公开(公告)号：US07303943B2

公开(公告)日：2007-12-04

申请号：US10960168

申请日：2004-10-07

申请人： Tsutomu Matsuhira ,  Hideaki Adachi ,  Keiichiro Hayashi ,  Tadahiro Nishigawa ,  Nobukazu Koizumi

发明人： Tsutomu Matsuhira ,  Hideaki Adachi ,  Keiichiro Hayashi ,  Tadahiro Nishigawa ,  Nobukazu Koizumi

IPC分类号： H01L21/00

CPC分类号： H05K3/0011 ,  H01L21/4846 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K2203/1194 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.

摘要翻译： 在制造电气装置的方法中，通过在80℃至100℃的温度下加热薄膜基板来降低薄膜基板中的湿度。此后，将IC安装在薄膜基板上。

公开(公告)号：US07283373B2

公开(公告)日：2007-10-16

申请号：US10368240

申请日：2003-02-18

申请人： Tsutomu Matsuhira

发明人： Tsutomu Matsuhira

IPC分类号： H05K1/18

CPC分类号： H01L22/32 ,  G01R31/048 ,  G02F1/1309 ,  G02F1/13452 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0268 ,  H01L2924/00

摘要： An electronic device comprises an IC provided with an array of pads a preselected number of which define inspection pads of the IC. A substrate has inspection patterns and is mounted on the IC so that each inspection pad is brought into contact with a corresponding inspection pattern to thereby enable electrical inspection of a mounting condition of the IC on the substrate. A pair of inspection lands is provided on the substrate and connected to some of the inspection patterns. The inspection pads and the inspection patterns are connected by wiring provided on the IC or on the substrate so that the inspection lands are electrically connected to each other when the IC is mounted on the substrate. A centerline of at least one of the inspection patterns is offset in position from a centerline of the corresponding inspection pad in width directions of the inspection pattern and the inspection pad.

摘要翻译： 电子设备包括设置有垫阵列的IC，其预定数量限定IC的检查焊盘。 基板具有检查图案并且安装在IC上，使得每个检查焊盘与相应的检查图案接触，从而能够对IC在基板上的安装状态进行电检查。 在基板上设置一对检查台，并连接到一些检查图案。 检查焊盘和检查图案通过设置在IC或基板上的布线连接，使得当IC安装在基板上时，检查台面彼此电连接。 至少一个检查图案的中心线在检查图案和检查垫的宽度方向上偏离相应的检查垫的中心线的位置。

公开(公告)号：US06528889B1

公开(公告)日：2003-03-04

申请号：US09342424

申请日：1999-06-29

申请人： Tsutomu Matsuhira ,  Atsushi Endo

发明人： Tsutomu Matsuhira ,  Atsushi Endo

IPC分类号： H01L2312

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： An electronic circuit device has an insulating substrate and an integrated circuit having a surface disposed opposite to and confronting a surface of the insulating substrate to form a gap therebetween. An adhesive material is disposed in the gap between the insulating substrate and the integrated circuit. Bumps project from the surface of the integrated circuit towards the surface of the insulating substrate. Electrode patterns are electrically connected to the bumps to electrically connect the integrated circuit to the electrode patterns. An adhesion-reinforcing pattern is spaced-apart from and surrounded by the electrode patterns. The adhesion-reinforcing pattern is disposed on a portion of the surface of the insulating substrate confronting a portion of the surface of the integrated circuit from which the bumps do not project.

摘要翻译： 电子电路装置具有绝缘基板和集成电路，该集成电路的表面与绝缘基板的表面相对并面对，以在其间形成间隙。 粘合剂材料设置在绝缘基板和集成电路之间的间隙中。 从集成电路的表面向绝缘基板的表面突出。 电极图案电连接到凸块以将集成电路电连接到电极图案。 粘合增强图案与电极图案间隔开并被电极图案包围。 粘合强化图案设置在与绝缘体不突出的集成电路的表面的一部分相对的绝缘基板的表面的一部分上。

公开(公告)号：US6005652A

公开(公告)日：1999-12-21

申请号：US616436

申请日：1996-03-15

申请人： Tsutomu Matsuhira

发明人： Tsutomu Matsuhira

IPC分类号： G02F1/1345 ,  G02F1/13

CPC分类号： G02F1/13452

摘要： A liquid crystal display device comprises a panel containing a liquid crystal and having an input wiring formed thereon. A film substrate is disposed over the panel and has wiring lines connected to the input wiring of the panel. At least one integrated circuit is disposed between the panel and the film substrate and has an input terminal connected to the input wiring of the panel for driving the liquid crystal.

