公开(公告)号：US07264992B2

公开(公告)日：2007-09-04

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/498

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术来制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07941916B1

公开(公告)日：2011-05-17

申请号：US10888282

申请日：2004-07-08

申请人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Kuang-Yu Wang

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2201/10159 ,  H05K2203/0228 ,  H05K2203/0746 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2224/85 ,  H01L2924/00

摘要： A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.

摘要翻译： 一种便携式存储卡，包括形成在存储装置上的模制塑料外壳和安装在基板上的其它电路，使得模制材料在基板的侧边缘上延伸以提供精确的宽度和厚度尺寸。 接触垫形成在PCBA基板的下表面上，该PCBA基板通过壳体的底部露出。 PCBA制造在基板载体上，然后定位在模具组件内部。 在模制过程中，杆从模具组件的上部延伸并推动衬底抵靠下表面。 然后施加真空以将衬底保持在模具的下表面上，并且随后在注射熔融成型材料期间将棒从模腔中取出。 单腔模具组件提供了在存储卡的前后边缘上延伸的成型材料。

公开(公告)号：US07433196B1

公开(公告)日：2008-10-07

申请号：US10825713

申请日：2004-04-14

申请人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

发明人： Kuang-Yu Wang ,  Paul Hsueh ,  Jim Ni

IPC分类号： H05K5/00

CPC分类号： H05K5/026 ,  B29C65/08 ,  B29C66/1142 ,  B29C66/124 ,  B29C66/131 ,  B29C66/3022 ,  B29C66/30223 ,  B29C66/5414 ,  B29C66/545 ,  B29L2017/00 ,  B29L2017/006

摘要： A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.

摘要翻译： 在通过使用超声波接合形成的内部接缝处结合在一起的上盖和下盖形成诸如SD卡，CF卡，记忆棒卡或USB闪存驱动器的卡式电子设备。 下盖上的下侧壁形成上盖的安装口。 安装袋不仅简化了上盖和下盖之间的对准，而且还包含任何可能会影响设备外壳尺寸的粘合剂材料溢出。 下侧壁可以完全围绕上盖，以便安装。 或者，下侧壁可以部分地围绕上盖，使得在组装期间上盖可以滑入到位。

公开(公告)号：US07235423B1

公开(公告)日：2007-06-26

申请号：US10982216

申请日：2004-11-05

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H01L21/98

CPC分类号： H01L21/561 ,  H01L23/49855 ,  H01L25/0655 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0169 ,  H05K2203/1316 ,  H01L2924/00

摘要： Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.

摘要翻译： 塑料外壳同时模制在以紧密间隔布置的方式连接到载体上的多个PCBA上。 每个PCBA的所有边缘具有延伸通过形成在相关联的模具组件中的凹槽的整体连接段，并且当模具组件闭合时，在模制过程期间将PCBA精确地并且可靠地定位在相关联的空腔内时被夹紧。 在一个实施例中，PCB基板被定位成弯曲的布置以适应便宜的存储器件的使用。 提供写保护开关。

公开(公告)号：US07174628B1

公开(公告)日：2007-02-13

申请号：US11071289

申请日：2005-03-03

申请人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Paul Hsueh ,  Ren-Kang Chiou

IPC分类号： H05K3/30

CPC分类号： H05K3/284 ,  H05K1/117 ,  H05K3/0058 ,  H05K2201/10159 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

摘要： Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.

摘要翻译： 使用一个或多个预制盖部分和模制外壳部分来生产安全数字（SD）型存储卡。 通过将印刷电路板组件（PCBA）安装到盖部分上使得PCBA的接触垫通过盖中限定的相关窗户暴露而形成子组件。 将子组件放置在形成在模具组件中的空腔中，然后使用已知的注塑技术将熔融的热塑性材料在热和压力下注入模具组件的每个空腔中，从而形成固定PCBA的模制塑料外壳部分 到盖子并完成存储卡外壳。

公开(公告)号：US20060030080A1

公开(公告)日：2006-02-09

申请号：US10913868

申请日：2004-08-06

申请人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

发明人： Paul Hsueh ,  Jim Ni ,  Sun-Teck See ,  Kuang-Yu Wang

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： G11C5/04 ,  G11C2029/4402 ,  H01L23/5388 ,  H01L25/50 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10053 ,  H05K2201/10446 ,  H05K2203/1316 ,  H01L2924/00

摘要： A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.

