MEMS device comprising a membrane and an actuator

    公开(公告)号:US10683200B2

    公开(公告)日:2020-06-16

    申请号:US16050924

    申请日:2018-07-31

    Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

    MEMS DEVICE COMPRISING A MEMBRANE AND AN ACTUATOR

    公开(公告)号:US20200156929A1

    公开(公告)日:2020-05-21

    申请号:US16752321

    申请日:2020-01-24

    Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

    MEMS triaxial magnetic sensor with improved configuration

    公开(公告)号:US10267869B2

    公开(公告)日:2019-04-23

    申请号:US15638204

    申请日:2017-06-29

    Abstract: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.

    MEMS DEVICE COMPRISING A MEMBRANE AND AN ACTUATOR

    公开(公告)号:US20190039880A1

    公开(公告)日:2019-02-07

    申请号:US16050924

    申请日:2018-07-31

    Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

    Integrated AMR magnetoresistor with large scale

    公开(公告)号:US10094891B2

    公开(公告)日:2018-10-09

    申请号:US15135793

    申请日:2016-04-22

    Abstract: An integrated AMR magnetoresistive sensor has a magnetoresistor, a set/reset coil and a shielding region arranged on top of each other. The set/reset coil is positioned between the magnetoresistor and the shielding region. The magnetoresistor is formed by a magnetoresistive strip of an elongated shape having a length in a first direction parallel to the preferential magnetization direction and a width in a second direction perpendicular to the first direction. The set/reset coil has at least one stretch extending transversely to the magnetoresistive strip. The shielding region is a ferromagnetic material and has a width in the second direction greater than the width of the magnetoresistive strip so as to attenuate the external magnetic field traversing the magnetoresistive strip and increase the sensitivity scale of the magnetoresistive sensor.

    LOW-CONSUMPTION, AMR-TYPE, INTEGRATED MAGNETORESISTOR
    28.
    发明申请
    LOW-CONSUMPTION, AMR-TYPE, INTEGRATED MAGNETORESISTOR 有权
    低消耗,AMR型,集成磁电阻

    公开(公告)号:US20140353785A1

    公开(公告)日:2014-12-04

    申请号:US14287798

    申请日:2014-05-27

    Inventor: Dario Paci

    CPC classification number: G01R33/096 G01R33/0011 H01L27/22 H01L43/02

    Abstract: An integrated magnetoresistive sensor (20; 30; 40) of an AMR (Anisotropic Magneto Resistance) type, formed by a magnetoresistive strip (24) of ferromagnetic material and having an elongated shape with a preferential magnetization direction (EA). A set/reset coil (22) has a stretch (34a, 34b), which extends over and transversely to the magnetoresistive strip. A concentrating region (23), also of ferromagnetic material, extends over the stretch of the set/reset coil so as to form a magnetic circuit for the field generated by the set/reset coil during steps of refresh and maintenance of magnetization of the magnetoresistive coil.

    Abstract translation: 由磁性材料的磁阻条(24)形成并具有优先磁化方向(EA)的细长形状的AMR(各向异性磁阻)型的集成磁阻传感器(20; 30; 40)。 设置/复位线圈(22)具有延伸到磁阻带上并且横向于磁阻带的延伸部(34a,34b)。 集中区域(23)也是铁磁材料,在设置/复位线圈的延伸部分上延伸,以便在刷新和维持磁阻的磁化的步骤期间形成用于由设置/复位线圈产生的场的磁路 线圈

    Semiconductor device and corresponding method

    公开(公告)号:US12148628B2

    公开(公告)日:2024-11-19

    申请号:US17942843

    申请日:2022-09-12

    Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.

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