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公开(公告)号：US11955731B2
公开(公告)日：2024-04-09
申请号：US17364103
申请日：2021-06-30
发明人： Yeonwoo Kim , Wonbin Hong , Junho Park , Jaehyun Choi , Sehyun Park , Sumin Yun
CPC分类号： H01Q9/0407 , H01Q5/10 , H04B1/38
摘要： An electronic device includes a housing including a first plate and a second plate; and a first antenna structure. The first antenna structure includes a board disposed between the first plate and the second plate. The board includes a first surface facing the first plate, a second surface facing the second plate, a plurality of insulating layers stacked on top of each other between the first surface and the second surface, a first conductive layer disposed on the first surface, a second conductive layer disposed on the second surface, a plurality of strips disposed between the plurality of insulating layers, and a plurality of vias connecting at least one or more of the first conductive layer, the second conductive layer, or the plurality of strips to each other and disposed in the plurality of insulating layers. The electronic device further includes a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure formed as part of the plurality of strips and the plurality of vias; and a wireless communication circuit electrically connected to at least one of the vias and configured to transmit or receive at least one signal having a frequency of 3 GHz to 100 GHz.
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公开(公告)号：US11936115B2
公开(公告)日：2024-03-19
申请号：US17419128
申请日：2019-12-27
发明人： Yeonwoo Kim , Wonbin Hong , Wonpyo Kwon , Sehyun Park , Sumin Yun
CPC分类号： H01Q21/28 , H01Q1/24 , H01Q9/0407 , H01Q21/0006 , H04B1/40
摘要： The disclosure provides an electronic device comprising an antenna module and a wireless communication circuit. The antenna module comprises: a printed circuit board comprising a first surface extending in a first direction and a second surface extending in a second direction opposite the first direction; a first area comprising a first antenna array; a second area comprising a second antenna array and at least partially overlapping the first area; a third area comprising a third antenna array and not overlapping the first area; a fourth area comprising a fourth antenna array and at least partially overlapping the third area; and a ground layer. The wireless communication circuit is electrically connected to the plurality of antenna arrays and transmits and/or receives a signal having a frequency in a range of about 3 GHz to 100 GHz.
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公开(公告)号：US11864309B2
公开(公告)日：2024-01-02
申请号：US17440474
申请日：2020-03-20
发明人： Sumin Yun , Dongyeon Kim , Seongjin Park , Sehyun Park , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC分类号： H05K1/0237 , H01Q1/243 , H01Q5/328 , H01Q13/02 , H05K1/115 , H05K2201/10098
摘要： Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.
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公开(公告)号：US11862876B2
公开(公告)日：2024-01-02
申请号：US17014471
申请日：2020-09-08
发明人： Dongyeon Kim , Hosaeng Kim , Seongjin Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC分类号： H01Q9/0485 , H01Q1/243 , H01Q3/22 , H01Q9/0407
摘要： An electronic device is provided. The device includes a housing including a first cover having a first dielectric constant, and an antenna structure disposed in an inner space of the housing. The antenna structure may include a PCB, an antenna element disposed in the PCB to form a beam pattern in a specific direction, a first dielectric structure disposed on a radiation path of the beam pattern, formed integrally with or combined with the PCB, and having a second dielectric constant equal to or different from the first dielectric constant, and a second dielectric structure disposed on the radiation path between the first dielectric structure and the first cover, and having a third dielectric constant higher than the first dielectric constant and the second dielectric constant. The electronic device may further include a wireless communication circuit configured to transmit and/or receive a radio signal through the antenna element.
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公开(公告)号：US11831071B2
公开(公告)日：2023-11-28
申请号：US17984662
申请日：2022-11-10
发明人： Sumin Yun , Dongyeon Kim , Seongjin Park , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC分类号： H01Q1/523 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H01Q15/006 , H01Q21/0068 , H01Q21/065
摘要： An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface. The antenna structure may also include a plurality of insulating layers disposed between the first and second surfaces, first conductive patches disposed in the first area, when viewed from above the first surface, and disposed on the first surface or on a first insulating layer closer to the first surface than the second surface, a second conductive patch overlapped at least in part with the second area, when viewed from above the first surface, and disposed on a second insulating layer between the first insulating layer and the second surface, a ground layer disposed on a third insulating layer between the second insulating layer and the second surface or on the second surface, and one or more conductive walls formed along at least a portion of an outer periphery of the first area, when viewed from above the first surface, and extended from the first insulating layer to the ground layer. The electronic device includes at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal having a frequency between about 3 GHz and about 100 GHz.