摘要翻译： 可拆卸的Flash集成内存模块卡具有塑料外壳和集成闪存模块。 在卡的背面，有暴露的接触垫。 当卡插入卡主机设备时，卡可以通过暴露的焊盘与设备通信。 该制造方法包括制造存储器模块并利用塑料模制技术制造卡外壳。 该方法包括准备基板，安装部件，测试模块，准备模制装置和模制卡体。

公开(公告)号：US07004794B2

公开(公告)日：2006-02-28

申请号：US10917672

申请日：2004-08-13

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou ,  Edward W. Lee ,  Tzu-Yih Chu

IPC分类号： H01R33/00

CPC分类号： G06K19/07732 ,  G06K19/07733 ,  H01R24/62

摘要： A low-profile Universal-Serial-Bus (USB) connector includes a substantially flat base structure that is received in the lower section of a conventional female USB connector, and includes metal contacts formed on an upper surface of the base structure. Wobble or vertical play is reduced by rails extending along side edges of the base structure that are partially inserted into gaps formed between the metal case and base structure of the female USB connector. Between metal contacts on the low-profile USB connector are raised ribs (dividers) that prevent undesirable damage or contamination to the metal contacts. The connector base structure of the low-profile USB connector can be separate or can be integrated with a circuit board that holds a flash memory chip and a USB controller chip.

摘要翻译： 一种低调的通用串行总线（USB）连接器包括基本上平坦的基座结构，其被接收在传统的母USB连接器的下部，并且包括形成在基座结构的上表面上的金属触点。 摇摆或垂直播放通过沿底座结构的侧边缘延伸的轨道减少，该轨道部分地插入形成在母壳式USB连接器的金属外壳和基座结构之间的间隙中。 在薄型USB连接器上的金属触点之间是凸肋（分隔线），可防止不必要的金属触点损坏或污染。 低调USB连接器的连接器基座结构可以是独立的，也可以与保存闪存芯片和USB控制器芯片的电路板集成。

公开(公告)号：US07215551B2

公开(公告)日：2007-05-08

申请号：US10956893

申请日：2004-09-29

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/42 ,  H01L23/3672 ,  H01L25/105 ,  H01L2924/0002 ,  H05K7/20509 ,  H01L2924/00

摘要： A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

摘要翻译： 存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。 粘合剂是热活化或热固化的。 将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。 然后将夹具通过烘箱以激活/固化粘合剂。

公开(公告)号：US20060067054A1

公开(公告)日：2006-03-30

申请号：US10956893

申请日：2004-09-29

申请人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou

发明人： Kuang-Yu Wang ,  Jim Ni ,  Ren-Kang Chiou

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/3672 ,  H01L25/105 ,  H01L2924/0002 ,  H05K7/20509 ,  H01L2924/00

摘要： A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive.

摘要翻译： 存储器模块组件包括通过粘合剂连接到存储器模块PCBA的一个或多个集成电路（例如，存储器件）的双板散热器。 粘合剂是热活化或热固化的。 将粘合剂施加到存储器件或散热板上，然后使用夹具在散热板和存储器模块之间进行压缩。 然后将夹具通过烘箱以激活/固化粘合剂。

公开(公告)号：US20050279838A1

公开(公告)日：2005-12-22

申请号：US10871741

申请日：2004-06-18

申请人： Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

发明人： Kuang-Yu Wang ,  Jim Ni ,  Sun-Teck See

IPC分类号： G06K19/06 ,  G06K19/077 ,  H05K1/11

CPC分类号： G06K19/07732 ,  G06K19/077 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09954

摘要： A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.

摘要翻译： 包括与现有13焊盘MMC机械外形尺寸一致的PCB组件的存储卡，以及与SD机械外形尺寸一致的外壳，从而提供单个PCBA和外壳布置，可用于生产MMC和 SD存储卡。 十三个接触垫支持所有MMC和SD接触焊盘图案，但是被修改以便于写保护开关。 壳体包括在多行中的每一行中暴露两个或更多个接触垫的放大窗口（或窗户），从而有助于存储卡可滑动地插入到主机系统的插座中。 对准凹口形成在PCB的侧边缘中，和/或对准销用于使PCBA在壳体内正确对准。