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    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    21.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    复合电子元件及其相应的板

    公开(公告)号：US20160007439A1

    公开(公告)日：2016-01-07

    申请号：US14674765

    申请日：2015-03-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Myeong Gi KIM ,  Min Kyoung CHEON ,  Yu Jin CHOI ,  Ho Yoon KIM ,  So Yeon SONG

    IPC: H05K1/02 ,  H05K1/18 ,  H01F27/28 ,  H01G4/40 ,  H01F27/29

    CPC classification number: H05K1/023 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H05K1/181

    Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

    Abstract translation: 复合电子部件包括电容器和电感器彼此耦合的复合体，所述电容器包括：陶瓷体，其包括多个电介质层和第一和第二内部电极，所述电感器包括具有线圈的磁性体 部分。 输入端子设置在复合体的第一侧表面上并连接到线圈部分。 输出端子包括设置在复合体的第一侧表面上并连接到线圈部分的第一输出端子和设置在复合体的第一端面上并连接到第一内部电极的第二输出端子。 接地端子设置在复合体的第二端面上并连接到第二内部电极。 电容器耦合到电感器的侧表面。

    ELECTRONIC COMPONENT
    23.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210202174A1

    公开(公告)日：2021-07-01

    申请号：US16852808

    申请日：2020-04-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Yeong Lim KWON

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008 ,  H01G2/06

    Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.

    ELECTRONIC COMPONENT
    24.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20210175018A1

    公开(公告)日：2021-06-10

    申请号：US16850583

    申请日：2020-04-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM

    IPC: H01G4/248 ,  H01G4/30 ,  H01G4/012

    Abstract: An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95≤{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}≤4.93, in which Lm2 is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm1 is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm1 is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm2 is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    25.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20200211770A1

    公开(公告)日：2020-07-02

    申请号：US16812933

    申请日：2020-03-09

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Soo Hwan SON ,  Jong Duck KIM ,  Dae Heon JEONG ,  Ho Yoon KIM

    IPC: H01G4/12 ,  H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/012 ,  H05K1/18 ,  H01G4/38

    Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT ARRAY
    26.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT ARRAY 审中-公开

    公开(公告)号：US20200118764A1

    公开(公告)日：2020-04-16

    申请号：US16572068

    申请日：2019-09-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G4/38 ,  H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  H05K1/18 ,  H05K1/02

    Abstract: A multilayer ceramic electronic component array includes a plurality of multilayer ceramic electronic components including a ceramic body including a dielectric layer and first and second internal electrodes, and first and second external electrodes, respectively; and an interposer including an insulating body disposed below the plurality of multilayer ceramic electronic components, a first terminal electrode disposed on the insulating body and connected to at least a portion of the respective first external electrodes of the plurality of multilayer ceramic electronic components, and a second terminal electrode disposed on the insulating body and connected to at least a portion of the respective second external electrodes of the plurality of multilayer ceramic electronic components. The first external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components are in electrical contact with each other.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    27.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20200092999A1

    公开(公告)日：2020-03-19

    申请号：US16691787

    申请日：2019-11-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Man Su BYUN ,  Ho Yoon KIM ,  Kyung Hwa YU ,  Dae Heon JEONG ,  Min Kyoung CHEON ,  Soo Hwan SON

    IPC: H05K1/18 ,  H01G4/40 ,  H01G2/06 ,  H05K3/30 ,  H01G4/30 ,  H01G4/232 ,  H01G4/002

    Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

    ELECTRONIC COMPONENT AND BOARD FOR MOUNTING OF THE SAME
    28.
    发明申请
    ELECTRONIC COMPONENT AND BOARD FOR MOUNTING OF THE SAME 审中-公开

    公开(公告)号：US20200090863A1

    公开(公告)日：2020-03-19

    申请号：US16200631

    申请日：2018-11-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Ho Yoon KIM ,  Sang Soo PARK ,  Woo Chul SHIN

    IPC: H01G2/06 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/012 ,  H05K1/18

    Abstract: An electronic component and a mounting board for mounting of the same are provided. The electronic component includes a body including external electrodes disposed on surfaces of the body opposing each other in a first direction, respectively, and metal frames connected to the external electrodes, respectively. The metal frames include supports bonded to the external electrodes and mounting portions extending from lower ends of the supports in the first direction and are spaced apart from the body and the external electrodes. The supports include a lower support portion disposed on a lower side of the body and an upper support portion disposed on an upper side of the body, and the lower support portion has a thickness in a second direction perpendicular to the first direction relatively greater than a thickness of the upper support portion in the first direction.

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