摘要:
A test structure provides defect information rapidly and accurately. The test structure includes a plurality of lines provided in a parallel orientation, a decoder coupled to the plurality of lines for selecting one of the plurality of lines, and a sense amplifier coupled to the selected line. To analyze an open, a line in the test structure is coupled to the sense amplifier. A high input signal is provided to the line. To determine the resistance of the open, a plurality of reference voltages are then provided to the sense amplifier. A mathematical model of the resistance of the line based on the reference voltage provided to the sense amplifier is generated. Using this mathematical model, the test structure can quickly detect and characterize defect levels down to a few parts-per-million at minimal expense.
摘要:
An electrostatic discharge (ESD) protection circuit for an IC device including a triple-well SCR and a control circuit connected between the triple-well SCR and ground. The triple-well SCR is implemented using triple-well CMOS technology to facilitate connection of the control circuit by isolating both terminals of the triple-well SCR from ground. The control circuit includes a switch circuit, a capacitor, or a combination thereof, for controlling the holding voltage of the triple-well SCR. The switch circuit is closed during non-operation (i.e., before power is applied to the IC device protected by the SCR) so that electrostatic discharge (ESD) energy is transmitted to ground through the triple-well SCR. Similarly, the capacitor transmits ESD pulses to ground during ESD events. During normal operation of the IC device, the switch circuit is controlled by system voltage to remain open. In contrast, the capacitor is charged when a voltage pulse triggers the triple-well SCR during normal IC operation, thereby reliably switching off the triple-well SCR by decreasing the voltage across the SCR below the holding voltage.
摘要:
A pass gate circuit includes a pass transistor and a body bias control circuit for biasing the body of the pass transistor to reduce body effect. The body bias control circuit includes one or more control transistors arranged to selectively connect the substrate (body) of the pass transistor to the drain or gate of the pass transistor when predetermined voltages are applied to the drain and gate of the pass transistor. As a result, the pass transistor exhibits a reduced body effect in the on-state. In one embodiment, the body bias control circuit includes a first control transistor having a drain and gate connected to the gate of the pass transistor, a gate connected to the drain of the pass transistor, and a source. The body bias control circuit also includes a second control transistor having a drain connected to the source of the first control transistor, a source connected to a body of the pass transistor, and a gate connected to the drain of the pass transistor. The bodies of the pass transistor, first control transistor and second control transistor are electrically interconnected. With this arrangement, the body of the pass transistor is biased "high" by the gate of the pass transistor only when both the gate and drain of the pass transistor are at a high voltage level.
摘要:
A method and apparatus is provided for the implementation of a measurement and adjustment mechanism within a semiconductor die that facilitates adjustment of the magnitude of voltage generated by one or more voltage reference generation circuits on the die. In a first embodiment, the output voltage magnitude of a bandgap reference circuit may be measured and adjusted. In a second embodiment, the output voltage magnitude of a voltage regulator circuit may be measured and adjusted. Programmable circuit elements, such as programmable resistors, may first be programmed during a configuration event of the die to determine the optimal configuration settings of the one or more voltage reference generation circuits. The optimal configuration settings are then used to program the state of one or more eFuses to maintain the optimal configuration settings for the duration of the semiconductor die's lifetime.
摘要:
Described are dynamic memory cells for use in FPGAs. Each memory cell includes a dynamic memory element that occupies less chip area than conventional static memory elements and that can be implemented using standard CMOS processes. In one embodiment, a conventional access transistor is connected to a pass transistor via a CMOS inverter. The CMOS inverter includes a pair of complementary MOS transistors sharing a common gate connection, and therefore exhibiting a combined gate capacitance. This gate capacitance at the input of the inverter supplements or replaces the capacitor normally required in conventional dynamic memory cells. Another embodiment uses the parasitic gate capacitance of a pass transistor for dynamic data storage. This embodiment requires that the voltage levels on the source and drain of the pass transistor be controlled during write and refresh operations to ensure that the gate capacitance of pass transistor stores an appropriate level of charge.
摘要:
Non-volatile storage elements are provided on an integrated circuit, where the non-volatile storage elements are low voltage CMOS devices and hence compatible in a manufacturing sense with other similar transistors on an integrated circuit, thereby not requiring special types of transistors for the non-volatile storage. The non-volatile storage elements are either one-time programmable devices which are programmed by rupturing their gate oxide, EEPROM floating gate transistor cells, or other EEPROM cells.
摘要:
An integrated circuit including a voltage generator for generating a body bias voltage is described. The voltage generator includes a charge source and a voltage regulator coupled to the charge source. Transistors are coupled to the charge source to receive the body bias voltage from the voltage generator.
摘要:
During the development of process parameters for fabricating an integrated circuit, a test circuit is provided on the wafer that provides rapid identification of process problems. Open circuits are identified by sequentially connecting one end of the conductive paths to the signal source and measuring the current at the other end. Short circuits are identified by sequentially connecting first conductive paths to the signal source and measuring the current generated in the second conductive paths. The location of breaks in the first conductive paths is identified by systematically bypassing sections of the first conductive paths, thereby facilitating failure analysis.
摘要:
During the development of process parameters for fabricating an integrated circuit, a test circuit is provided on the wafer that provides rapid identification of process problems (i.e., before failure analysis), detects defects down to a part-per-million (PPM) level, and identifies the precise location of any defects, thereby facilitating rapid failure analysis during the development and refinement of IC fabrication processes used to fabricate an integrated circuit (IC). In a first embodiment, the test circuit includes parallel conductive paths that are selectively connected to a signal source by pass transistors. Open circuits are identified by sequentially connecting one end of the conductive paths to the signal source and measuring the current at the other end. In a second embodiment, the test circuit includes perpendicular sets of overlapping conductors. Short conductive segments extend in parallel with a first set of conductors that are electrically connected to a second set of conductors. Short circuits are identified by sequentially connecting the first conductive paths to the signal source and measuring the current generated in the second conductive paths. In a third embodiment, the test circuit includes perpendicular sets of overlapping conductors. Pairs of parallel first conductors are selectively connected by bypass circuits. The location of breaks in the first conductors is identified by systematically bypassing sections of the first conductors, thereby facilitating failure analysis.
摘要:
A non-volatile memory cell is provided that includes a low voltage CMOS storage transistor having a source region and a drain region that are commonly connected to ground. The low voltage storage transistor is programmed by applying a high programming voltage to its gate, thereby rupturing the gate oxide of the storage transistor. The high programming voltage is applied to the low voltage storage transistor through a high voltage p-channel transistor. The high voltage p-channel transistor has a thicker gate oxide than the storage transistor, thereby enabling the p-channel transistor to withstand higher voltages. The high voltage p-channel transistor also has a higher breakdown voltage than a high voltage n-channel transistor of the same size. Both the low voltage storage transistor and the high voltage p-channel transistor are fabricated in accordance with a standard sub 0.35 micron process. The state of the low voltage storage transistor can be read through the p-channel transistor, or through a dedicated high voltage n-channel transistor. In one embodiment, the programming voltage is generated by a charge pump circuit fabricated in accordance with a standard sub 0.35 micron process. In another embodiment, the decoder circuits that access the non-volatile memory cell use high voltage p-channel transistors to transmit the high programming voltage. Another embodiment of the present invention includes a system-on-a-chip structure that implements the non-volatile memory of the present invention.