摘要:
A surface emitting device using a photonic crystal includes: a two-dimensional slab type photonic crystal structure including a first dielectric layer and a second dielectric layer formed on top of the first dielectric layer wherein a plurality of air holes in a two-dimensional lattice pattern are formed on the surface of the second dielectric layer; a light-emitting material layer formed on the inner wall of the air holes; and optical pumping means for irradiating the lateral surface of the photonic crystal structure with light. The surface emitting device shows improved surface emission efficiency and can advantageously emit light close to monochromatic light. Therefore, the surface emitting device can be used to manufacture a surface emitting laser. A method for fabricating the surface emitting device is also disclosed.
摘要:
Methods for producing nanoparticle thin films are disclosed. According to one of the methods, a nanoparticle thin film is produced by modifying the surface of nanoparticles to allow the nanoparticles to be charged, controlling an electrostatic attractive force between the charged nanoparticles and a substrate and a repulsive force between the individual nanoparticles by a variation in pH to control the number density of the nanoparticles arranged on the substrate.
摘要:
An optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube, and a plurality of optical semiconductor modules arranged along a circumference of the light-transmitting tube and separated from each other in a cross-sectional view of the light-transmitting tube. Each of the optical semiconductor modules is placed on a point, which is not on a central axis line of light emitted from other optical semiconductor modules, so as not to face another optical semiconductor module at an opposite side thereof.
摘要:
Disclosed is a device for reducing a user-sensed weight of a wireless vacuum cleaner including a suctioning pipe and a suction motor disposed on a top of the suctioning pipe, the device comprising: a case disposed adjacent to the suction motor and having a space defined therein, and a rotatable assembly received in the space, wherein the rotatable assembly receives therein a motor and a battery, wherein the rotatable assembly is configured to rotate clockwise or counter-clockwise when the motor is activated.
摘要:
A light-emitting device including a semiconductor nanocrystal layer and a method for producing the light-emitting device are provided. The light-emitting device includes a semiconductor nanocrystal layer whose voids are filled with a filling material. According to the light-emitting device, since voids formed between nanocrystal particles of the semiconductor nanocrystal layer are filled with a filling material, the occurrence of a current leakage through the voids is minimized, which enables the device to have extended service life, high luminescence efficiency, and improved stability.
摘要:
An optical semiconductor lighting apparatus having at least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit supplies a DC voltage to the light emitting module to control the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit.
摘要:
Embodiments of the invention provide an optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube; a linear slit formed on the light-transmitting tube in a longitudinal direction thereof; and at least one bar-shaped optical semiconductor module secured to the light-transmitting tube, with edges of the slit fitted into side surfaces of the bar-shaped optical semiconductor module. Here, the optical semiconductor module includes a heat sink, a PCB attached to the heat sink, and an array of semiconductor optical devices arranged on the PCB. The heat sink is partially exposed from the light-transmitting tube through the slit.
摘要:
Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board.
摘要:
A photovoltaic cell substrate and a method of manufacturing the same. The photovoltaic cell substrate includes a transparent substrate and a transparent conductive film. The transparent conductive film includes zinc oxide (ZnO) which is doped with a dopant and is formed over the transparent substrate. A surface charge activated layer is formed on a surface of the transparent conductive film by Rapid-Thermal-Annealing.
摘要:
Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press; and forming a fixed abrasive pad using the roller or press, The fixed abrasive pad has a plurality of polishing portions, each having a different real contact area. Especially, the fixed abrasive pad can comprise a low-density polishing portion having a real contact area less than 20% and a high-density polishing portion having a real contact area of 20%˜50%.