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21.
公开(公告)号:US11427463B2
公开(公告)日:2022-08-30
申请号:US16165828
申请日:2018-10-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Dario Paci , Marco Ferrera , Andrea Picco
IPC: B81B3/00 , H01L41/09 , H01L41/22 , B81C1/00 , H01L41/31 , G02B3/14 , G02B26/08 , H01L25/16 , H01L41/187
Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.
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公开(公告)号:US10794738B2
公开(公告)日:2020-10-06
申请号:US16049262
申请日:2018-07-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Dario Paci , Francesco Procopio , Carlo Valzasina , Paolo Angelini , Francesco Diazzi , Roberto Pio Baorda , Danilo Karim Kaddouri
Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.
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公开(公告)号:US10683200B2
公开(公告)日:2020-06-16
申请号:US16050924
申请日:2018-07-31
Applicant: STMicroelectronics S.r.l.
Inventor: Dario Paci , Domenico Giusti , Irene Martini
Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.
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公开(公告)号:US20200156929A1
公开(公告)日:2020-05-21
申请号:US16752321
申请日:2020-01-24
Applicant: STMicroelectronics S.R.L.
Inventor: Dario Paci , Domenico Giusti , Irene Martini
Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.
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公开(公告)号:US10267869B2
公开(公告)日:2019-04-23
申请号:US15638204
申请日:2017-06-29
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Giacomo Laghi , Giacomo Langfelder , Gabriele Gattere , Alessandro Tocchio , Dario Paci
IPC: G01R33/02 , G01R33/028 , G01R33/038
Abstract: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.
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公开(公告)号:US20190039880A1
公开(公告)日:2019-02-07
申请号:US16050924
申请日:2018-07-31
Applicant: STMicroelectronics S.r.l.
Inventor: Dario Paci , Domenico Giusti , Irene Martini
Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.
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公开(公告)号:US10094891B2
公开(公告)日:2018-10-09
申请号:US15135793
申请日:2016-04-22
Applicant: STMicroelectronics S.r.l.
Inventor: Dario Paci , Marco Marchesi , Marco Morelli
IPC: G01R33/09 , G01R33/00 , G01R33/07 , G01R33/025
Abstract: An integrated AMR magnetoresistive sensor has a magnetoresistor, a set/reset coil and a shielding region arranged on top of each other. The set/reset coil is positioned between the magnetoresistor and the shielding region. The magnetoresistor is formed by a magnetoresistive strip of an elongated shape having a length in a first direction parallel to the preferential magnetization direction and a width in a second direction perpendicular to the first direction. The set/reset coil has at least one stretch extending transversely to the magnetoresistive strip. The shielding region is a ferromagnetic material and has a width in the second direction greater than the width of the magnetoresistive strip so as to attenuate the external magnetic field traversing the magnetoresistive strip and increase the sensitivity scale of the magnetoresistive sensor.
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公开(公告)号:US20140353785A1
公开(公告)日:2014-12-04
申请号:US14287798
申请日:2014-05-27
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Dario Paci
CPC classification number: G01R33/096 , G01R33/0011 , H01L27/22 , H01L43/02
Abstract: An integrated magnetoresistive sensor (20; 30; 40) of an AMR (Anisotropic Magneto Resistance) type, formed by a magnetoresistive strip (24) of ferromagnetic material and having an elongated shape with a preferential magnetization direction (EA). A set/reset coil (22) has a stretch (34a, 34b), which extends over and transversely to the magnetoresistive strip. A concentrating region (23), also of ferromagnetic material, extends over the stretch of the set/reset coil so as to form a magnetic circuit for the field generated by the set/reset coil during steps of refresh and maintenance of magnetization of the magnetoresistive coil.
Abstract translation: 由磁性材料的磁阻条(24)形成并具有优先磁化方向(EA)的细长形状的AMR(各向异性磁阻)型的集成磁阻传感器(20; 30; 40)。 设置/复位线圈(22)具有延伸到磁阻带上并且横向于磁阻带的延伸部(34a,34b)。 集中区域(23)也是铁磁材料,在设置/复位线圈的延伸部分上延伸,以便在刷新和维持磁阻的磁化的步骤期间形成用于由设置/复位线圈产生的场的磁路 线圈
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公开(公告)号:US12148628B2
公开(公告)日:2024-11-19
申请号:US17942843
申请日:2022-09-12
Applicant: STMicroelectronics S.r.l. , STMicroelectronics (MALTA) Ltd
Inventor: Roseanne Duca , Dario Paci , Pierpaolo Recanatini
IPC: H01L21/324 , H01L23/16 , H01L23/31
Abstract: A leadframe includes a die pad and a set of electrically conductive leads. A semiconductor die, having a front surface and a back surface opposed to the front surface, is arranged on the die pad with the front surface facing away from the die pad. The semiconductor die is electrically coupled to the electrically conductive leads. A package molding material is molded over the semiconductor die arranged on the die pad. A stress absorbing material contained within a cavity delimited by a peripheral wall on the front surface of the semiconductor die is positioned intermediate at least one selected portion of the front surface of the semiconductor die and the package molding material.
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公开(公告)号:US11737369B2
公开(公告)日:2023-08-22
申请号:US17343388
申请日:2021-06-09
Applicant: STMicroelectronics S.r.l.
Inventor: Dario Paci , Marco Morelli , Caterina Riva
IPC: G11B5/127 , H04R31/00 , H10N50/01 , B82Y25/00 , G01R33/09 , H10B61/00 , H10N59/00 , H10N50/10 , G01R33/00 , G01R33/02
CPC classification number: H10N50/01 , B82Y25/00 , G01R33/0011 , G01R33/0052 , G01R33/0206 , G01R33/09 , G01R33/093 , G01R33/096 , G01R33/098 , H10B61/00 , H10N50/10 , H10N59/00
Abstract: An integrated magnetoresistive device includes a substrate of semiconductor material that is covered, on a first surface, by an insulating layer. A magnetoresistor of ferromagnetic material extends within the insulating layer and defines a sensitivity plane of the sensor. A concentrator of ferromagnetic material includes at least one arm that extends in a transversal direction to the sensitivity plane and is vertically offset from the magnetoresistor. The concentrator concentrates deflects magnetic flux lines perpendicular to the sensitivity plane so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.
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