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公开(公告)号：US20110070813A1
公开(公告)日：2011-03-24
申请号：US12992782
申请日：2009-06-02
CPC分类号： B24B37/32 , B24B37/042 , B24B37/24
摘要： A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.
摘要翻译： 一种用于制造具有环形刚性环的抛光头的方法; 橡胶膜与刚性环结合，张力均匀; 连接到刚性环的中间板，与橡胶膜和刚性环一起形成空间; 以及用于改变空间压力的机构，所述方法包括在将橡胶膜粘合到刚性环之前根据JIS K6251在橡胶膜上进行拉伸试验，并且选择值为10MPa以下的橡胶膜 通过在应变值5％内的应力 - 应变曲线的线性近似获得的倾斜度; 并将所述倾斜度为10MPa以下的所选橡胶膜与所述刚性环接合，制造所述研磨头。
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公开(公告)号：US20100210192A1
公开(公告)日：2010-08-19
申请号：US12682458
申请日：2007-11-20
IPC分类号： B24B7/00
CPC分类号： B24B37/30 , B24B41/002 , B24B57/02
摘要： The present invention is a polishing head having at least: an approximately discoid mid plate; a rubber film covering at least a lower face portion and a side face portion of the mid plate; and a space portion surrounded by the mid plate and the rubber film; in which pressure of the space portion can be changed by a pressure adjustment mechanism, a back surface of a workpiece is held on a lower face portion of the rubber film and a front surface of the workpiece is brought into sliding contact with a polishing pad attached onto a turn table for performing polishing; wherein the mid plate and the rubber film do not contact one another to have a gap at least throughout a whole of the lower face portion of the mid plate. As a result, there is provided a polishing head etc by a rubber chuck method in which a uniform polishing load is applied over the workpiece without influence of stiffness or flatness of the mid plate.
摘要翻译： 本发明是至少具有：近似盘状的中间板的抛光头; 覆盖所述中间板的至少下表面部分和侧面部分的橡胶膜; 以及由中间板和橡胶膜包围的空间部分; 其中空间部分的压力可以通过压力调节机构改变，工件的后表面被保持在橡胶膜的下表面部分上，并且工件的前表面与附接的抛光垫滑动接触 在转台上进行抛光; 其中中间板和橡胶膜彼此不接触以至少在整个中板的下表面部分中具有间隙。 结果，通过橡胶卡盘方法提供了抛光头等，其中在工件上施加均匀的研磨载荷而不影响中间板的刚度或平坦度。
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公开(公告)号：US06729941B2
公开(公告)日：2004-05-04
申请号：US09926731
申请日：2001-12-10
IPC分类号： B24B722
CPC分类号： H01L21/02008 , B24B37/042 , B24B37/24 , B24D3/28 , H01L21/02024
摘要： The present invention provides a process for manufacturing a semiconductor wafer capable of effectively reducing unevenness having a wavelength of 0.5 mm or more which remains on a surface of the semiconductor wafer after a first polishing step and improving flatness thereof; and a semiconductor wafer manufactured by the manufacturing process. The manufacturing process comprises: plural polishing steps including a first polishing step and a final polishing step; and a corrective polishing step performed after the first polishing step using a polishing cloth harder than that used in the first polishing step.
摘要翻译： 本发明提供一种半导体晶片的制造方法，其能够有效地减少在第一研磨工序后残留在半导体晶片的表面上的波长为0.5mm以上的波长的凹凸，并提高其平坦度。 以及通过制造工艺制造的半导体晶片。 制造方法包括：多个抛光步骤，包括第一抛光步骤和最终抛光步骤; 以及在第一抛光步骤之后使用比在第一抛光步骤中使用的抛光布更硬的抛光布进行的校正抛光步骤。
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公开(公告)号：US6042688A
公开(公告)日：2000-03-28
申请号：US104396
申请日：1998-06-25
申请人： Hisashi Masumura , Kiyoshi Suzuki
发明人： Hisashi Masumura , Kiyoshi Suzuki
CPC分类号： B24B53/017 , B24B37/28
摘要： A carrier for double-side polishing, which has a polishing pad dressing function as well as a polishing function, so that it can do removal of matter stuck to polishing pads and wear correction thereof concurrently with polishing and ensure stable work polishing accuracy. A resin-coated metal or resin ring is provided around the outer periphery of a carrier portion having work retainer holes and abrasive feed holes, and projections are formed on the upper and lower surfaces of the ring. The projections are cylindrical, triangular pyramidal, quadrangular pyramidal or conical, or they may be irregular projections formed by blasting.
