公开(公告)号：US20070143509A1

公开(公告)日：2007-06-21

申请号：US11309842

申请日：2006-10-11

申请人： Jim Ni ,  Abraham Ma ,  Edward Lee ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Edward Lee ,  Ming-Shiang Shen

IPC分类号： G06F13/00

CPC分类号： H01R13/6658 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G07C9/00087 ,  H01R13/7175 ,  H05K5/0278

摘要： A Universal-Serial-Bus (USB) device has a USB plug that is centered over a center-line of a circuit board. The circuit board with flash memory and a USB flash controller has metal pads that a USB connector is soldered to. The USB connector has a rear step that is about half the height of the USB connector plug. Contacts on the rear step are soldered to the metal pads on the circuit board so that the USB connector is centered around the edge of the circuit board. The overall height of the flash device can be reduced since the bulky USB connector is not attached off-center to the circuit board, but is attached at the half-height rear step. Both the USB connector and the circuit board share the same center line, allowing a printed-circuit board assembly (PCBA) to be symmetric around the center line.

摘要翻译： 通用串行总线（USB）设备具有以电路板中心线为中心的USB插头。 具有闪存的电路板和USB闪存控制器具有焊接USB连接器的金属焊盘。 USB连接器的后部步骤大约是USB连接器插头高度的一半。 后台上的触点焊接到电路板上的金属焊盘，使得USB连接器围绕电路板的边缘居中。 由于笨重的USB连接器不会偏离电路板的中心位置，而是在半高后方的步骤安装，因此闪光装置的整体高度可以减小。 USB连接器和电路板共享相同的中心线，允许印刷电路板组件（PCBA）围绕中心线对称。

公开(公告)号：US07264992B2

公开(公告)日：2007-09-04

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术来制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07941916B1

公开(公告)日：2011-05-17

申请号：US10888282

申请日：2004-07-08

申请人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/10159 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85 ,  H01L2924/00

摘要： A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.

摘要翻译： 一种便携式存储卡，包括形成在存储装置上的模制塑料外壳和安装在基板上的其它电路，使得模制材料在基板的侧边缘上延伸以提供精确的宽度和厚度尺寸。 接触垫形成在PCBA基板的下表面上，该PCBA基板通过壳体的底部露出。 PCBA制造在基板载体上，然后定位在模具组件内部。 在模制过程中，杆从模具组件的上部延伸并推动衬底抵靠下表面。 然后施加真空以将衬底保持在模具的下表面上，并且随后在注射熔融成型材料期间将棒从模腔中取出。 单腔模具组件提供了在存储卡的前后边缘上延伸的成型材料。

公开(公告)号：US07433196B1

公开(公告)日：2008-10-07

申请号：US10825713

申请日：2004-04-14

申请人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

发明人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

IPC分类号： H05K5/00

CPC分类号： H05K5/026 ,  B29C65/08 ,  B29C66/1142 ,  B29C66/124 ,  B29C66/131 ,  B29C66/3022 ,  B29C66/30223 ,  B29C66/5414 ,  B29C66/545 ,  B29L2017/00 ,  B29L2017/006

摘要： A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

摘要翻译： 在通过使用超声波接合形成的内部接缝处结合在一起的上盖和下盖形成诸如SD卡，CF卡，记忆棒卡或USB闪存驱动器的卡式电子设备。 下盖上的下侧壁形成上盖的安装口。 安装袋不仅简化了上盖和下盖之间的对准，而且还包含任何可能会影响设备外壳尺寸的粘合剂材料溢出。 下侧壁可以完全围绕上盖，以便安装。 或者，下侧壁可以部分地围绕上盖，使得在组装期间上盖可以滑入到位。

公开(公告)号：US07235423B1

公开(公告)日：2007-06-26

申请号：US10982216

申请日：2004-11-05

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H01L21/98

CPC分类号： H01L21/561 ,  H01L23/49855 ,  H01L25/0655 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0169 ,  H05K2203/1316 ,  H01L2924/00

摘要： Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.

摘要翻译： 塑料外壳同时模制在以紧密间隔布置的方式连接到载体上的多个PCBA上。 每个PCBA的所有边缘具有延伸通过形成在相关联的模具组件中的凹槽的整体连接段，并且当模具组件闭合时，在模制过程期间将PCBA精确地并且可靠地定位在相关联的空腔内时被夹紧。 在一个实施例中，PCB基板被定位成弯曲的布置以适应便宜的存储器件的使用。 提供写保护开关。

公开(公告)号：US07174628B1

公开(公告)日：2007-02-13

申请号：US11071289

申请日：2005-03-03

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H05K1/117 ,  H05K3/0058 ,  H05K2201/10159 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

摘要： Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.

