公开(公告)号：US06875703B1

公开(公告)日：2005-04-05

申请号：US10760500

申请日：2004-01-20

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Peter H. Mitchell

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Peter H. Mitchell

IPC分类号： H01L21/033 ,  H01L21/28 ,  H01L21/3213 ,  H01L21/461

CPC分类号： H01L21/32139 ,  H01L21/0337 ,  H01L21/0338 ,  H01L21/28132

摘要： A method is provided for forming a quadruple density sidewall image transfer (SIT) structure. Oxide spacers are formed on opposite sidewalls of a first mandrel. The oxide spacers form a second mandrel. Then sidewall spacers are formed on opposite sidewalls of the oxide spacers forming the second mandrel. A pattern of the sidewall spacers is used to form the quadruple density sidewall image transfer (SIT) structure. The method of the invention enables formation of four well-controlled lines for each lithographically minimum pitch dimension.

摘要翻译： 提供了一种用于形成四重密度侧壁图像转印（SIT）结构的方法。 氧化物间隔件形成在第一心轴的相对侧壁上。 氧化物间隔物形成第二心轴。 然后，侧壁间隔件形成在形成第二心轴的氧化物间隔件的相对侧壁上。 侧壁间隔物的图案用于形成四重密度侧壁图像转印（SIT）结构。 本发明的方法能够形成用于每个光刻最小间距尺寸的四个良好控制的线。

公开(公告)号：US20080261363A1

公开(公告)日：2008-10-23

申请号：US12144139

申请日：2008-06-23

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Mark Eliot Masters ,  Peter H. Mitchell

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Mark Eliot Masters ,  Peter H. Mitchell

IPC分类号： H01L21/8242

CPC分类号： H01L27/108 ,  H01L27/10826 ,  H01L27/10879 ,  H01L29/66795 ,  H01L29/785

摘要： A memory gain cell for a memory circuit, a memory circuit formed from multiple memory gain cells, and methods of fabricating such memory gain cells and memory circuits. The memory gain cell includes a storage device capable of holding a stored electrical charge, a write device, and a read device. The read device includes a fin of semiconducting material, electrically-isolated first and second gate electrodes flanking the fin, and a source and drain formed in the fin adjacent to the first and the second gate electrodes. The first gate electrode is electrically coupled with the storage device. The first and second gate electrodes are operative for gating a region of the fin defined between the source and the drain to thereby regulate a current flowing from the source to the drain. When gated, the magnitude of the current is dependent upon the electrical charge stored by the storage device.

摘要翻译： 用于存储器电路的存储增益单元，由多个存储器增益单元形成的存储器电路，以及制造这种存储器增益单元和存储器电路的方法。 存储器增益单元包括能够保存存储的电荷的存储装置，写入装置和读取装置。 读取装置包括半导体材料的翅片，鳍片侧面的电隔离的第一和第二栅电极，以及形成在与第一和第二栅电极相邻的鳍片中的源极和漏极。 第一栅电极与存储装置电耦合。 第一和第二栅极电极用于选通限定在源极和漏极之间的鳍片的区域，从而调节从源极流到漏极的电流。 当门控时，电流的大小取决于存储设备存储的电量。

公开(公告)号：US07737504B2

公开(公告)日：2010-06-15

申请号：US11759981

申请日：2007-06-08

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L29/772

CPC分类号： H01L21/823892 ,  H01L21/76229 ,  H01L21/823878 ,  H01L27/11

摘要： A well isolation trenches for a CMOS device and the method for forming the same. The CMOS device includes (a) a semiconductor substrate, (b) a P well and an N well in the semiconductor substrate, (c) a well isolation region sandwiched between and in direct physical contact with the P well and the N well. The P well comprises a first shallow trench isolation (STI) region, and the N well comprises a second STI region. A bottom surface of the well isolation region is at a lower level than bottom surfaces of the first and second STI regions. When going from top to bottom of the well isolation region, an area of a horizontal cross section of the well isolation region is an essentially continuous function.

摘要翻译： CMOS器件的良好隔离沟槽及其形成方法。 CMOS器件包括（a）半导体衬底，（b）半导体衬底中的P阱和N阱，（c）夹在P阱和N阱之间并与P阱和N阱直接物理接触的阱隔离区域。 P阱包括第一浅沟槽隔离（STI）区域，并且N阱包括第二STI区域。 阱隔离区域的底表面处于比第一和第二STI区域的底表面更低的水平面。 当从隔离区域的顶部到底部进行时，阱隔离区域的水平横截面的区域是基本上连续的函数。

公开(公告)号：US07668004B2

公开(公告)日：2010-02-23

申请号：US12019746

申请日：2008-01-25

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

IPC分类号： G11C11/50

CPC分类号： G11C13/025 ,  B82Y10/00 ,  G11C2213/16 ,  G11C2213/77 ,  Y10S977/742 ,  Y10S977/939 ,  Y10S977/943

摘要： Non-volatile and radiation-hard switching and memory devices using vertical nano-tubes and reversibly held in state by van der Waals' forces and methods of fabricating the devices. Means for sensing the state of the devices include measuring capacitance, and tunneling and field emission currents.