摘要翻译： 用于双面抛光的载体，其具有抛光垫修整功能以及抛光功能，使得它可以在抛光垫上同时去除粘附在抛光垫上的物质并进行磨损校正，并确保稳定的抛光精度。 在具有工作保持孔和磨料供给孔的承载部分的外周设置树脂涂覆的金属或树脂环，并且在环的上表面和下表面上形成突起。 突起是圆柱形，三角锥体，四棱锥形或圆锥形，或者它们可以是通过喷砂形成的不规则突起。
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25.发明授权公开(公告)号：US08323075B2
公开(公告)日：2012-12-04
申请号：US12734119
申请日：2007-11-21
CPC分类号： B24B37/30 , B24B37/345 , Y10T29/49826
摘要： A polishing head having a disklike carrier in which an annular projecting portion and a carrier-engagement portion are formed in a peripheral portion, a disklike head body in which a head-body-engagement portion is formed outside, a diaphragm for connecting the head body with the carrier, a spacer located between the carrier-engagement portion and the head-body-engagement portion in a part of the carrier-engagement portion and/or the head-body-engagement portion, in which the spacer abuts on the carrier-engagement portion and/or the head-body-engagement portion at the time of lifting the head body so that the workpiece is demounted from the polishing pad by lifting the carrier with it inclined. As a result, there is provided a polishing head in which the workpiece can be easily, safely and surely demounted from the polishing pad by lifting the polishing head holding the workpiece without overhanging the polishing head from the turn table and the like.
摘要翻译： 一种抛光头，其具有圆盘状载体，其中环形突出部分和载体接合部分形成在周边部分中，盘状头体，其中头部体接合部分形成在外部;光阑，用于连接头部主体 在载体接合部分和头部本体接合部分之间的间隔件位于载体接合部分和/或头部本体接合部分的一部分中，间隔件邻接在载体接合部分上， 在抬起头部本体时使接合部和/或头体接合部通过使其倾斜地抬起托架而使抛光垫从抛光垫上拆下。 结果，提供了一种研磨头，其中通过提起保持工件的抛光头而不会使抛光头从转台等悬垂，从而可以从抛光垫容易地，安全地和可靠地拆卸工件。
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公开(公告)号：US20100291838A1
公开(公告)日：2010-11-18
申请号：US12733535
申请日：2008-10-20
摘要： The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.
摘要翻译： 本发明是一种研磨头，其中橡胶膜形成为靴形，其中橡胶膜由中间板保持的位置远离工件保持部分; 靴形橡胶膜的端部形成为O形环，使得橡胶膜由中间板保持，尽可能地减小中间板和橡胶膜之间的接触面积。 结果，提供了一种具有橡胶卡盘方法的抛光头，其中尽可能地抑制了在工件的表面上发生诸如划痕的表面缺陷，并且可以将工件均匀且稳定地抛光到 外围。
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27.发明授权Polishing head, polishing apparatus and polishing method for semiconductor wafer 有权半导体晶片的抛光头，抛光装置和抛光方法公开(公告)号：US07740521B2
公开(公告)日：2010-06-22
申请号：US11884833
申请日：2006-03-01
申请人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
发明人： Hiromasa Hashimoto , Yasuharu Ariga , Hisashi Masumura , Kouzi Kitagawa , Toshimasa Kubota , Takahiro Matsuda
CPC分类号： B24B37/30
摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.
