公开(公告)号：US20140197487A1

公开(公告)日：2014-07-17

申请号：US14151527

申请日：2014-01-09

Applicant: STMicroelectronics S.r.l.

Inventor： Salvatore Cascino ,  Leonardo Gervasi ,  Antonello Santangelo

IPC: H01L29/78 ,  H01L27/088 ,  H01L29/66

CPC classification number: H01L29/66681 ,  H01L21/26586 ,  H01L21/823418 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/063 ,  H01L29/0634 ,  H01L29/0878 ,  H01L29/0886 ,  H01L29/1095 ,  H01L29/404 ,  H01L29/407 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/4933 ,  H01L29/66613 ,  H01L29/66689 ,  H01L29/66719 ,  H01L29/66727 ,  H01L29/7802 ,  H01L29/7835

Abstract: An electronic semiconductor device comprising: a semiconductor body, having a first side and a second side opposite to one another and including a first structural region facing the second side, and a second structural region extending over the first structural region and facing the first side; a body region extending in the second structural region at the first side; a source region extending inside the body region; an LDD region facing the first side of the semiconductor body; and a gate electrode. The device comprises: a trench dielectric region extending through the second structural region a first trench conductive region immediately adjacent to the trench dielectric region; and a second trench conductive region in electrical contact with the body region and with the source region. An electrical contact at the second side of the semiconductor body is in electrical contact with the drain region via the first structural region.

Abstract translation: 一种电子半导体器件，包括：半导体本体，具有彼此相对的第一侧和第二侧，并且包括面向所述第二侧的第一结构区域和在所述第一结构区域上延伸并面向所述第一侧面的第二结构区域; 身体区域，其在所述第一侧面处在所述第二结构区域中延伸; 源区域，其在身体区域内延伸; 面向半导体主体的第一侧的LDD区; 和栅电极。 所述器件包括：沟槽电介质区域，其延伸穿过所述第二结构区域与所述沟槽电介质区域紧邻的第一沟槽导电区域; 以及与所述主体区域和所述源极区域电接触的第二沟槽导电区域。 半导体本体的第二侧的电触点经由第一结构区域与漏区电接触。

公开(公告)号：US11768148B2

公开(公告)日：2023-09-26

申请号：US17367160

申请日：2021-07-02

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Antonello Santangelo ,  Salvatore Cascino ,  Viviana Cerantonio

IPC: G01N15/14 ,  G01N15/00

CPC classification number: G01N15/1436 ,  G01N2015/0046 ,  G01N2015/1493

Abstract: A particle detector formed by a body defining a chamber and housing a light source and a photodetector. A reflecting surface is formed by a first reflecting region and a second reflecting region that have a respective curved shape. The curved shapes are chosen from among portions of ellipsoidal, paraboloidal, and spherical surfaces. The first reflecting region faces the light source and the second reflecting region faces the photodetector. The first reflecting region has an own first focus, and the second reflecting region has an own first focus. The first focus of the first reflecting region is arranged in an active volume of the body, designed for detecting particles, and the photodetector is arranged on the first focus of the second reflecting region.

公开(公告)号：US11552191B2

公开(公告)日：2023-01-10

申请号：US17017565

申请日：2020-09-10

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro Paolo Bramanti ,  Alberto Pagani ,  Antonello Santangelo

IPC: G01R33/07 ,  H01L29/78 ,  H01L49/02 ,  H01L29/417 ,  H01L43/06 ,  H01L43/14 ,  H03K17/687 ,  H03K17/51

Abstract: Various embodiments of the present disclosure provide a power device including at least one first conductive element adapted to generate a magnetic field when traversed by a current, and characterised in that it further comprises a Hall sensor electrically insulated from the first conductive element. The sensor and the first conductive element are mutually arranged so as to detect said magnetic field indicative of the current that traverses the first conductive element.

公开(公告)号：US11079321B2

公开(公告)日：2021-08-03

申请号：US16584808

申请日：2019-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Maria Eloisa Castagna ,  Salvatore Cascino ,  Viviana Cerantonio ,  Antonello Santangelo

IPC: G01N21/3504

Abstract: The device is formed in a casing including a support, a spacer body, and a mirror element fixed together. A light-emitting element and a light-receiving element are arranged on a bearing surface of the support and face a reflecting surface of the mirror element. The light-emitting element is configured to generate infrared radiation, and the light-receiving element is configured to receive light radiation reflected by the reflecting surface. The spacer body has an emission opening housing the light-emitting element and a reception opening housing the light-receiving element; the reception opening comprises a radiation-limitation portion configured to enable entry of reflected light radiation having an angle, with respect to a normal to the bearing surface, of less than a preset value.

