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公开(公告)号：US11503748B2
公开(公告)日：2022-11-15
申请号：US17166248
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Dongku Kang , Jihong Kim , Min Park , Yunjeong Park , Kyuhwan Lee , Jinhwan Jung , Ahreum Hwang , Kyungha Koo
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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公开(公告)号：US11202363B2
公开(公告)日：2021-12-14
申请号：US16795223
申请日：2020-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hongki Moon , Yoonsun Park , Seunghoon Kang , Kyungha Koo , Hajoong Yun , Seungjoo Lee , Yeonjoo Lee , Seyoung Jang
Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.
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公开(公告)号：US10938239B2
公开(公告)日：2021-03-02
申请号：US16371690
申请日：2019-04-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kihyun Kim , Kyungha Koo , Wooram Lee , Changhyung Lee , Jihye Kim , Jihong Kim , Yunjeong Noh , Seho Park , Kumjong Sun , Ju-Hyang Lee , Mincheol Ha , Sangmoo Hwangbo
Abstract: An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
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公开(公告)号：US10785887B2
公开(公告)日：2020-09-22
申请号：US15938192
申请日：2018-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan Jeong , Kyungha Koo , Kiyoun Jang , Se-Young Jang , Han-Shil Choi
Abstract: According to various embodiments an electronic device may include a first housing comprising a hollow portion configured to receive an external electronic device, and a second housing disposed at an angle defined by a portion coupled with at least part of the hollow portion. The second housing may include a first cover facing at least part of the hollow portion and comprising a plurality of first openings, a second cover received in the first cover and comprising a plurality of second openings, and an electric fan motor disposed in a space between the first cover and the second cover, the electric fan motor configured to discharge at least part of intake air from at least some of the first openings to at least some of the second openings.
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公开(公告)号：US12250798B2
公开(公告)日：2025-03-11
申请号：US17975169
申请日：2022-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haein Chung , Kyungha Koo , Kangsik Kim , Wonmin Kim
Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.
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Patent Agency Ranking
公开(公告)号：US11910516B2
公开(公告)日：2024-02-20
申请号：US17293280
申请日：2019-11-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki Moon , Yoonsun Park , Seunghoon Kang , Kyungha Koo , Seyoung Jang , Woojune Jung
CPC classification number: H05K1/0203 , H05K1/14 , H05K7/20336 , H05K2201/064 , H05K2201/10098
Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
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公开(公告)号：US11871541B2
公开(公告)日：2024-01-09
申请号：US17673099
申请日：2022-02-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki Moon , Kyungha Koo , Yoonsun Park , Youngjae You , Hyunjoo Lee , Joseph Ahn
IPC: H05K7/20
CPC classification number: H05K7/20327 , H05K7/2099 , H05K7/20336 , H05K7/20963
Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.
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公开(公告)号：US11800688B2
公开(公告)日：2023-10-24
申请号：US17289285
申请日：2019-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haein Chung , Kyungha Koo , Seungjae Bae , Hyunjoong Yoon , Jaeho Chung , Yongwon Cho
CPC classification number: H05K7/20509 , G06F1/203 , H05K7/20336
Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.
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公开(公告)号：US11520387B2
公开(公告)日：2022-12-06
申请号：US15734060
申请日：2020-09-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungha Koo , Kuntak Kim , Hajoong Yun , Seungjoo Lee , Seyoung Jang , Hyuntae Jang
Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.
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30.发明授权公开(公告)号：US11497141B2
公开(公告)日：2022-11-08
申请号：US16577835
申请日：2019-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungha Koo , Kuntak Kim , Jihong Kim , Hongki Moon , Hajoong Yun , Haejin Lee , Seyoung Jang
Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
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