公开(公告)号：US20190096988A1

公开(公告)日：2019-03-28

申请号：US15964636

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Karthick Murukesan ,  Wen-Chih Chiang ,  Chun Lin Tsai ,  Ker-Hsiao Huo ,  Kuo-Ming Wu ,  Po-Chih Chen ,  Ru-Yi Su ,  Shiuan-Jeng Lin ,  Yi-Min Chen ,  Hung-Chou Lin ,  Yi-Cheng Chiu

IPC: H01L29/06 ,  H01L29/78 ,  H01L29/66

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a high voltage metal-oxide-semiconductor (HVMOS) device is integrated with a high voltage junction termination (HVJT) device. In some embodiments, a first drift well and a second drift well are in a substrate. The first and second drift wells border in a ring-shaped pattern and have a first doping type. A peripheral well is in the substrate and has a second doping type opposite the first doping type. The peripheral well surrounds and separates the first and second drift wells. A body well is in the substrate and has the second doping type. Further, the body well overlies the first drift well and is spaced from the peripheral well by the first drift well. A gate electrode overlies a junction between the first drift well and the body well.

公开(公告)号：US09190476B2

公开(公告)日：2015-11-17

申请号：US14705007

申请日：2015-05-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ker Hsiao Huo ,  Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng

IPC: H01L29/40 ,  H01L29/78 ,  H01L29/06 ,  H01L29/08 ,  H01L29/10 ,  H01L29/66

CPC classification number: H01L29/404 ,  H01L29/0607 ,  H01L29/0615 ,  H01L29/0649 ,  H01L29/0696 ,  H01L29/0852 ,  H01L29/0869 ,  H01L29/0886 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/41758 ,  H01L29/4238 ,  H01L29/49 ,  H01L29/66674 ,  H01L29/66681 ,  H01L29/7801 ,  H01L29/7816

Abstract: A lateral DMOS transistor is provided with a source region, a drain region, and a conductive gate. The drain region is laterally separated from the conductive gate by a field oxide that encroaches beneath the conductive gate. The lateral DMOS transistor may be formed in a racetrack-like configuration with the conductive gate including a rectilinear portion and a curved portion and surrounded by the source region. Disposed between the conductive gate and the trapped drain is one or more levels of interlevel dielectric material. One or more groups of isolated conductor leads are formed in or on the dielectric layers and may be disposed at multiple device levels. The isolated conductive leads increase the breakdown voltage of the lateral DMOS transistor particularly in the curved regions where electric field crowding can otherwise degrade breakdown voltages.

Abstract translation: 横向DMOS晶体管设置有源极区，漏极区和导电栅。 漏极区域通过在导电栅极下方侵入的场氧化物与导电栅极横向分离。 横向DMOS晶体管可以形成为跑道状结构，其中导电栅极包括直线部分和弯曲部分并被源极区域包围。 布置在导电栅极和捕获的漏极之间是一层或多层次的层间电介质材料。 一组或多组隔离的导体引线形成在电介质层中或介质层上，并且可以设置在多个器件级。 隔离导电引线增加了横向DMOS晶体管的击穿电压，特别是在电场拥挤可能会降低击穿电压的弯曲区域中。

公开(公告)号：US09035379B2

公开(公告)日：2015-05-19

申请号：US14333886

申请日：2014-07-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ker Hsiao Huo ,  Ru-Yi Su ,  Fu-Chih Yang ,  Chun Lin Tsai ,  Chih-Chang Cheng

IPC: H01L29/66 ,  H01L29/78 ,  H01L29/06 ,  H01L29/423 ,  H01L29/49 ,  H01L29/40 ,  H01L29/417 ,  H01L29/08

CPC classification number: H01L29/404 ,  H01L29/0607 ,  H01L29/0615 ,  H01L29/0649 ,  H01L29/0696 ,  H01L29/0852 ,  H01L29/0869 ,  H01L29/0886 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/41758 ,  H01L29/4238 ,  H01L29/49 ,  H01L29/66674 ,  H01L29/66681 ,  H01L29/7801 ,  H01L29/7816

