SURFACE EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME
    21.
    发明申请
    SURFACE EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    表面发射装置及其制造方法

    公开(公告)号:US20070237479A1

    公开(公告)日:2007-10-11

    申请号:US11567975

    申请日:2006-12-07

    IPC分类号: G02B6/10

    摘要: A surface emitting device using a photonic crystal includes: a two-dimensional slab type photonic crystal structure including a first dielectric layer and a second dielectric layer formed on top of the first dielectric layer wherein a plurality of air holes in a two-dimensional lattice pattern are formed on the surface of the second dielectric layer; a light-emitting material layer formed on the inner wall of the air holes; and optical pumping means for irradiating the lateral surface of the photonic crystal structure with light. The surface emitting device shows improved surface emission efficiency and can advantageously emit light close to monochromatic light. Therefore, the surface emitting device can be used to manufacture a surface emitting laser. A method for fabricating the surface emitting device is also disclosed.

    摘要翻译: 使用光子晶体的表面发射器件包括:二维平板型光子晶体结构,其包括形成在第一电介质层的顶部上的第一电介质层和第二电介质层,其中以二维晶格图案形成多个气孔 形成在第二电介质层的表面上; 形成在所述气孔内壁上的发光材料层; 以及用于用光照射光子晶体结构的侧表面的光泵装置。 表面发射器件显示出改进的表面发射效率,并且可以有利地发射接近单色光的光。 因此,表面发射器件可用于制造表面发射激光器。 还公开了一种用于制造表面发射器件的方法。

    OPTICAL SEMICONDUCTOR-BASED TUBE TYPE LIGHTING APPARATUS
    23.
    发明申请
    OPTICAL SEMICONDUCTOR-BASED TUBE TYPE LIGHTING APPARATUS 审中-公开
    基于半导体的管型照明设备

    公开(公告)号:US20120320571A1

    公开(公告)日:2012-12-20

    申请号:US13590927

    申请日:2012-08-21

    摘要: An optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube, and a plurality of optical semiconductor modules arranged along a circumference of the light-transmitting tube and separated from each other in a cross-sectional view of the light-transmitting tube. Each of the optical semiconductor modules is placed on a point, which is not on a central axis line of light emitted from other optical semiconductor modules, so as not to face another optical semiconductor module at an opposite side thereof.

    摘要翻译: 一种能够扩大光分布以提高组装特性的光半导体管式照明装置。 照明装置包括细长的透光管和沿着透光管的圆周布置并且在透光管的横截面图中彼此分离的多个光学半导体模块。 每个光学半导体模块被放置在不在与其它光学半导体模块发射的光的中心轴线上的点上,以便不面对在其相反侧的另一个光学半导体模块。

    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS
    26.
    发明申请
    OPTICAL SEMICONDUCTOR LIGHTING APPARATUS 审中-公开
    光学半导体照明设备

    公开(公告)号:US20130170209A1

    公开(公告)日:2013-07-04

    申请号:US13601277

    申请日:2012-08-31

    IPC分类号: F21V21/00

    摘要: An optical semiconductor lighting apparatus having at least one or more clamping units are formed along a longitudinal direction of a race way. A first sealing unit finishes both ends of a housing attached to or detached from the clamping unit. A second sealing unit surrounds upper and lower portions of both edges of an optical member disposed on the bottom surface of the housing. A wireless communication unit receives a dimming signal through a wireless communication network, and outputs the received dimming signal to a power supply unit. The power supply unit supplies a DC voltage to the light emitting module to control the illuminance of the light emitting module according to the dimming signal input from the wireless communication unit.

    摘要翻译: 沿着跑道的纵向方向形成具有至少一个或多个夹紧单元的光学半导体照明装置。 第一密封单元完成附接到夹紧单元或从夹紧单元拆卸的壳体的两端。 第二密封单元围绕设置在壳体的底表面上的光学构件的两个边缘的上部和下部。 无线通信单元通过无线通信网络接收调光信号,并将接收到的调光信号输出到电源单元。 电源单元向发光模块提供直流电压,以根据从无线通信单元输入的调光信号来控制发光模块的照度。

    OPTICAL SEMICONDUCTOR-BASED TUBE TYPE LIGHTING APPARATUS
    27.
    发明申请
    OPTICAL SEMICONDUCTOR-BASED TUBE TYPE LIGHTING APPARATUS 审中-公开
    基于半导体的管型照明设备

    公开(公告)号:US20120314409A1

    公开(公告)日:2012-12-13

    申请号:US13590943

    申请日:2012-08-21

    IPC分类号: F21V29/00 H01L21/00

    摘要: Embodiments of the invention provide an optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube; a linear slit formed on the light-transmitting tube in a longitudinal direction thereof; and at least one bar-shaped optical semiconductor module secured to the light-transmitting tube, with edges of the slit fitted into side surfaces of the bar-shaped optical semiconductor module. Here, the optical semiconductor module includes a heat sink, a PCB attached to the heat sink, and an array of semiconductor optical devices arranged on the PCB. The heat sink is partially exposed from the light-transmitting tube through the slit.

