunbum Lee ,  Seongbeom Hong ,  Kyunghoon Moon ,  Seunggil Jeon ,  Jaeyoung Huh ,  Jinsang Kim ,  Sungchul Park

IPC: H01Q1/02 ,  H01Q9/04 ,  H01Q21/08 ,  H01Q19/09 ,  H01Q21/28 ,  H01Q23/00 ,  H01Q1/24 ,  H01Q1/22 ,  H01Q1/40

Abstract: An electronic device is provided. The electronic device includes a display having a first surface, a metal frame structure configured to form a side surface of the electronic device, a rear plate having a second surface facing a third direction, at least one antenna module disposed inside the side surface and having a radiation surface, at least one dielectric layer having at least a partial region attached to the radiation surface, and a wireless communication circuit configured to transmit or receive an radio frequency (RF) signal to or from the at least one antenna module, in which the at least one dielectric layer includes a first dielectric sheet and a second dielectric sheet, in which the first dielectric sheet is made of a thermal conductive material having a first permittivity and the second dielectric sheet is made of a material having a second permittivity larger than the first permittivity.

公开(公告)号：US11388276B2

公开(公告)日：2022-07-12

申请号：US16839534

申请日：2020-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung Huh ,  Kyungwan Park ,  Seunghoon Kang ,  Boram Kim ,  Youngjin Kim ,  Sunghoon Moon ,  Hongki Moon ,  Yoonsun Park ,  Hajoong Yun ,  Jonghoon Lim

IPC: H04M1/02 ,  H04N5/225 ,  H05K1/18 ,  H05K7/20

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

公开(公告)号：US11385690B2

公开(公告)日：2022-07-12

申请号：US16862009

申请日：2020-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon Chae ,  Sunmin Park ,  Jaeyoung Huh ,  Mooyoung Kim ,  Minjung Kim ,  Jungeun Lee

IPC: G06F1/20 ,  G06F1/3287 ,  H04W52/02

Abstract: An electronic device is provided. The electronic device includes a wireless communication module including a first communication processor and a second communication processor, a sensor module, at least one processor, and at least one memory configured to store instructions, executable by the at least one processor, for identifying an execution status of the application and temperature of at least part of the electronic device, deactivating the second communication processor based on the identified execution status of the application and the identified temperature, and activating the second communication processor based on network traffic being processed by the first communication processor being greater than a predetermined threshold.

公开(公告)号：US20220083110A1

公开(公告)日：2022-03-17

申请号：US17532518

申请日：2021-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck Kwon ,  Jaeyoung Huh ,  Daesuk Kang ,  Seunghoon Kang ,  Boram Kim ,  Hongki Moon ,  Yoonsun Park ,  Kyungwoo Lee ,  Seungjoo Lee ,  Jonghoon Lim

IPC: G06F1/20 ,  H01L23/427 ,  G06F1/16

Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

公开(公告)号：US11181955B2

公开(公告)日：2021-11-23

申请号：US16774618

申请日：2020-01-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ohhyuck Kwon ,  Jaeyoung Huh ,  Daesuk Kang ,  Seunghoon Kang ,  Boram Kim ,  Hongki Moon ,  Yoonsun Park ,  Kyungwoo Lee ,  Seungjoo Lee ,  Jonghoon Lim

IPC: G06F1/20 ,  G06F1/16 ,  H01L23/427

Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

公开(公告)号：US11075469B2

公开(公告)日：2021-07-27

申请号：US16717399

申请日：2019-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoung Huh ,  Sanghyun Chang ,  Seunggil Jeon ,  Wonjoon Choi

IPC: H01Q21/24 ,  H01Q5/28 ,  H01Q9/26 ,  H01Q9/42 ,  H01Q21/06 ,  H05K1/11

Abstract: An electronic device is provided. The electronic device includes a housing including a first portion, a second portion, and a third portion configured to be movable such that the second portion is capable of being folded with respect to the first portion, a first array antenna disposed at the first portion and including a first antenna element and a second antenna element, a second array antenna including a third antenna element and a fourth antenna element, and disposed at the second portion such that the third antenna element is aligned with the first antenna element and the fourth antenna element is aligned with the second antenna element when the electronic device is in a folded state in which the second portion of the housing is folded with respect to the first portion by using the third portion, a communication circuit electrically connected to the first array antenna and the second array antenna, and at least one processor, wherein the at least one processor may be configured to: determine whether the electronic device is in an unfolded state or a folded state based on the second portion being in the unfolded state or folded state with respect to the first portion by using the third portion, when the electronic device is in the unfolded state, form a first beam through the first antenna element and the second antenna element or a second beam through the third antenna element and the fourth antenna element by using the communication circuit, and when the electronic device is in the folded state, form a third beam through the first antenna element and the third antenna element or a fourth beam through the second antenna element and the fourth antenna element by using the communication circuit.