Micromechanical device with elastic assembly having variable elastic constant

    公开(公告)号:US11698388B2

    公开(公告)日:2023-07-11

    申请号:US17122793

    申请日:2020-12-15

    IPC分类号: G01P15/125 G01P15/00

    CPC分类号: G01P15/125

    摘要: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

    MEMS triaxial magnetic sensor with improved configuration

    公开(公告)号:US10267869B2

    公开(公告)日:2019-04-23

    申请号:US15638204

    申请日:2017-06-29

    摘要: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.

    High-sensitivity, z-axis micro-electro-mechanical detection structure, in particular for an MEMS accelerometer
    5.
    发明授权
    High-sensitivity, z-axis micro-electro-mechanical detection structure, in particular for an MEMS accelerometer 有权
    高灵敏度,z轴微机电检测结构,特别适用于MEMS加速度计

    公开(公告)号:US09513310B2

    公开(公告)日:2016-12-06

    申请号:US14220979

    申请日:2014-03-20

    IPC分类号: G01P15/125 G01P15/08

    摘要: A z-axis micro-electro-mechanical detection structure, having a substrate defining a plane and a suspended mass carried by two anchorage elements. The suspended mass includes a translating mass, suspended over the substrate, mobile in a transverse direction to the plane and arranged between the anchorage elements and two tilting masses, each of which is supported by the anchorage elements through respective elastic anchorage elements so as to be able to rotate with respect to respective oscillation axes. The oscillation axes are parallel to each other to enable a translation movement of the translating mass. Fixed electrodes face at a distance the tilting masses or the translating mass so as to be able to detect displacement of the suspended mass as a result of external forces. Elastic supporting elements are arranged between the translating mass and the tilting masses to enable relative rotation between the translating mass and the tilting masses.

    摘要翻译: z轴微电子机械检测结构,其具有限定平面的基板和由两个锚固元件承载的悬架。 悬挂质量包括悬挂在基板上的平移质量块,在横向方向移动到平面并且布置在锚固元件和两个倾斜块之间,每个倾斜块通过相应的弹性锚固元件由锚固元件支撑,以便是 能够相对于各个摆动轴线旋转。 振荡轴线彼此平行,以便平移质量的平移运动。 固定电极面对倾斜质量或平移质量的距离,以便能够检测由于外力而导致的悬浮质量的位移。 弹性支撑元件设置在平移质量块和倾斜质量块之间,以实现平移质量块与倾斜质量块之间的相对旋转。

    MEMs inertial sensor with high resistance to stiction

    公开(公告)号:US11543428B2

    公开(公告)日:2023-01-03

    申请号:US16898350

    申请日:2020-06-10

    IPC分类号: G01P15/125 G01P15/08

    摘要: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

    Microelectromechanical resonator system with improved stability with respect to temperature variations

    公开(公告)号:US10862449B2

    公开(公告)日:2020-12-08

    申请号:US16171885

    申请日:2018-10-26

    摘要: A MEMS resonator system has a micromechanical resonant structure and an electronic processing circuit including a first resonant loop that excites a first vibrational mode of the structure and generates a first signal at a first resonance frequency. A compensation module compensates, as a function of a measurement of temperature variation, a first variation of the first resonance frequency caused by the temperature variation to generate a clock signal at a desired frequency that is stable relative to temperature. The electronic processing circuit further includes a second resonant loop, which excites a second vibrational mode of the structure and generates a second signal at a second resonance frequency. A temperature-sensing module receives the first and second signals and generates the measurement of temperature variation as a function of the first variation of the first resonance frequency and a second variation of the second resonance frequency caused by the temperature variation.

    MEMS tri-axial accelerometer with one or more decoupling elements

    公开(公告)号:US10768199B2

    公开(公告)日:2020-09-08

    申请号:US15639524

    申请日:2017-06-30

    摘要: A MEMS tri-axial accelerometer is provided with a sensing structure having: a single inertial mass, with a main extension in a horizontal plane defined by a first horizontal axis and a second horizontal axis and internally defining a first window that traverses it throughout a thickness thereof along a vertical axis orthogonal to the horizontal plane; and a suspension structure, arranged within the window for elastically coupling the inertial mass to a single anchorage element, which is fixed with respect to a substrate and arranged within the window, so that the inertial mass is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component. In particular, the suspension structure has at least one first decoupling element for decoupling at least one of the first, second, and third sensing movements from the remaining sensing movements.

    Accelerometric sensor in MEMS technology having high accuracy and low sensitivity to temperature and ageing

    公开(公告)号:US10591505B2

    公开(公告)日:2020-03-17

    申请号:US15280720

    申请日:2016-09-29

    IPC分类号: G01P1/00 G01P15/125

    摘要: The accelerometric sensor has a suspended region, mobile with respect to a supporting structure, and a sensing assembly coupled to the suspended region and configured to detect a movement of the suspended region with respect to the supporting structure. The suspended region has a geometry variable between at least two configurations associated with respective centroids, different from each other. The suspended region is formed by a first region rotatably anchored to the supporting structure and by a second region coupled to the first region through elastic connection elements configured to allow a relative movement of the second region with respect to the first region. A driving assembly is coupled to the second region so as to control the relative movement of the latter with respect to the first region.