公开(公告)号：US07264992B2

公开(公告)日：2007-09-04

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术来制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07941916B1

公开(公告)日：2011-05-17

申请号：US10888282

申请日：2004-07-08

申请人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/10159 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85 ,  H01L2924/00

摘要： A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.

摘要翻译： 一种便携式存储卡，包括形成在存储装置上的模制塑料外壳和安装在基板上的其它电路，使得模制材料在基板的侧边缘上延伸以提供精确的宽度和厚度尺寸。 接触垫形成在PCBA基板的下表面上，该PCBA基板通过壳体的底部露出。 PCBA制造在基板载体上，然后定位在模具组件内部。 在模制过程中，杆从模具组件的上部延伸并推动衬底抵靠下表面。 然后施加真空以将衬底保持在模具的下表面上，并且随后在注射熔融成型材料期间将棒从模腔中取出。 单腔模具组件提供了在存储卡的前后边缘上延伸的成型材料。

公开(公告)号：US07433196B1

公开(公告)日：2008-10-07

申请号：US10825713

申请日：2004-04-14

申请人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

发明人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

IPC分类号： H05K5/00

CPC分类号： H05K5/026 ,  B29C65/08 ,  B29C66/1142 ,  B29C66/124 ,  B29C66/131 ,  B29C66/3022 ,  B29C66/30223 ,  B29C66/5414 ,  B29C66/545 ,  B29L2017/00 ,  B29L2017/006

摘要： A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

摘要翻译： 在通过使用超声波接合形成的内部接缝处结合在一起的上盖和下盖形成诸如SD卡，CF卡，记忆棒卡或USB闪存驱动器的卡式电子设备。 下盖上的下侧壁形成上盖的安装口。 安装袋不仅简化了上盖和下盖之间的对准，而且还包含任何可能会影响设备外壳尺寸的粘合剂材料溢出。 下侧壁可以完全围绕上盖，以便安装。 或者，下侧壁可以部分地围绕上盖，使得在组装期间上盖可以滑入到位。

公开(公告)号：US07235423B1

公开(公告)日：2007-06-26

申请号：US10982216

申请日：2004-11-05

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H01L21/98

CPC分类号： H01L21/561 ,  H01L23/49855 ,  H01L25/0655 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0169 ,  H05K2203/1316 ,  H01L2924/00

摘要： Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.

摘要翻译： 塑料外壳同时模制在以紧密间隔布置的方式连接到载体上的多个PCBA上。 每个PCBA的所有边缘具有延伸通过形成在相关联的模具组件中的凹槽的整体连接段，并且当模具组件闭合时，在模制过程期间将PCBA精确地并且可靠地定位在相关联的空腔内时被夹紧。 在一个实施例中，PCB基板被定位成弯曲的布置以适应便宜的存储器件的使用。 提供写保护开关。

公开(公告)号：US07174628B1

公开(公告)日：2007-02-13

申请号：US11071289

申请日：2005-03-03

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H05K1/117 ,  H05K3/0058 ,  H05K2201/10159 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

摘要： Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.

摘要翻译： 使用一个或多个预制盖部分和模制外壳部分来生产安全数字（SD）型存储卡。 通过将印刷电路板组件（PCBA）安装到盖部分上使得PCBA的接触垫通过盖中限定的相关窗户暴露而形成子组件。 将子组件放置在形成在模具组件中的空腔中，然后使用已知的注塑技术将熔融的热塑性材料在热和压力下注入模具组件的每个空腔中，从而形成固定PCBA的模制塑料外壳部分 到盖子并完成存储卡外壳。

公开(公告)号：US20060030080A1

公开(公告)日：2006-02-09

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US20080003882A1

公开(公告)日：2008-01-03

申请号：US11846725

申请日：2007-08-29

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01R13/66

CPC分类号： G06K19/07743 ,  A45C2011/188 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/077 ,  G06K19/07732 ,  G07C9/00087 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB. A user-slidable switch may be slanted to compensate for the PCB slant. The PCB may have a flex section to facilitate the slant without a slanted switch.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以便为安装在PCB底部表面的芯片提供更大的厚度。 用户可滑动的开关可以倾斜以补偿PCB倾斜。 PCB可以具有弯曲部分以便于倾斜而没有倾斜的开关。

