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公开(公告)号:US12110938B2
公开(公告)日:2024-10-08
申请号:US17718423
申请日:2022-04-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunchul Kim , Souk Kim , Younghoon Sohn
IPC: F16F15/02
CPC classification number: F16F15/02
Abstract: A vibration isolation table of the disclosure may include a lower structure including a plurality of block structures, a middle structure on the lower structure, and an upper structure on the middle structure. The plurality of block structures may be spaced apart from one another such that a space is formed between adjacent ones of the plurality of block structures. At least one of the lower structure and the upper structure may include high attenuation concrete.
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公开(公告)号:US12019139B2
公开(公告)日:2024-06-25
申请号:US17857525
申请日:2022-07-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Moonseok Kang , Yi Yang , Hyunchul Kim , Jiho Shin , Sukgi Hong
IPC: G01S13/08 , H04B1/7163
CPC classification number: G01S13/08 , H04B1/7163
Abstract: An electronic device is provided. The electronic device includes an antenna module, a communication module configured to control the antenna module, and at least one processor operatively connected to the communication module, wherein the at least one processor transmits a ultra-wide band (UWB) signal including a first data frame, receives, based on the transmitted first data frame, a reflected first data frame, obtains a first channel impulse response by using the reflected first data frame, acquires information by using the channel impulse response, and receives a UWB signal including a second data frame from an external electronic device in response to the transmitted first data frame.
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公开(公告)号:US11962096B2
公开(公告)日:2024-04-16
申请号:US17727190
申请日:2022-04-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sehwan Choi , Sukgi Hong , Moonseok Kang , Hyunchul Kim , Yi Yang , Jungsik Park , Sungjun Lim , Jonghoon Jang
Abstract: An electronic device is provided. The electronic device includes a housing, a first antenna and a second antenna which are disposed near at least one edge of the housing inside the housing and a first distance away from each other, wherein the first antenna and second antenna are positioned different distances away from an edge vertical to the one edge, a communication circuit operatively connected to the first antenna and second antenna, at least one sensor, a processor, and a memory. The memory can store instructions which, when executed, enable the processor to identify the posture of the electronic device by means of at least one sensor, if the identified posture of the electronic device is a landscape state, determine the position of at least one external electronic device on the basis of at least one signal received from the at least one external electronic device, and, if the identified posture of the electronic device is a portrait state, determine the position of an external electronic device on the basis of a signal received from the external electronic device positioned in a direction which is determined on the basis of the placements of the first antenna and second antenna among the at least one external electronic device.
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公开(公告)号:US11856487B2
公开(公告)日:2023-12-26
申请号:US17749575
申请日:2022-05-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sejong Yoon , Doosuk Kang , Moonseok Kang , Hyunchul Kim , Yi Yang , Jonghoon Jang
CPC classification number: H04W4/029 , G01S5/06 , H04B1/7163
Abstract: An electronic device includes an ultra-wide band (UWB) communication module; a memory; and a processor operably connected to the UWB communication module and the memory, wherein the processor is configured to receive, through the UWB communication module, a first message from a first external electronic device at a first time slot; store, in the memory, the first message and a receiving time of the first message; receive, through the UWB communication module, a second message from a second external electronic device at a second time slot; store, in the memory, the second message and a receiving time of the second message; identify a time schedule information for transmitting a third message to the first external electronic device and the second external electronic device, the time schedule information including a transmitting time of the third message; obtain first time information regarding a period of time between the receiving time of the first message and the transmitting time of the third message and second time information regarding a period of time between the receiving time of the second message and the transmitting time of the third message; and transmit, through the UWB communication module, the third message including the first time information and the second time information to the first external electronic device and the second external electronic device at a third time slot.
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25.
公开(公告)号:US11855686B2
公开(公告)日:2023-12-26
申请号:US17565617
申请日:2021-12-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sejong Yoon , Moonseok Kang , Hyunchul Kim
IPC: H04B1/7163 , H04W52/02
CPC classification number: H04B1/71637 , H04W52/0225
Abstract: According to certain embodiments, an electronic device comprises: a wireless communication module configured to support ultra-wide band (UWB) communication; and at least one processor operatively connected with the wireless communication module, wherein the at least one processor is configured to: set the wireless communication module to a wake-up state; when a given number of first ranging response messages (RRMs) are received from second external electronic devices after receiving a first ranging initiation message (RIM) from a first external electronic device in a RIM slot of a first ranging round, set the wireless communication module to a sleep state after receiving a first ranging final message (RFM) from the first external electronic device in a RFM slot of the first ranging round until a RIM slot of a second ranging round is reached after the first ranging round; set the wireless communication module to the wake-up state in the RIM slot in the second ranging round; and set the wireless communication module to the sleep state if a second RIM is not received from a third external electronic device in the RIM slot in the second ranging round.