摘要翻译： 使用一个或多个预制盖部分和模制外壳部分来生产安全数字（SD）型存储卡。 通过将印刷电路板组件（PCBA）安装到盖部分上使得PCBA的接触垫通过盖中限定的相关窗户暴露而形成子组件。 将子组件放置在形成在模具组件中的空腔中，然后使用已知的注塑技术将熔融的热塑性材料在热和压力下注入模具组件的每个空腔中，从而形成固定PCBA的模制塑料外壳部分 到盖子并完成存储卡外壳。

公开(公告)号：US20060030080A1

公开(公告)日：2006-02-09

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07407390B1

公开(公告)日：2008-08-05

申请号：US11379736

申请日：2006-04-21

申请人： Jim Ni

发明人： Jim Ni

IPC分类号： H01R12/00

CPC分类号： H01R13/50 ,  G06K19/07732 ,  G06K19/07743 ,  H01R13/6658 ,  Y10S439/906

摘要： A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a plastic housing molded from a hard plastic (e.g., PC), and includes a handle portion mounted over a body section of the PCBA, and a plug support portion that is snap-coupled onto the housing and disposed under a plug section of the PCBA. The plug shell portion of the housing is integrally connected to (i.e., molded at the same time as or connected by way of molding to) the handle portion, and combines with the plug support structure extending under the plug section of the PCBA to form a structural arrangement similar to a conventional male USB connector plug that allows access to metal contacts formed on the PCBA, but without having the plug shell soldered to the PCBA.

摘要翻译： 通用串行总线（USB）装置包括安装在由硬塑料（例如，PC）模制的塑料外壳内的PCBA），并且包括安装在PCBA的主体部分上的手柄部分，以及插头支撑部分 卡扣耦合到壳体上并且布置在PCBA的插塞部分下方。 壳体的插头外壳部分（即，通过模制的同时成型或与其成型连接）一体地连接到手柄部分，并且与在PCBA的插塞部分下方延伸的插头支撑结构组合，以形成 结构布置类似于常规的公USB连接器插头，其允许访问形成在PCBA上的金属触点，但是没有将插头壳体焊接到PCBA。

公开(公告)号：US07004794B2

公开(公告)日：2006-02-28

申请号：US10917672

申请日：2004-08-13

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

IPC分类号： H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62

摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.

摘要翻译： 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。

公开(公告)号：US20050070138A1

公开(公告)日：2005-03-31

申请号：US10904529

申请日：2004-11-15

申请人： Ren-Kang Chiou ,  Jim Ni

发明人： Ren-Kang Chiou ,  Jim Ni

IPC分类号： H01L23/28 ,  H01R12/00 ,  H01R13/627 ,  H01R13/717 ,  H01R24/00 ,  H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R13/717 ,  H01R13/7175 ,  H01R24/62

摘要： A two-piece flash-memory-drive card has an integrated slim Universal-Serial-Bus (USB) connector that fits into a standard USB socket. The slim USB connector has 4 metal contacts on a board that is encapsulated by a lower plastic case but no upper plastic case. Components are mounted onto the board on the side opposite the metal contacts and are covered by the lower plastic case. A thinner portion of the plastic case forms a light window that allows a light-emitting diode on the board to shine through the case. The lower plastic case is bonded to the board with adhesive or using snaps. Supporting underside ribs in the lower plastic case opposite the metal contacts allow most of the card to be thinner than the space inside the standard USB socket.

摘要翻译： 两片闪存驱动器卡具有集成的超薄通用串行总线（USB）连接器，适合标准USB插座。 超薄的USB连接器在板上有4个金属触点，由一个较低的塑料外壳封装，但没有上塑料外壳。 组件安装在与金属触点相对的一侧的板上，并被下部塑料外壳覆盖。 塑料外壳的较薄部分形成一个光窗，允许板上的发光二极管照射在外壳上。 较低的塑料外壳用粘合剂或使用卡扣粘合到板上。 与金属触点相对的下部塑料外壳中的支撑下侧肋允许大多数卡片比标准USB插座内的空间更薄。