公开(公告)号：US11073467B2

公开(公告)日：2021-07-27

申请号：US16586627

申请日：2019-09-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Antonello Santangelo ,  Salvatore Cascino ,  Viviana Cerantonio

IPC: G01N15/14 ,  G01N15/00

Abstract: A particle detector formed by a body defining a chamber and housing a light source and a photodetector. A reflecting surface is formed by a first reflecting region and a second reflecting region that have a respective curved shape. The curved shapes are chosen from among portions of ellipsoidal, paraboloidal, and spherical surfaces. The first reflecting region faces the light source and the second reflecting region faces the photodetector. The first reflecting region has an own first focus, and the second reflecting region has an own first focus. The first focus of the first reflecting region is arranged in an active volume of the body, designed for detecting particles, and the photodetector is arranged on the first focus of the second reflecting region.

公开(公告)号：US10796918B2

公开(公告)日：2020-10-06

申请号：US15640203

申请日：2017-06-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandra Alberti ,  Paolo Badala' ,  Antonello Santangelo

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/285 ,  H01L23/482 ,  H01L23/00

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.

公开(公告)号：US10520457B2

公开(公告)日：2019-12-31

申请号：US15836587

申请日：2017-12-08

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Antonello Santangelo ,  Salvatore Cascino ,  Roberto Modica ,  Viviana Cerantonio ,  Maurizio Moschetti

IPC: G01N27/22

Abstract: A sensor of volatile substances including: a sensitive layer, of a sensitive material that is permeable to a volatile substance and has an electrical permittivity depending upon a concentration of the volatile substance absorbed; a first electrode structure and a second electrode structure capacitively coupled together and arranged so that a capacitance between the first electrode structure and the second electrode structure is affected by the electrical permittivity of the sensitive material; and a supply device, configured to supply a heating current through one between the first electrode structure and the second electrode structure in a first operating condition, so as to heat the sensitive layer.

公开(公告)号：US20180212042A1

公开(公告)日：2018-07-26

申请号：US15927646

申请日：2018-03-21

Applicant: STMicroelectronics S.r.l.

Inventor： Antonello Santangelo ,  Salvatore Cascino ,  Leonardo Gervasi

IPC: H01L29/66

CPC classification number: H01L29/66681 ,  H01L21/26586 ,  H01L21/823418 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/063 ,  H01L29/0634 ,  H01L29/0878 ,  H01L29/0886 ,  H01L29/1095 ,  H01L29/404 ,  H01L29/407 ,  H01L29/4175 ,  H01L29/41766 ,  H01L29/4933 ,  H01L29/66613 ,  H01L29/66689 ,  H01L29/66719 ,  H01L29/66727 ,  H01L29/7802 ,  H01L29/7835

Abstract: Methods are directed to forming an electronic semiconductor device that includes a body having a first side and a second side opposite to one another and including a first structural region facing the second side, and a second structural region extending over the first structural region and facing the first side. A body region extends in the second structural region at the first side. A source region extends inside the body region and a lightly-doped drain region faces the first side of the body. A gate electrode is formed over the body region. A trench dielectric region extends through the second structural region in a first trench conductive region immediately adjacent to the trench dielectric region. A second trench conductive region is in electrical contact with the body region and source region. An electrical contact on the body is in electrical contact with the drain region through the first structural region.

公开(公告)号：US09841393B2

公开(公告)日：2017-12-12

申请号：US14611062

申请日：2015-01-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Antonello Santangelo ,  Salvatore Cascino ,  Roberto Modica ,  Viviana Cerantonio ,  Maurizio Moschetti

IPC: G01N27/22

CPC classification number: G01N27/225 ,  G01N27/22 ,  G01N27/223 ,  G01N27/227

Abstract: A sensor of volatile substances including: a sensitive layer, of a sensitive material that is permeable to a volatile substance and has an electrical permittivity depending upon a concentration of the volatile substance absorbed; a first electrode structure and a second electrode structure capacitively coupled together and arranged so that a capacitance between the first electrode structure and the second electrode structure is affected by the electrical permittivity of the sensitive material; and a supply device, configured to supply a heating current through one between the first electrode structure and the second electrode structure in a first operating condition, so as to heat the sensitive layer.

公开(公告)号：US09728412B2

公开(公告)日：2017-08-08

申请号：US14970637

申请日：2015-12-16

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandra Alberti ,  Paolo Badala′ ,  Antonello Santangelo

IPC: H01L23/498 ,  H01L23/495 ,  H01L21/285 ,  H01L23/482 ,  H01L23/00

CPC classification number: H01L21/28518 ,  H01L21/28568 ,  H01L23/4827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/01014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/03

Abstract: An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer.