公开(公告)号：US20250112081A1

公开(公告)日：2025-04-03

申请号：US18981155

申请日：2024-12-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Chin-Lin CHOU ,  Shang-Ying TSAI ,  Shou-Wen KUO ,  Kuei-Sung CHANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU ,  Chun-wen CHENG

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

公开(公告)号：US20240379393A1

公开(公告)日：2024-11-14

申请号：US18784494

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Guan-Wei HUANG ,  Chih-Hung HUANG ,  Yang-Ann CHU ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/66

Abstract: In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.

公开(公告)号：US20240186162A1

公开(公告)日：2024-06-06

申请号：US18444299

申请日：2024-02-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Kang HU ,  Shou-Wen KUO ,  Sheng-Hsiang CHUANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU

IPC: H01L21/67 ,  G01M3/38 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G01M3/38 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/67772

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

公开(公告)号：US20220059393A1

公开(公告)日：2022-02-24

申请号：US16998461

申请日：2020-08-20

Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.

Inventor： Chien-Fa LEE ,  Chin-Lin CHOU ,  Shang-Ying TSAI ,  Shou-Wen KUO ,  Kuei-Sung CHANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU ,  Chun-wen CHENG

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

公开(公告)号：US20200227283A1

公开(公告)日：2020-07-16

申请号：US16834290

申请日：2020-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsung-Sheng KUO ,  Yang-Ann CHU ,  Alan YANG ,  Vic HUANG ,  Hsu-Shui LIU ,  Jiun-Rong PAI

IPC: H01L21/677 ,  H01L21/683 ,  H01L21/68

Abstract: An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

公开(公告)号：US20170148651A1

公开(公告)日：2017-05-25

申请号：US15365455

申请日：2016-11-30

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Mao-Lin KAO ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Li-Jen KO ,  Hsiang-Yin SHEN ,  Tien-Chen HU

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67184 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/68707

Abstract: A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein the first platform has a first load lock and a first plurality of chambers, and the second platform has a second load lock and a second plurality of chambers, and the vacuum tunnel connects the first and the second load locks.

公开(公告)号：US20160111311A1

公开(公告)日：2016-04-21

申请号：US14518373

申请日：2014-10-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chien-Fa LEE ,  Hsu-Shui LIU ,  Jiun-Rong PAI ,  Shou-Wen KUO

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67259 ,  H01L21/67265 ,  H01L21/67778 ,  H01L21/68

Abstract: A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.

Abstract translation: 晶片转印方法包括以下步骤。 检测晶片盒中的第一晶片的初始位置。 基于第一晶片的初始位置来确定晶片盒中的拾取进入位置，其中拾取进入位置与第一晶片的初始位置间隔开。 晶片转印刀片移动到拾取进入位置。

公开(公告)号：US20150197852A1

公开(公告)日：2015-07-16

申请号：US14153430

申请日：2014-01-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Pei-Nung CHEN ,  Hsu-Shui LIU

IPC: C23C16/50 ,  H01L21/285 ,  C23C16/509 ,  C23C16/455 ,  C23C16/503 ,  H01L21/3065 ,  H01L21/683

CPC classification number: C23C16/509 ,  C23C16/4586 ,  C23C16/503 ,  H01L21/6831

Abstract: Embodiments of a plasma density distribution control method and a plasma processing apparatus are provided. The plasma processing apparatus includes an electrostatic chuck positioned in a processing chamber thereof The electrostatic chuck includes a number of power electrodes for controlling the plasma in the processing chamber, and the power electrodes are separated from and movable relative to each other. Since the distances between the plasma and each of the power electrodes are adjustable, the plasma density in the processing chamber can thus be tunable by zone. Therefore, the uniformity of the plasma density in the processing chamber can be improved. Further, the power electrodes can be driven by a single electrical signal. Therefore, the cost and system complexity of the plasma processing apparatus can be reduced.

Abstract translation: 提供等离子体密度分布控制方法和等离子体处理装置的实施例。 等离子体处理装置包括位于处理室中的静电卡盘。静电卡盘包括用于控制处理室中的等离子体的多个功率电极，并且功率电极相对于彼此分离和移动。 由于等离子体和每个功率电极之间的距离是可调节的，因此处理室中的等离子体密度可以由区域调节。 因此，可以提高处理室中的等离子体密度的均匀性。 此外，功率电极可以由单个电信号驱动。 因此，可以降低等离子体处理装置的成本和系统复杂性。