    摘要翻译: 本发明的实施例提供了一种能够扩大光分布以提高组装特性的基于光学半导体的管式照明装置。 照明装置包括细长的透光管; 在所述透光管上沿其长度方向形成的线状狭缝; 以及固定到透光管的至少一个条形光学半导体模块,其中狭缝的边缘装配在条形光学半导体模块的侧表面中。 这里,光学半导体模块包括散热器,附接到散热器的PCB以及布置在PCB上的半导体光学器件的阵列。 散热器通过狭缝从透光管部分露出。

    LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME
    28.
    发明申请
    LED MODULE, METHOD FOR MANUFACTURING THE SAME, AND LED CHANNEL LETTER INCLUDING THE SAME 有权
    LED模块,其制造方法和包括其的LED通道信号

    公开(公告)号:US20120228649A1

    公开(公告)日:2012-09-13

    申请号:US13416540

    申请日:2012-03-09

    摘要: Disclosed herein is a method for manufacturing a light emitting diode (LED) module, the method including: disposing a circuit board at a molding space formed by an upper mold and a lower mold; adding a filling material to the molding space; hardening the filling material to form a molding cover covering at least a portion of an upper surface, a lower surface, and a side surface of the circuit board, the molding cover having an opening exposing the lower surface of the circuit board; removing the upper mold and the lower mold from the circuit board; and disposing an LED on the upper surface of the circuit board.

    摘要翻译: 本发明公开了一种制造发光二极管(LED)模块的方法,该方法包括:将电路板设置在由上模和下模形成的模制空间中; 向成型空间添加填充材料; 硬化填充材料以形成覆盖电路板的上表面,下表面和侧表面的至少一部分的模制盖,模制盖具有暴露电路板的下表面的开口; 从电路板上拆下上模和下模; 以及在所述电路板的上表面上配置LED。

    Photovoltaic Cell Substrate And Method Of Manufacturing The Same
    29.
    发明申请
    Photovoltaic Cell Substrate And Method Of Manufacturing The Same 审中-公开
    光伏电池基板及其制造方法

    公开(公告)号:US20110023959A1

    公开(公告)日:2011-02-03

    申请号:US12844291

    申请日:2010-07-27

    IPC分类号: H01L31/0224 H01L31/18

    摘要: A photovoltaic cell substrate and a method of manufacturing the same. The photovoltaic cell substrate includes a transparent substrate and a transparent conductive film. The transparent conductive film includes zinc oxide (ZnO) which is doped with a dopant and is formed over the transparent substrate. A surface charge activated layer is formed on a surface of the transparent conductive film by Rapid-Thermal-Annealing.

    摘要翻译: 光伏电池基板及其制造方法。 光伏电池基板包括透明基板和透明导电膜。 透明导电膜包括掺杂有掺杂剂并形成在透明基板上的氧化锌(ZnO)。 通过快速热退火在透明导电膜的表面上形成表面电荷活化层。

    Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof
    30.
    发明申请
    Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof 审中-公开
    具有不同实际接触面积的固定磨料垫及其制造方法

    公开(公告)号:US20090130958A1

    公开(公告)日:2009-05-21

    申请号:US12356499

    申请日:2009-01-20

    申请人: Jae Young CHOI

    发明人: Jae Young CHOI

    IPC分类号: B24B1/00 B24D11/04 B24B7/20

    CPC分类号: B24D11/001

    摘要: Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press; and forming a fixed abrasive pad using the roller or press, The fixed abrasive pad has a plurality of polishing portions, each having a different real contact area. Especially, the fixed abrasive pad can comprise a low-density polishing portion having a real contact area less than 20% and a high-density polishing portion having a real contact area of 20%˜50%.

    摘要翻译: 公开了一种使用化学机械抛光工艺制造固定磨料垫的方法。 该方法包括:形成提供多个不同实际接触区域的一个或多个蚀刻模具; 将蚀刻模具附接到辊或压机; 并使用辊或压力机形成固定的研磨垫。固定研磨垫具有多个抛光部分,每个抛光部分具有不同的实际接触面积。 特别地,固定研磨垫可以包括实际接触面积小于20%的低密度抛光部分和实际接触面积为20%〜50%的高密度研磨部分。