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    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD HAVING THE SAME EMBEDDED THEREIN
    21.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD HAVING THE SAME EMBEDDED THEREIN 审中-公开
    嵌入式多层陶瓷电子元件，其制造方法及其嵌入式印刷电路板

    公开(公告)号：US20150380161A1

    公开(公告)日：2015-12-31

    申请号：US14484566

    申请日：2014-09-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Bong LIM ,  Hai Joon LEE ,  Doo Young KIM ,  Chang Hoon KIM

    IPC: H01G4/012 ,  C23C14/34 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/008

    CPC classification number: C23C14/34 ,  C23C14/185 ,  H01G4/1227 ,  H01G4/248 ,  H01G4/30

    Abstract: A multilayer ceramic electronic component may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; first and second internal electrodes alternately exposed to the end surfaces with the dielectric layer interposed therebetween; and first and second external electrodes including connection portions disposed on the end surfaces and connected to the internal electrodes and band portions extended to portions of the main surfaces. The connection portions and the band portions are formed of a conductive thin film, and a width of the band portion may be greater than a distance between an end of the first internal electrode and the second end surface or a distance between an end of the second internal electrode and the first end surface.

    Abstract translation: 多层陶瓷电子部件可以包括：陶瓷体，其包括电介质层，并且具有彼此相对的第一和第二主表面，彼此相对的第一和第二侧表面以及彼此相对的第一和第二端面; 交替地暴露于端面的第一和第二内部电极，介电层插入其间; 以及第一和第二外部电极，包括设置在端面上并连接到内部电极的连接部分和延伸到主表面的部分的带部分。 连接部分和带部分由导电薄膜形成，并且带部分的宽度可以大于第一内部电极的端部和第二端部表面之间的距离或第二内部电极的端部之间的距离 内部电极和第一端面。

    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON
    22.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装的板

    公开(公告)号：US20150213957A1

    公开(公告)日：2015-07-30

    申请号：US14282990

    申请日：2014-05-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Don CHOI ,  Hai Joon LEE

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H05K1/18

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H05K1/0231 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; a first capacitor part including a first internal electrode and a second internal electrode disposed in the ceramic body; second to fifth capacitor parts including a third internal electrode having first and second leads and a fourth internal electrode having third and fourth leads, the third and fourth internal electrodes being disposed on one dielectric layer in the ceramic body, and fifth and sixth internal electrodes disposed on another dielectric layer in the ceramic body; and a first external electrode and a second external electrode. The first capacitor part and the second to fifth capacitor parts may be connected in parallel to each other.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括多个电介质层; 第一电容器部分，包括设置在陶瓷体中的第一内部电极和第二内部电极; 第二至第五电容器部分，包括具有第一和第二引线的第三内部电极和具有第三和第四引线的第四内部电极，第三和第四内部电极设置在陶瓷体中的一个电介质层上，第五和第六内部电极设置 在陶瓷体中的另一个介电层上; 以及第一外部电极和第二外部电极。 第一电容器部分和第二至第五电容器部分可以彼此并联连接。

    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON
    23.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON 有权
    多层陶瓷电容器及其安装的板

    公开(公告)号：US20150213956A1

    公开(公告)日：2015-07-30

    申请号：US14282836

    申请日：2014-05-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Don CHOI ,  Hai Joon LEE

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H05K1/18

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H05K1/0231 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; a first capacitor part including a first internal electrode and a second internal electrode disposed in the ceramic body; second to fifth capacitor parts including a third internal electrode having a first lead, a fourth internal electrode having a second lead, a fifth internal electrode having a third lead, and a sixth internal electrode having a fourth lead, the third to sixth internal electrodes being disposed on one dielectric layer in the ceramic body, and a seventh internal electrode disposed on another dielectric layer in the ceramic body; and a first external electrode and a second external electrode. The first capacitor part and the second to fifth capacitor parts may be connected in parallel to each other.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括多个电介质层; 第一电容器部分，包括设置在陶瓷体中的第一内部电极和第二内部电极; 第二至第五电容器部分，包括具有第一引线的第三内部电极，具有第二引线的第四内部电极，具有第三引线的第五内部电极和具有第四引线的第六内部电极，第三至第六内部电极为 设置在陶瓷体的一个电介质层上，第七内部电极设置在陶瓷体的另一个电介质层上; 以及第一外部电极和第二外部电极。 第一电容器部分和第二至第五电容器部分可以彼此并联连接。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN
    24.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT THEREIN 审中-公开
    嵌入式多层陶瓷电子元件及其制造方法以及具有嵌入式多层陶瓷电子元件的印刷电路板

    公开(公告)号：US20140151101A1

    公开(公告)日：2014-06-05

    申请号：US13770971

    申请日：2013-02-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hai Joon LEE ,  Byoung Hwa LEE ,  Jin Man JUNG

    IPC: H01G4/12 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/12 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

    Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一和第二内部电极彼此面对，介电层插入其间; 形成在所述陶瓷体的外表面上的第一外部电极和第二外部电极，所述第一外部电极与所述第一内部电极电连接，所述第二外部电极与所述第二内部电极电连接; 以及形成在所述第一外部电极和所述第二外部电极上的镀层，其中，所述陶瓷体的表面粗糙度为500nm以上且不大于陶瓷覆盖片的厚度，并且所述镀层的表面粗糙度为300 nm以上且不大于镀层的厚度。

    THIN-FILM CAPACITOR
    26.
    发明申请
    THIN-FILM CAPACITOR 审中-公开

    公开(公告)号：US20180144872A1

    公开(公告)日：2018-05-24

    申请号：US15645339

    申请日：2017-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Ho SHIN ,  Yun Sung KANG ,  Seung Mo LIM ,  Kyo Yeol LEE ,  Dong Joon OH ,  Woong Do JUNG ,  Ho Phil JUNG ,  Hai Joon LEE

    IPC: H01G4/33 ,  H01G4/30 ,  H01G4/228

    CPC classification number: H01G4/33 ,  H01G4/228 ,  H01G4/306

    Abstract: A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.

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