Abstract: A lateral DMOS transistor is provided with a source region, a drain region, and a conductive gate. The drain region is laterally separated from the conductive gate by a field oxide that encroaches beneath the conductive gate. The lateral DMOS transistor may be formed in a racetrack-like configuration with the conductive gate including a rectilinear portion and a curved portion and surrounded by the source region. Disposed between the conductive gate and the trapped drain is one or more levels of interlevel dielectric material. One or more groups of isolated conductor leads are formed in or on the dielectric layers and may be disposed at multiple device levels. The isolated conductive leads increase the breakdown voltage of the lateral DMOS transistor particularly in the curved regions where electric field crowding can otherwise degrade breakdown voltages.

公开(公告)号：US20240371951A1

公开(公告)日：2024-11-07

申请号：US18776399

申请日：2024-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chien Liu ,  Yao-Chung Chang ,  Chun Lin Tsai

IPC: H01L29/417 ,  H01L29/40 ,  H01L29/66 ,  H01L29/778

Abstract: Various embodiments of the present disclosure are directed towards a two-dimensional carrier gas (2DCG) semiconductor device comprising an ohmic source/drain electrode with a plurality of protrusions separated by gaps and protruding from a bottom surface of the ohmic source/drain electrode. The ohmic source/drain electrode overlies a semiconductor film, and the protrusions extend from the bottom surface into the semiconductor film. Further, the ohmic source/drain electrode is separated from another ohmic source/drain electrode that also overlies the semiconductor film. The semiconductor film comprises a channel layer and a barrier layer that are vertically stacked and directly contact at a heterojunction. The channel layer accommodates a 2DCG that extends along the heterojunction and is ohmically coupled to the ohmic source/drain electrode and the other ohmic source/drain electrode. A gate electrode overlies the semiconductor film between the ohmic source/drain electrode and the other source/drain electrode.

公开(公告)号：US12132088B2

公开(公告)日：2024-10-29

申请号：US17353051

申请日：2021-06-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Chien Liu ,  Yao-Chung Chang ,  Chun Lin Tsai

IPC: H01L29/417 ,  H01L29/40 ,  H01L29/66 ,  H01L29/778

CPC classification number: H01L29/41766 ,  H01L29/401 ,  H01L29/66462 ,  H01L29/7783

Abstract: Various embodiments of the present disclosure are directed towards a two-dimensional carrier gas (2DCG) semiconductor device comprising an ohmic source/drain electrode with a plurality of protrusions separated by gaps and protruding from a bottom surface of the ohmic source/drain electrode. The ohmic source/drain electrode overlies a semiconductor film, and the protrusions extend from the bottom surface into the semiconductor film. Further, the ohmic source/drain electrode is separated from another ohmic source/drain electrode that also overlies the semiconductor film. The semiconductor film comprises a channel layer and a barrier layer that are vertically stacked and directly contact at a heterojunction. The channel layer accommodates a 2DCG that extends along the heterojunction and is ohmically coupled to the ohmic source/drain electrode and the other ohmic source/drain electrode. A gate electrode overlies the semiconductor film between the ohmic source/drain electrode and the other source/drain electrode.

公开(公告)号：US11791388B2

公开(公告)日：2023-10-17

申请号：US16862875

申请日：2020-04-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Aurelien Gauthier Brun ,  Chun Lin Tsai ,  Jiun-Lei Jerry Yu ,  Po-Chih Chen ,  Yun-Hsiang Wang

IPC: H01L29/417 ,  H01L29/423 ,  H01L29/778 ,  H01L29/205 ,  H01L21/3213 ,  H01L21/02 ,  H01L29/20 ,  H01L29/66

CPC classification number: H01L29/41775 ,  H01L21/0254 ,  H01L21/32133 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/42316 ,  H01L29/66462 ,  H01L29/7786

Abstract: In some embodiments, the present disclosure relates to a transistor device. The transistor device that includes a source contact disposed over a substrate. The source contact has a first side and an opposing second side disposed between a first end and an opposing second end. A drain contact is disposed over the substrate and is separated from the source contact along a first direction. A gate structure is disposed over the substrate between the source contact and the drain contact. The gate structure extends along the first side of the source contact facing the drain contact and also wraps around the first end and the opposing second end of the source contact.

