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1.发明授权公开(公告)号：US11165728B2
公开(公告)日：2021-11-02
申请号：US16474386
申请日：2017-12-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Im-Sung Lee , Ki-Won Kim , Sae Gee Oh , Ja-Min Goo , Kiyoung Kwon , Eun-Young Kim , Jimin Kim , Chulkwi Kim , Hyung-Woo Kim , Joo Namkung , Ji-Hyun Park , Seong-Hoon You , Yong-Ju Yu , Dongkyu Lee , Chanwon Lee , Si-Hak Jang
Abstract: Various embodiments of the present disclosure relate to an electronic device and a method for delivering a message by the same. The electronic device may comprise: a camera; at least one processor functionally connected to the camera; a driving circuitry configured to control moving of the electronic device; and a memory for storing at least one program configured to be executable by the at least one processor, wherein the program comprises instructions that are set to: in response to an input of a message from a sender, activate the camera and capture an image of the sender, analyze the image of the sender for an emotion of the sender, analyze the inputted message for a recipient, determine an output pattern based on the image, determine the recipient based on the inputted message, determine whether the determined recipient is located in a vicinity of the electronic device, and in response to the determined recipient not being located in the vicinity of the electronic device, identify a location of the determined recipient and control the driving circuitry to move the electronic device to the identified location.
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2.发明授权Method and apparatus for displaying information about wireless charging pad in electronic device 有权用于在电子设备中显示关于无线充电垫的信息的方法和装置公开(公告)号：US09564940B2
公开(公告)日：2017-02-07
申请号：US14150337
申请日：2014-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji-Hyun Park , Jung-Hyung Kim , Bo-Ram Namgoong , Sang-Mi Park , Sung-Kwang Yang , Bo-Kun Choi
IPC: H04B5/00 , H02J50/90 , H04B1/3883 , H04W4/00 , H04W4/02
CPC classification number: H04B1/3883 , H02J50/90 , H04B5/0037 , H04W4/02 , H04W4/80
Abstract: A method and apparatus for providing information about a plurality of wireless charging pads to an electronic device such that the electronic device performs wireless charging efficiently is provided. The method includes receiving information about the plurality of wireless charging pads and displaying the information about the plurality of wireless charging pads on a screen of the electronic device.
Abstract translation: 提供一种用于向电子设备提供关于多个无线充电垫的信息的方法和装置，使得电子设备有效地执行无线充电。 该方法包括接收关于多个无线充电垫的信息，并且在电子设备的屏幕上显示关于多个无线充电垫的信息。
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公开(公告)号：US20150048789A1
公开(公告)日：2015-02-19
申请号：US14460301
申请日：2014-08-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soo-Hyung Kim , Hun-Cheol Oh , Ji-Hyun Park , Soon-Hyun Cha , Young-Joon Kim , Hyun-Soo Kim
Abstract: A wireless power transmitter performs a method for supplying power for wireless charging from the wireless power transmitter to a plurality of wireless power receivers. The wireless charging method includes allocating priorities to one or more electronic devices that connect for wireless charging, and supplying wireless power to the one or more electronic devices based on the priorities. Other embodiments may be implemented.
Abstract translation: 无线电力发射机执行从无线电力发射机向多个无线电力接收机提供用于无线充电的电力的方法。 无线充电方法包括：为连接无线充电的一个或多个电子设备分配优先权，并且基于优先级向一个或多个电子设备提供无线电力。 可以实现其他实施例。
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公开(公告)号：US11800004B2
公开(公告)日：2023-10-24
申请号：US17485998
申请日：2021-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chang-Ryong Heo , Hyun-Seok Shin , Ji-Hyun Park , Sung-Hyuk Shin , Myung-Gon Hong
IPC: H04M1/72412 , H04W4/80 , H04B5/00 , H04W12/06 , H04W76/14 , G06K7/10 , H04W88/06 , H04L67/00 , H04W84/18
CPC classification number: H04M1/72412 , H04B5/0031 , H04W4/80 , H04W12/06 , H04W76/14 , G06K7/10297 , H04L67/34 , H04W84/18 , H04W88/06
Abstract: A method and electronic device for executing application concurrently with other devices are provided. An address of an external electronic device and a location of an application is obtained. A connection is established with a device using a short-range communication protocol. The application is obtained and executed in conjunction with the device.