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公开(公告)号:US11671834B2
公开(公告)日:2023-06-06
申请号:US17026783
申请日:2020-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yi Yang , Jiho Shin , Moonseok Kang , Hyunchul Kim , Jonghoon Jang , Sehwan Choi , Sukgi Hong
IPC: H04W12/102 , H04W12/47 , H04W12/037
CPC classification number: H04W12/47 , H04W12/037 , H04W12/102
Abstract: An electronic device is provided. The electronic device includes a near-field communication (NFC) communication circuit, an ultra-wideband (UWB) communication circuit connected with the NFC communication circuit, at least one secure element operatively connected with the NFC communication circuit and configured to store security information, and a processor disposed in the NFC communication circuit and operatively connected with the UWB communication circuit, wherein the processor is configured to receive a data request from an external electronic device via the UWB communication circuit, access at least part of the security information stored in the at least one secure element, based on a routing table matching the data request with the at least one secure element, and transmit the at least part of the security information to the external electronic device via the UWB communication circuit.
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公开(公告)号:US20220392930A1
公开(公告)日:2022-12-08
申请号:US17671651
申请日:2022-02-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyoungeun Chang , Hyunchul Kim , Jinyoung Kim , Donghyun Kim , Sungin Kim
IPC: H01L27/146
Abstract: An image sensor includes: a substrate having a first surface on which light is incident and a second surface opposite to the first surface; a pixel isolation structure enclosing a pixel region in the substrate; a photoelectric conversion region in the pixel region; and a device isolation layer defining a pattern in the pixel region, wherein the device isolation layer includes a first portion contacting the pixel isolation structure and a second portion spaced apart from the pixel isolation structure, the device isolation layer extends from a second surface of the substrate into the substrate, and a length of the second portion of the device isolation layer in a vertical direction perpendicular to the first surface of the substrate is less than a length of the first portion of the device isolation layer in the vertical direction.
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28.
公开(公告)号:US08809929B2
公开(公告)日:2014-08-19
申请号:US14016912
申请日:2013-09-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wonmo Park , Hyunchul Kim , Hyodong Ban , Hyunju Lee
IPC: H01L27/108 , H01L49/02 , H01L21/205
CPC classification number: H01L27/108 , H01L21/205 , H01L27/10817 , H01L27/10852 , H01L27/10894 , H01L28/91
Abstract: Memory devices comprise a lower layer that extends across a cell array region and across a peripheral region and that includes a flat outer surface from the cell array region to the peripheral region. A signal transfer conductor layer extends in the cell array region beneath the flat outer surface of the lower layer and extends in the peripheral region above the flat outer surface of the lower layer. An insulating layer is provided on the lower layer, including a flat outer surface from the cell array region to the peripheral region. A flat stopper layer is provided on the flat outer surface of the insulating layer and extending across the cell array region and the peripheral region. Related methods are also provided.
Abstract translation: 存储器件包括延伸跨越单元阵列区域并跨越周边区域并且包括从单元阵列区域到外围区域的平坦外表面的下层。 信号传输导体层在下层的平坦外表面下方的电池阵列区域中延伸,并且在下层的平坦外表面上方的周边区域中延伸。 绝缘层设置在下层,包括从电池阵列区域到外围区域的平坦的外表面。 在绝缘层的平坦外表面上设置有平坦的阻挡层,并延伸穿过电池阵列区域和周边区域。 还提供了相关方法。
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29.
公开(公告)号:US12266674B2
公开(公告)日:2025-04-01
申请号:US17315321
申请日:2021-05-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Minho Jang , Kyoungwon Na , Seungkuk Kang , Hyunchul Kim , Hyun Young Yeo , In Sung Joe
IPC: H01L27/146
Abstract: An image sensor includes a first chip that includes a pixel region and a pad region, and a second chip that is in contact with one surface of the first chip and includes circuits that drive the first chip. The first chip includes a first substrate, an interlayer insulating layer disposed between the first substrate and the second chip, first interconnection lines disposed in the interlayer insulating layer, a conductive pad disposed in the pad region between the second chip and the first interconnection lines, and a recess region formed in the pad region that penetrates the first substrate and the interlayer insulating layer and exposes the conductive pad.
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30.
公开(公告)号:US12156112B2
公开(公告)日:2024-11-26
申请号:US17721448
申请日:2022-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gupil Cheong , Moonseok Kang , Hyunchul Kim , Yi Yang , Moongee Cho , Doosuk Kang , Bokun Choi
Abstract: Disclosed is an electronic device configured to transmit an advertising signal using a first communication circuit, establish a connection with each of a plurality of external electronic devices based on one or more response signals for the advertising signal using the first communication circuit, receive an identifier from each of the plurality of external electronic devices, identify at least two external electronic devices corresponding to the same group or the same identifier among the plurality of external electronic devices based on the received identifier, determine a ranging device among the at least two external electronic devices based on communication quality related to the plurality of external electronic devices, and perform UWB ranging with the determined ranging device.
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