摘要翻译： 本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和 连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。 在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。 结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。 因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。
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公开(公告)号：US20050014455A1
公开(公告)日：2005-01-20
申请号：US10493494
申请日：2002-10-25
申请人： Hisashi Masumura , Kazuya Tomii , Shigenao Ito , Kenichi Anzai , Kenichi Inoue
发明人： Hisashi Masumura , Kazuya Tomii , Shigenao Ito , Kenichi Anzai , Kenichi Inoue
IPC分类号： B24B1/00 , B24B7/30 , B24B37/20 , B24B37/24 , B24D13/14 , H01L21/304 , H01L21/306
CPC分类号： H01L21/02024 , B24B37/042 , B24B37/24 , Y10T428/249955
摘要： A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (μm)/compressibility (%)} is 3.8 or more.
摘要翻译： 提供了用于抛光晶片的方法，其有效地防止晶片的外周部分的下垂以及用于抛光晶片的抛光垫的抛光垫。 抛光晶片的方法包括以下步骤：将晶片的主表面与浸渍有树脂的无纺织物的抛光垫接触的晶片进行镜面抛光，其中抛光垫的表面粗糙度与 （表面粗糙度Ra（母体）/压缩率（％））为3.8以上。
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29.发明授权Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece 失效用于抛光的工件架，抛光工件的设备和抛光工件的方法公开(公告)号：US06422922B1
公开(公告)日：2002-07-23
申请号：US09647505
申请日：2000-09-29
IPC分类号： B24B100
CPC分类号： B24B37/30
摘要： A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.
摘要翻译： 一种用于抛光的工件保持器，包括：工件保持器主体，其具有用于通过真空吸附保持工件的多个穿孔;以及保持器背板，其与保持器主体的背面紧密接触并具有用于真空的凹槽，其中， 背板由合成树脂构成，具有70以上且低于98的Asker C硬度，以及用于研磨工件的装置以及利用该工件抛光工件的方法。 通过改善用于通过真空抽吸保持工件的用于抛光的工件保持器的保持器背板的材料，以增强与保持体的密封性，从而显影不应该将保持器主体的变形转移到工件表面的保持器背板， 即使抛光剂浆料被引入和固化，也可提供具有高精度的工件保持表面的抛光用工件保持器，用于研磨工件的设备和抛光工件的方法。
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公开(公告)号：US06399498B1
公开(公告)日：2002-06-04
申请号：US09244697
申请日：1999-02-04
申请人： Hisashi Masumura , Fumio Suzuki , Kouichi Okamura
发明人： Hisashi Masumura , Fumio Suzuki , Kouichi Okamura
IPC分类号： H01L21302
CPC分类号： B24B37/015
摘要： There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 wherein temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same. Degradation of flatness due to thermal influence when polishing the holding plate and polishing the wafer can be prevented in a method of processing comprising polishing the work holding surface of the work holding plate to conform with the deformed shape of the polishing pad, holding a work with the work holding surface, and polishing the work.
摘要翻译： 公开了一种处理工件的方法，其包括通过使工件保持板4的工件保持表面4a与安装在抛光台1上的抛光垫2接触和摩擦来抛光工件保持板4的工件保持表面4a， 向其提供抛光剂5，通过真空保持将晶片W保持在所述工件保持表面4a上，并且与抛光垫2接触并摩擦晶片W以抛光工件以提供抛光剂5，其中抛光剂5的温度或 抛光转台1由温度控制器7,9控制，使得当抛光所述工件保持板4时所述工件保持表面4a的温度和当研磨晶片w时所述工件保持表面4a的温度被控制为相同 。 可以防止在研磨保持板并抛光晶片时由于热影响而导致的平坦度的降低，包括：研磨工件保持板的工件保持表面以符合抛光垫的变形形状，保持工件 工作保持面，并抛光工作。
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