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公开(公告)号：US11277037B2
公开(公告)日：2022-03-15
申请号：US16998976
申请日：2020-08-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Soo-Hyung Kim , Hun-Cheol Oh , Ji-Hyun Park , Soon-Hyun Cha , Young-Joon Kim , Hyun-Soo Kim
Abstract: A wireless power transmitter performs a method for supplying power for wireless charging from the wireless power transmitter to a plurality of wireless power receivers. The wireless charging method includes allocating priorities to one or more electronic devices that connect for wireless charging, and supplying wireless power to the one or more electronic devices based on the priorities. Other embodiments may be implemented.
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Patent Agency Ranking
公开(公告)号：US11134145B2
公开(公告)日：2021-09-28
申请号：US16826352
申请日：2020-03-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chang-Ryong Heo , Hyun-Seok Shin , Ji-Hyun Park , Sung-Hyuk Shin , Myung-Gon Hong
IPC: H04M1/72412 , H04W4/80 , H04B5/00 , H04W12/06 , H04W76/14 , G06K7/10 , H04W88/06 , H04L29/08 , H04W84/18
Abstract: A method and electronic device for executing application concurrently with other devices are provided. An address of an external electronic device and a location of an application is obtained. A connection is established with a device using a short-range communication protocol. The application is obtained and executed in conjunction with the device.
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公开(公告)号：US20200381957A1
公开(公告)日：2020-12-03
申请号：US16998976
申请日：2020-08-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Soo-Hyung Kim , Hun-Cheol Oh , Ji-Hyun Park , Soon-Hyun Cha , Young-Joon Kim , Hyun-Soo Kim
Abstract: A wireless power transmitter performs a method for supplying power for wireless charging from the wireless power transmitter to a plurality of wireless power receivers. The wireless charging method includes allocating priorities to one or more electronic devices that connect for wireless charging, and supplying wireless power to the one or more electronic devices based on the priorities. Other embodiments may be implemented.
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公开(公告)号：US10534900B2
公开(公告)日：2020-01-14
申请号：US15120687
申请日：2015-02-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Cheol-Ho Cheong , Hyuk Kang , Dong-Hyun Kim , Yang-Su Kim , Hyun-Soo Kim , Bo-Yeon Na , Byoung-Tack Roh , Jeong-Min Park , Ji-Hyun Park , Tae-Gun Park , Kwang-Sub Son , Dong-Il Son , Sung-Ho Son , Sung-Hyuk Shin , Hyun-Seok Shin , Jin-gil Yang , Jae-Yung Yeo , Jae-Bong Yoo , Su-Ha Yoon , Seung-Young Jeon , Kyung-Soo Lim , Eui-Chang Jung , In-Ji Jin , Jong-Ho Choi , Duk-Ki Hong , Moo-Hyun Baek , Sang-Youp Seok , Byoung-Uk Yoon
IPC: G06F21/32 , H04W12/06 , H04W4/00 , G06F1/16 , G06F21/34 , A61B5/00 , A61B5/0205 , G06F3/01 , G16H10/00 , G16H20/30 , H04W88/02 , H04L29/06 , A61B5/021 , A61B5/024 , A61B5/0402
Abstract: A method for providing a service by an electronic device according to various embodiments may comprise the steps of: obtaining biometric information of a user; determining at least one service associated with the biometric information out of a plurality of services that the electronic device supports; and providing the determined at least one service.
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9.发明申请公开(公告)号：US20190319012A1
公开(公告)日：2019-10-17
申请号：US16448392
申请日：2019-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heung-Kyu KWON , Min-Ok NA , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
IPC: H01L25/065 , H01L21/56 , H01L23/00 , H01L23/31 , H01L25/18 , H01L25/10 , H01L23/552 , H01L23/498 , H01L25/00
Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
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公开(公告)号：US09978721B2
公开(公告)日：2018-05-22
申请号：US15241452
申请日：2016-08-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heung-Kyu Kwon , Min-Ok Na , Sung-Woo Park , Ji-Hyun Park , Su-Min Park
IPC: H05K1/11 , H01L25/065 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/498 , H01L23/552 , H01L23/00 , H01L25/10 , H01L25/18 , H01L25/00
CPC classification number: H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/566 , H01L21/568 , H01L23/3128 , H01L23/3142 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/105 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13099 , H01L2224/14181 , H01L2224/16112 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/17051 , H01L2224/17181 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49 , H01L2224/73257 , H01L2224/73265 , H01L2224/81192 , H01L2224/97 , H01L2225/06506 , H01L2225/06513 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01064 , H01L2924/01077 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
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