公开(公告)号：US20070130414A1

公开(公告)日：2007-06-07

申请号：US11309844

申请日：2006-10-11

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： G06F12/00

CPC分类号： G06K19/077 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/07732 ,  G07C9/00087 ,  Y02D10/13

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an input/output interface circuit to an external computer over a Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Supporting end ribs under each of the SD contact pads and middle ribs support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括通过安全数字（SD）接口连接到外部计算机的输入/输出接口电路，以及从闪速存储器芯片读取数据块的处理单元。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 在每个SD接触垫和中肋下的支撑端肋以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜，以允许安装在PCB底部表面的芯片的厚度更大，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。

公开(公告)号：US20080003883A1

公开(公告)日：2008-01-03

申请号：US11846733

申请日：2007-08-29

申请人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

发明人： Jim Ni ,  Abraham Ma ,  Paul Hsueh ,  Ming-Shiang Shen

IPC分类号： H01R13/66

CPC分类号： G06K19/07743 ,  A45C2011/188 ,  G06F12/1416 ,  G06F21/32 ,  G06F21/78 ,  G06K9/00087 ,  G06K19/07 ,  G06K19/07354 ,  G06K19/077 ,  G06K19/07732 ,  G07C9/00087 ,  H05K1/117 ,  H05K1/118 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/091 ,  H05K2201/10159 ,  H05K2203/1527

摘要： A flash-memory device has a printed-circuit board assembly (PCBA) with a PCB with a flash-memory chip and a controller chip. The controller chip includes an external Secure-Digital (SD) interface, and a processing unit to read blocks of data from the flash-memory chip. The PCBA is encased inside an upper case and a lower case, with SD contact pads on the PCB that fit through contact openings in the upper case. Dividers between openings in the upper case that expose the SD contact pads also support the PCB at a slanted angle to the centerline of the device. The PCB slants upward at the far end to allow more thickness for the chips mounted to the bottom surface of the PCB, and slants downward at the insertion end to position the SD contact pads near the centerline. A metal switch-bar or an over-molded controller die may be substituted.

摘要翻译： 闪存设备具有印刷电路板组件（PCBA），PCB组件具有闪存芯片和控制器芯片。 控制器芯片包括一个外部安全数字（SD）接口，以及一个处理单元，用于从闪存芯片中读取数据块。 PCBA被封装在上壳体和下壳体内，PCB上的SD接触垫通过上壳体中的接触开口配合。 暴露SD接触垫的上壳体中的开口之间的分隔线也以与设备中心线倾斜的角度支撑PCB。 PCB在远端向上倾斜以允许安装到PCB的底表面的芯片具有更大的厚度，并且在插入端向下倾斜以将SD接触垫定位在中心线附近。 金属开关杆或过模制的控制器管芯可以被替代。

公开(公告)号：US20080006927A1

公开(公告)日：2008-01-10

申请号：US11831888

申请日：2007-07-31

申请人： Siew Hiew ,  Jim Ni ,  Paul Hsueh ,  Charles Lee ,  Ming-Shiang Shen

发明人： Siew Hiew ,  Jim Ni ,  Paul Hsueh ,  Charles Lee ,  Ming-Shiang Shen

IPC分类号： H01L23/488 ,  H01L21/52

CPC分类号： H05K3/284 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/117 ,  H05K2201/09936 ,  H05K2201/10159 ,  Y10T29/49126 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.

摘要翻译： MMC / SD核心单元包括PCBA，其中所有无源组件和未封装的IC芯片附接到与金属触点相对的PCB的单侧。 IC芯片例如包括控制器芯片和闪存芯片，或单芯片（组合的控制器/闪存）芯片。 可选择堆叠多个闪存IC芯片以增加存储容量。 IC芯片通过引线接合或其他芯片上（COB）芯片技术连接到PCB。 无源元件通过传统的表面贴装技术（SMT）技术连接起来。 然后在IC芯片和无源部件上形成模制外壳，使得该装置具有均匀的厚度。 然后将MMC / SD核心单元插入或以其他方式安装在永久壳体中以提供完成的MMC / SD设备。