摘要翻译： 使用垂直纳米管的非易失性和辐射硬的开关和存储器件，并通过范德华力力可逆地保持状态和制造器件的方法。 用于感测装置状态的装置包括测量电容，以及隧穿和场发射电流。

公开(公告)号：US07651902B2

公开(公告)日：2010-01-26

申请号：US11737989

申请日：2007-04-20

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/338 ,  H01L23/62

CPC分类号： H01L21/76243 ,  H01L21/76251 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1207

摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。 该方法涉及使用SIMOX工艺来形成绝缘层。 绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US20090035708A1

公开(公告)日：2009-02-05

申请号：US11831099

申请日：2007-07-31

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

IPC分类号： G03F7/20

CPC分类号： G03F7/2024 ,  G03F7/38 ,  G03F7/40 ,  G03F7/70425

摘要： A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

摘要翻译： 一种结构及其形成方法。 该方法包括提供一种结构，其包括（a）待图案化层，（b）在待图案化层的顶部上的光致抗蚀剂层，其中光致抗蚀剂层包括第一开口，和（c）帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。

公开(公告)号：US07985643B2

公开(公告)日：2011-07-26

申请号：US12052855

申请日：2008-03-21

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  William Robert Tonti

IPC分类号： H01L21/8238

CPC分类号： H01L21/76897 ,  H01L21/28052 ,  H01L21/28061 ,  H01L21/28114

摘要： A semiconductor structure. The structure includes (a) a semiconductor layer including a channel region disposed between first and second S/D regions; (b) a gate dielectric region on the channel region; (c) a gate region on the gate dielectric region and electrically insulated from the channel region by the gate dielectric region; (d) a protection umbrella region on the gate region, wherein the protection umbrella region comprises a first dielectric material, and wherein the gate region is completely in a shadow of the protection umbrella region; and (e) a filled contact hole (i) directly above and electrically connected to the second S/D region and (ii) aligned with an edge of the protection umbrella region, wherein the contact hole is physically isolated from the gate region by an inter-level dielectric (ILD) layer which comprises a second dielectric material different from the first dielectric material.

摘要翻译： 半导体结构。 该结构包括（a）包括设置在第一和第二S / D区之间的沟道区的半导体层; （b）沟道区上的栅介质区; （c）栅极电介质区域上的栅极区域，并且通过栅极电介质区域与沟道区域电绝缘; （d）栅极区域上的保护伞区域，其中保护伞区域包括第一介电材料，并且其中栅极区域完全处于保护伞区域的阴影中; 和（e）直接在第二S / D区域上方并电连接到第二S / D区域的填充接触孔（i）和（ii）与保护伞区域的边缘对准，其中接触孔通过一个 层间介电层（ILD）层，其包括不同于第一介电材料的第二电介质材料。

公开(公告)号：US07750406B2

公开(公告)日：2010-07-06

申请号：US11877871

申请日：2007-10-24

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L23/62 ,  H01L29/94

CPC分类号： H01L21/76264

摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 设计结构体现在机器可读介质中，用于设计，制造或测试设计，其中设计结构包括以混合衬底形成的器件，其特征在于具有不同晶体取向的半导体岛。 绝缘层将至少一个不同晶体取向的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US07579272B2

公开(公告)日：2009-08-25

申请号：US11670778

申请日：2007-02-02

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III

IPC分类号： H01L21/4763

CPC分类号： H01L21/02115 ,  B82Y10/00 ,  H01L21/02282 ,  H01L21/3146 ,  H01L21/3185 ,  H01L21/76814 ,  H01L21/7682 ,  H01L21/76826 ,  H01L21/76831 ,  H01L21/76888 ,  H01L2221/1047

摘要： Methods of forming low-k dielectric layers for use in the manufacture of semiconductor devices and fabricating semiconductor structures using the low-k dielectric material. The low-k dielectric material comprises carbon nanostructures, like carbon nanotubes or carbon buckyballs, that are characterized by an insulating electronic state. The carbon nanostructures may be converted to the insulating electronic state either before or after a layer containing the carbon nanostructures is formed on a substrate. One approach for converting the carbon nanostructures to the insulating electronic state is fluorination.

摘要翻译： 形成用于制造半导体器件的低k电介质层并使用低k电介质材料制造半导体结构的方法。 低k介电材料包括碳纳米结构，如碳纳米管或碳​​棒球，其特征在于绝缘电子状态。 碳纳米结构可以在包含碳纳米结构的层在基底上形成之前或之后转变为绝缘电子状态。 将碳纳米结构转化为绝缘电子态的一种方法是氟化。

公开(公告)号：US07268028B1

公开(公告)日：2007-09-11

申请号：US11279962

申请日：2006-04-17

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/336 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/8249 ,  H01L21/8244 ,  H01L21/8242

CPC分类号： H01L21/823892 ,  H01L21/76229 ,  H01L21/823878 ,  H01L27/11

摘要： A well isolation trenches for a CMOS device and the method for forming the same. The CMOS device includes (a) a semiconductor substrate, (b) a P well and an N well in the semiconductor substrate, (c) a well isolation region sandwiched between and in direct physical contact with the P well and the N well. The P well comprises a first shallow trench isolation (STI) region, and the N well comprises a second STI region. A bottom surface of the well isolation region is at a lower level than bottom surfaces of the first and second STI regions. When going from top to bottom of the well isolation region, an area of a horizontal cross section of the well isolation region is an essentially continuous function.

摘要翻译： CMOS器件的良好隔离沟槽及其形成方法。 CMOS器件包括（a）半导体衬底，（b）半导体衬底中的P阱和N阱，（c）夹在P阱和N阱之间并与P阱和N阱直接物理接触的阱隔离区域。 P阱包括第一浅沟槽隔离（STI）区域，并且N阱包括第二STI区域。 阱隔离区域的底表面处于比第一和第二STI区域的底表面更低的水平面。 当从隔离区域的顶部到底部进行时，阱隔离区域的水平横截面的区域是基本上连续的函数。