摘要翻译： 液晶显示装置包括含有液晶并具有形成在其上的输入布线的面板。 薄膜基板设置在面板上并具有连接到面板的输入布线的布线。 至少一个集成电路设置在面板和薄膜基板之间，并且具有连接到用于驱动液晶的面板的输入布线的输入端子。

公开(公告)号：US07927440B2

公开(公告)日：2011-04-19

申请号：US12085806

申请日：2006-11-28

申请人： Tsutomu Matsuhira

发明人： Tsutomu Matsuhira

IPC分类号： B32B41/00

CPC分类号： G01N21/8422 ,  G01N21/958

摘要： Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.

摘要翻译： 在透明粘合剂层中的空气气泡或异物在透明板和板状构件以全表面接触的状态下结合在一起被检测到。 为了检测，使用光纤等对来自侧面的光照射粘合剂层，将铸造光引导通过粘合剂层，并且用引导光来检查粘合剂层的状态。 因此，能够将粘合剂层中的缺陷与粘合透明板中的缺陷区分开的检查成为可能。

公开(公告)号：US20100296027A1

公开(公告)日：2010-11-25

申请号：US12311875

申请日：2007-10-16

申请人： Tsutomu Matsuhira ,  Teruo Ebihara ,  Mitsuyoshi Hara

发明人： Tsutomu Matsuhira ,  Teruo Ebihara ,  Mitsuyoshi Hara

IPC分类号： G02F1/1335 ,  G02F1/1333

CPC分类号： G02F1/133308 ,  G02F2201/503 ,  G02F2202/28

摘要： Glass plates for reinforcement are attached over an entire surface of a display region on a display surface side and its opposite side of a liquid crystal panel 30 to increase performance of a loading resistance to an impact from an outside or pressing force, whereby the liquid crystal panel 30 is allowed to be thin. Specifically, there is provided a display device including: the liquid crystal panel 30 which includes two transparent substrates sandwiching liquid crystals therebetween and an optical film placed on at least one of outer surfaces of the two transparent substrates; a first glass plate which is attached on a display surface side of the liquid crystal panel 30 through a first adhesive made of an optical adhesive or a translucent bonding sheet; and a second glass plate which is attached on a rear surface side of the liquid crystal panel 30 through a second adhesive made of the optical adhesive or the translucent bonding sheet.

摘要翻译： 用于加强的玻璃板被附着在显示表面侧的显示区域的整个表面上以及液晶面板30的相对侧，以增加对外部的冲击的负载阻力或压力的性能，由此液晶 面板30被允许变薄。 具体地说，提供了一种显示装置，包括：液晶面板30，其包括夹着液晶的两个透明基板和位于两个透明基板的至少一个外表面上的光学薄膜; 第一玻璃板，其通过由光学粘合剂或半透明粘合片制成的第一粘合剂附着在液晶面板30的显示表面侧; 以及第二玻璃板，其通过由光学粘合剂或半透明粘合片制成的第二粘合剂附着在液晶面板30的后表面侧。

公开(公告)号：US20090283211A1

公开(公告)日：2009-11-19

申请号：US12085807

申请日：2006-11-22

申请人： Tsutomu Matsuhira

发明人： Tsutomu Matsuhira

IPC分类号： B32B37/12

CPC分类号： C09J5/00 ,  B29C65/1406 ,  B29C65/1409 ,  B29C65/1435 ,  B29C65/1448 ,  B29C65/1483 ,  B29C65/4845 ,  B29C65/52 ,  B29C65/782 ,  B29C66/1122 ,  B29C66/21 ,  B29C66/342 ,  B29C66/45 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/8322 ,  B29C66/91645 ,  B29K2709/08 ,  B29K2995/0026 ,  B29L2031/3475 ,  B32B37/003 ,  B32B37/1284 ,  B32B37/1292 ,  B32B2457/20 ,  B32B2457/206 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2202/28 ,  B29C65/00 ,  B29K2033/12 ,  B29K2069/00

摘要： Provided is a method of bonding a transparent plate or a touch panel to a flat display without allowing air bubbles to form. A fixed amount of liquid adhesive is applied in dots to a bonding surface around corners and at the center. More adhesive is applied to connect the dots of applied adhesive with lines. The bonding surface is then reversed, causing the adhesive to drip, and the dripping adhesive is brought into contact with an opposite bonding surface to fill a gap between the bonding surfaces with the adhesive. The adhesive is cured by irradiation with light incident from a transparent plate side. In short, after dots of adhesive are brought into contact with the opposite bonding surface and the adhesive flows into a pattern that does not let in air bubbles, the gap between the bonding surfaces is filled with the adhesive.