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公开(公告)号：US11522299B2
公开(公告)日：2022-12-06
申请号：US16654265
申请日：2019-10-16
发明人： Sungchul Park , Sumin Yun
摘要： Presented herein is an electronic device comprising a Printed Circuit Board (PCB) including a first circuit board plane including a plurality of first patch antenna elements and a second circuit board plane including a plurality of second patch antenna elements, a communication module that transmits and receives a signal of a first frequency band using the plurality of first patch antenna elements, and transmits and receives a signal of a second frequency band higher than the first frequency band using the plurality of second patch antenna elements, a processor connected to the communication module, wherein central points of the plurality of first patch antenna elements are spaced apart from one another to have a first distance and central points of the plurality of second patch antenna elements are spaced apart from one another to have a second distance shorter than the first distance, and wherein the plurality of second patch antenna elements are arranged such that the central points of the plurality of second patch antenna elements are disposed to be closer to a central axis connecting a first central point that is a center of gravity of the first circuit board plane and a second central point that is a center of gravity of the second circuit board plane in a direction passing through the printed circuit board from a first surface to a second surface of the printed circuit board, than central points of the plurality of first patch antenna elements.
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公开(公告)号：US11431109B2
公开(公告)日：2022-08-30
申请号：US16970177
申请日：2019-02-14
发明人： Sumin Yun , Sehyun Park , Myunghun Jeong , Jehun Jong , Jaehoon Jo , Jinwoo Jung , Jaebong Chun
摘要： According to various embodiments, an electronic device may comprise: a housing including a first plate, a second plate oriented in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate; and, as an antenna structure including at least one plane parallel to the second plate, wherein the antenna structure includes a first element disposed on the plane, a second element spaced apart from the first element on the plane when viewed from above the plane, and a third element spaced apart from the second element on the plane when viewed from above the plane, the second element being disposed between the first element and the third element, a wireless communication circuit electrically configured to transmit and receive a signal having a frequency range of 10 GHz-100 GHz, wherein the wireless communication circuit includes a first electrical path connected to the first element, a second electrical path connected to a first point on the second element, the first point being closer to the first element than to the third element, a third electrical path connected to a second point on the second element, the second point being closer to the third element than to the first element, and a fourth electrical path connected to the third element, and the wireless communication circuit is configured to provide a phase difference between a first signal from the first point and a second signal from the second point. Various other embodiments may also be possible.
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公开(公告)号：US11417954B2
公开(公告)日：2022-08-16
申请号：US17262087
申请日：2019-07-31
发明人： Yeonwoo Kim , Wonbin Hong , Sehyun Park , Junho Park , Sumin Yun
摘要： An electronic device according to an embodiment of the present invention may include a housing and an antenna module disposed on one surface of the housing, wherein the antenna module may include a printed circuit board including a first layer facing the one surface of the housing, a second layer facing the first layer, and at least one ground layer disposed between the first layer and the second layer, a first antenna array disposed on the first layer, a second antenna array disposed on the second layer and at least partially overlapping the first antenna array when viewed from the one surface of the housing, and a communication circuit (radio frequency integrated circuit (RFIC)) electrically connected to the first antenna array and the second antenna array and feeding the first antenna array and the second antenna array, wherein the communication circuit may be configured to receive a first signal from an external device via at least one of the first antenna array or the second antenna array, change a phase of at least a portion of the first antenna array and the second antenna array based on the first signal, and transmit/receive a second signal in a direction of a beam formed by the changed phase. Other various embodiments could be derived from the description.
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公开(公告)号：US11171406B2
公开(公告)日：2021-11-09
申请号：US16727484
申请日：2019-12-26
发明人： Sumin Yun , Dongyeon Kim , Seongjin Park , Sehyun Park , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： An electronic device is provided that includes, an antenna structure including a printed circuit board including first and second surfaces, at least one conductive patch interposed between the first second surfaces or is disposed on the first surface, the conductive patch including first to fourth areas placed in a clockwise direction with respect to a first imaginary axis extended in a first direction on the conductive patch and a second imaginary axis intersecting the first imaginary axis and perpendicular to the first imaginary axis, and at least one wireless communication circuit that transmits and/or receives a first signal having a frequency between 3 and 100 GHz. The wireless communication circuit includes a first port electrically connected to a first position of the first area, and a second port electrically connected to a second position placed on an opposite side to the first position with respect to the first imaginary axis.
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公开(公告)号：US12015193B2
公开(公告)日：2024-06-18
申请号：US17423724
申请日：2020-01-07
发明人： Dongyeon Kim , Seongjin Park , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.
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