公开(公告)号：US20210376135A1

公开(公告)日：2021-12-02

申请号：US16884398

申请日：2020-05-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Man-Ho Kwan ,  Fu-Wei Yao ,  Chun Lin Tsai ,  Jiun-Lei Jerry Yu ,  Ting-Fu Chang

IPC: H01L29/778 ,  H01L29/20 ,  H01L29/66 ,  H01L29/10

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip a first undoped layer overlies a substrate. A first barrier layer overlies the first undoped layer and has a first thickness. A first doped layer overlies the first barrier layer and is disposed laterally within an n-channel device region of the substrate. A second barrier layer overlies the first barrier layer and is disposed within a p-channel device region that is laterally adjacent to the n-channel device region. The second barrier layer has a second thickness that is greater than the first thickness. A second undoped layer overlies the second barrier layer. A second doped layer overlies the second undoped layer. The second undoped layer and the second doped layer are disposed within the p-channel device region.

公开(公告)号：US20210242337A1

公开(公告)日：2021-08-05

申请号：US16872551

申请日：2020-05-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yun-Hsiang Wang ,  Chun Lin Tsai ,  Jiun-Lei Jerry Yu ,  Po-Chih Chen ,  Chia-Ling Yeh ,  Ching Yu Chen

IPC: H01L29/778 ,  H01L29/20 ,  H01L29/205 ,  H01L29/66

Abstract: Various embodiments of the present disclosure are directed toward an integrated chip including an undoped layer overlying a substrate. A first barrier layer overlies the undoped layer. A doped layer overlies the first barrier layer. Further, a second barrier layer overlies the first barrier layer, where the second barrier layer is laterally offset from a perimeter of the doped layer by a non-zero distance. The first and second barrier layers comprise a same III-V semiconductor material. A first atomic percentage of a first element within the first barrier layer is less than a second atomic percentage of the first element within the second barrier layer.

公开(公告)号：US10535730B2

公开(公告)日：2020-01-14

申请号：US15964636

申请日：2018-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Karthick Murukesan ,  Wen-Chih Chiang ,  Chun Lin Tsai ,  Ker-Hsiao Huo ,  Kuo-Ming Wu ,  Po-Chih Chen ,  Ru-Yi Su ,  Shiuan-Jeng Lin ,  Yi-Min Chen ,  Hung-Chou Lin ,  Yi-Cheng Chiu

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/78

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a high voltage metal-oxide-semiconductor (HVMOS) device is integrated with a high voltage junction termination (HVJT) device. In some embodiments, a first drift well and a second drift well are in a substrate. The first and second drift wells border in a ring-shaped pattern and have a first doping type. A peripheral well is in the substrate and has a second doping type opposite the first doping type. The peripheral well surrounds and separates the first and second drift wells. A body well is in the substrate and has the second doping type. Further, the body well overlies the first drift well and is spaced from the peripheral well by the first drift well. A gate electrode overlies a junction between the first drift well and the body well.

公开(公告)号：US20190109189A1

公开(公告)日：2019-04-11

申请号：US16199483

申请日：2018-11-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Cheng Chiu ,  Wen-Chih Chiang ,  Chun Lin Tsai ,  Kuo-Ming Wu ,  Shiuan-Jeng Lin ,  Yi-Min Chen ,  Hung-Chou Lin ,  Karthick Murukesan

IPC: H01L29/06 ,  H01L29/66 ,  H01L29/78 ,  H01L23/522 ,  H01L29/10 ,  H01L23/528

Abstract: The present disclosure, in some embodiments, relates to a high voltage resistor device. The device includes a buried well region disposed within a substrate and having a first doping type. A drift region is disposed within the substrate and contacts the buried well region. The drift region has the first doping type. A body region is disposed within the substrate and has a second doping type. The body region laterally contacts the drift region and vertically contacts the buried well region. An isolation structure is over the drift region and a resistor structure is over the isolation structure.