摘要翻译： 提供了一种将透明板或触摸面板粘合到平面显示器上而不允许形成气泡的方法。 固定量的液体粘合剂以点形式施加在角落周围的接合表面和中心处。 应用更多的粘合剂将应用的粘合剂的点与线连接。 然后将接合表面反转，导致粘合剂滴落，并且滴下的粘合剂与相对的粘合表面接触，以用粘合剂填充粘合表面之间的间隙。 粘合剂通过从透明板侧入射的光的照射而固化。 简而言之，在粘合剂点与相对的接合表面接触并且粘合剂流入不会发生气泡的图案之后，用粘合剂填充接合表面之间的间隙。

公开(公告)号：US20090038734A1

公开(公告)日：2009-02-12

申请号：US12085806

申请日：2006-11-28

申请人： Tsutomu Matsuhira

发明人： Tsutomu Matsuhira

IPC分类号： B32B38/00

CPC分类号： G01N21/8422 ,  G01N21/958

摘要： Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.

摘要翻译： 在透明粘合剂层中的空气气泡或异物在透明板和板状构件以全表面接触的状态下结合在一起被检测到。 为了检测，使用光纤等对来自侧面的光照射粘合剂层，将铸造光引导通过粘合剂层，并且用引导光来检查粘合剂层的状态。 因此，能够将粘合剂层中的缺陷与粘合透明板中的缺陷区分开的检查成为可能。

公开(公告)号：US07474274B2

公开(公告)日：2009-01-06

申请号：US10960167

申请日：2004-10-07

申请人： Tsutomu Matsuhira ,  Hiroki Hanawa ,  Nobuyuki Sasaki ,  Hideaki Adachi

发明人： Tsutomu Matsuhira ,  Hiroki Hanawa ,  Nobuyuki Sasaki ,  Hideaki Adachi

IPC分类号： G09G5/00

CPC分类号： G09G3/3644 ,  G09G2340/0407

摘要： A display device of the present invention switches between two displays, a main panel display and a sub-panel display, by using one driver IC. Liquid crystals having different optimal driver voltages are used in the main panel and the sub-panel, and the optimal driver voltage for the panel in which display is to be performed is output. A driver voltage that is higher or lower than the optimal driver voltage is applied to the display panel where display is not to be performed, and the entire display thereof displays a single color. Display content of the panel on which display is not to be performed cannot be identified.

摘要翻译： 本发明的显示装置通过使用一个驱动器IC来切换两个显示器，主面板显示器和子面板显示器。 在主面板和子面板中使用具有不同最佳驱动器电压的液晶，并且输出要执行显示的面板的最佳驱动器电压。 高于或低于最佳驱动器电压的驱动器电压被施加到不执行显示的显示面板，并且其整个显示器显示单一颜色。 不能识别不显示显示的面板的显示内容。

公开(公告)号：US20060079026A1

公开(公告)日：2006-04-13

申请号：US10960168

申请日：2004-10-07

申请人： Tsutomu Matsuhira ,  Hideaki Adachi ,  Keiichiro Hayashi ,  Tadahiro Nishigawa ,  Nobukazu Koizumi

发明人： Tsutomu Matsuhira ,  Hideaki Adachi ,  Keiichiro Hayashi ,  Tadahiro Nishigawa ,  Nobukazu Koizumi

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H05K3/0011 ,  H01L21/4846 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0393 ,  H05K2203/1194 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacture is provided in which position deviations during mounting are eliminated, and in which fine connections on the order of a 30 μm pitch can be stabilized. A low cost device can thus be realized by cost reductions that accompany smaller ICs. Mounting is performed in a state where moisture in a polyimide film of a film substrate has been substantially dried, or mounting is performed after conditioning under a fixed environment. Further, patterning of the film substrate is performed after similar drying processing or conditioning.

摘要翻译： 提供了一种制造方法，其中消除了安装期间的位置偏差，并且可以稳定30μm级间距的精细连接。 因此，可以通过伴随较小IC的成本降低来实现低成本设备。 在膜基材的聚酰亚胺膜中的水分已经基本干燥的状态下进行安装，或者在固定环境下进行调理后进行安装。 此外，在类似的干燥处理或调理之后进行膜基材的图案化。