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    Method of fabricating a semiconductor package
    22.
    发明授权
    Method of fabricating a semiconductor package 有权

    公开(公告)号：US10403606B2

    公开(公告)日：2019-09-03

    申请号：US15971600

    申请日：2018-05-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Heung-Kyu Kwon ,  Min-Ok Na ,  Sung-Woo Park ,  Ji-Hyun Park ,  Su-Min Park

    IPC: H01L25/00 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/18 ,  H01L23/48

    Abstract: A method for fabricating a semiconductor package including mounting a first semiconductor chip on a first substrate, disposing a first connector on the first substrate, placing a molding control film on the first semiconductor chip to horizontally extend over the first substrate, filling a space between the molding control film and the first substrate with a molding compound such that the molding compound contacts side surfaces of the first semiconductor chip and covers the first connector and does not cover a top surface of the first semiconductor chip, detaching the molding control film, forming an opening through the molding compound to expose a portion of the first connector, disposing a second connector and a second semiconductor chip on opposite surfaces of a second substrate, respectively, and placing the second substrate on the first substrate such that the second connector contacts the first connector may be provided.

    Method for providing virtual object and electronic device therefor
    23.
    发明授权
    Method for providing virtual object and electronic device therefor 有权

    公开(公告)号：US10242031B2

    公开(公告)日：2019-03-26

    申请号：US14860992

    申请日：2015-09-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jin-He Jung ,  Ji-Hyun Park ,  Kyu-Sung Cho ,  Ik-Hwan Cho ,  Yong-Joon Jeon ,  Min-Kyung Hwang

    IPC: G09G5/00 ,  G06F17/30 ,  G06T11/00 ,  G06K9/00

    Abstract: An electronic device and method for providing a virtual object are disclosed, including a processor and memory storing program instructions executable by the processor to implement the method, which includes receiving a request for a virtual object including a plurality of present conditions, searching a database for the virtual object by comparing the received plurality of present conditions to a plurality of condition sets, each set associated with at least one virtual object stored in the database; and when none of the plurality of condition sets matches all of the received plurality of present conditions, detecting a partially matching condition set matching at least one of the received plurality of present conditions and providing a partially matching virtual object corresponding to the partially matching condition set.

    Method of analyzing a fault of an electronic system
    25.
    发明授权
    Method of analyzing a fault of an electronic system 有权

    公开(公告)号：US10067813B2

    公开(公告)日：2018-09-04

    申请号：US14937989

    申请日：2015-11-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jang-Hyuk An ,  Byoung-Ju Choi ,  Ji-Hyun Park

    IPC: G06F11/00 ,  G06F11/07 ,  G06F11/30 ,  G06F11/34 ,  G06F11/36

    Abstract: In a method of analyzing a fault and/or error of an electronic system according to some example embodiments, a system call that accesses a hardware is replaced with a hooking system call including a code that executes the system call and a code that obtains monitoring information, the monitoring information including system call execution information and hardware performance information is obtained by executing the hooking system call when the hooking system call is called instead of the system call, and the monitoring information is recorded to analyze the fault/error of the electronic system based on the monitoring information.

    METHOD FOR PROCESSING DATA RECEIVED AND AN ELECTRONIC DEVICE THEREOF
    29.
    发明申请
    METHOD FOR PROCESSING DATA RECEIVED AND AN ELECTRONIC DEVICE THEREOF 有权
    用于处理接收到的数据的方法及其电子设备

    公开(公告)号：US20150223013A1

    公开(公告)日：2015-08-06

    申请号：US14615279

    申请日：2015-02-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-Hyun Park ,  Hyun-Soo Kim

    IPC: H04W4/00 ,  H04W8/02

    CPC classification number: H04W4/80 ,  H04L67/18 ,  H04W4/023 ,  H04W8/02

    Abstract: A method for operating a first electronic device is provided. The method includes receiving data from a second electronic device in short-range radio communication. The method also includes detecting a location of the first electronic device. The method further includes determining an execution method of the received data based on at least one of the location of the electronic device and one or more of communication region information of the short-range radio communication of the second electronic device, signal strength of the short-range radio communication in the communication region, and location information of the electronic device.

    Abstract translation: 提供了一种操作第一电子设备的方法。 该方法包括在短程无线电通信中从第二电子设备接收数据。 该方法还包括检测第一电子设备的位置。 该方法还包括基于电子设备的位置和第二电子设备的短距离无线电通信的通信区域信息中的一个或多个的至少一个来确定接收到的数据的执行方法，短路的信号强度 通信区域中的无线电通信，以及电子设备的位置信息。

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