公开(公告)号：US07651586B2

公开(公告)日：2010-01-26

申请号：US10920367

申请日：2004-08-18

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike

IPC分类号： C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC分类号： H01J37/32431 ,  C23C16/4401 ,  H01J2237/022

摘要： A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

摘要翻译： 一种用于从等离子体处理装置的室中除去颗粒的颗粒去除装置，其中所述室连接到排气口，并且在所述室中产生处理气体的等离子体，以等离子体处理待处理的基板，包括颗粒 充电控制构件，用于通过形成在除被处理基板附近的区域中的离子鞘区域的正离子正向地对室内产生的颗粒进行充电，其中带正电的颗粒经由排气口从室排出。 因此，没有等离子体干扰或金属污染，因此可以应用于实际应用。

公开(公告)号：US08052798B2

公开(公告)日：2011-11-08

申请号：US12632559

申请日：2009-12-07

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike

IPC分类号： B08B6/00

CPC分类号： H01J37/32431 ,  C23C16/4401 ,  H01J2237/022

摘要： A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

摘要翻译： 一种用于从等离子体处理装置的室中除去颗粒的颗粒去除装置，其中所述室连接到排气口，并且在所述室中产生处理气体的等离子体，以等离子体处理待处理的基板，包括颗粒 充电控制构件，用于通过形成在除被处理基板附近的区域中的离子鞘区域的正离子正向地对室内产生的颗粒进行充电，其中带正电的颗粒经由排气口从室排出。 因此，没有等离子体干扰或金属污染，因此可以应用于实际应用。

公开(公告)号：US08043971B2

公开(公告)日：2011-10-25

申请号：US12340256

申请日：2008-12-19

申请人： Yasuharu Sasaki ,  Tsuyoshi Moriya ,  Hiroshi Nagaike

发明人： Yasuharu Sasaki ,  Tsuyoshi Moriya ,  Hiroshi Nagaike

IPC分类号： H01L21/302

CPC分类号： H01J37/32642 ,  H01J37/32706 ,  H01L21/67069

摘要： [Problem to be Solved] In a plasma processing apparatus for executing a process using plasma, promoting the sharing of an apparatus in executing a plurality of different processes and plasma states amongst apparatuses in executing same processes in a plurality of apparatuses are provided.[Solution] A ring member formed of an insulating material is disposed to surround a to-be-treated substrate in a processing vessel and an electrode is installed in the ring member for adjusting a plasma sheath region. For example, a first DC voltage is applied to the electrode when a first process is performed on the to-be-treated substrate and a second DC voltage is applied to the electrode when a second process is performed on the to-be-treated substrate. In this case, the plasma state can be matched by applying an appropriate DC voltage according to each process or each apparatus executing the same process. Therefore, the sharing of an apparatus can be promoted and the plasma state can be readily adjusted.

摘要翻译： [待解决的问题]在用于执行使用等离子体的处理的等离子体处理装置中，提供了在执行多个装置中的相同处理的装置中执行多个不同处理和等离子体状态的共享的装置。 [解决方案]由绝缘材料形成的环形构件设置成围绕处理容器中的待处理衬底，并且电极安装在用于调整等离子体鞘区域的环构件中。 例如，当在待处理的基板上执行第一工艺时，将第一直流电压施加到电极，并且当对待处理的基板执行第二工艺时，向电极施加第二直流电压 。 在这种情况下，可以通过根据每个处理或执行相同处理的每个装置施加适当的DC电压来匹配等离子体状态。 因此，可以促进装置的共享，并且可以容易地调整等离子体状态。

公开(公告)号：US20100118302A1

公开(公告)日：2010-05-13

申请号：US12617235

申请日：2009-11-12

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Hideaki Yakushiji

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Hideaki Yakushiji

IPC分类号： G01N21/00 ,  G01N33/00

CPC分类号： H01L21/67288 ,  G01N21/91 ,  G01N21/94 ,  G01N21/9501

摘要： A foreign material detecting method for detecting a foreign material attached to a substrate surface includes a spraying step of spraying an organic solvent or an oil-phase material containing a halogen element to the substrate surface, a condensing step of emphasizing the foreign material by condensing the sprayed organic solvent or oil-phase material around the foreign material attached to the substrate surface by controlling a temperature of the substrate surface, and a surface inspecting step of detecting the foreign material emphasized by the condensation of the organic solvent or the oil-phase material by a surface inspecting device.

摘要翻译： 用于检测附着在基板表面上的异物的异物检测方法包括：向基板表面喷射含有卤素元素的有机溶剂或油相材料的喷射步骤，通过冷凝来强调异物的冷凝步骤 通过控制基板表面的温度，附着于基板表面的异物附近的喷涂有机溶剂或油相材料，以及检测由有机溶剂或油相材料的冷凝强调的异物的表面检查步骤 通过表面检查装置。

公开(公告)号：US20070209591A1

公开(公告)日：2007-09-13

申请号：US11683164

申请日：2007-03-07

申请人： Hiroshi NAGAIKE ,  Tsuyoshi Moriya

发明人： Hiroshi NAGAIKE ,  Tsuyoshi Moriya

IPC分类号： C23C16/00

CPC分类号： H01L21/67161 ,  G01N21/91 ,  G01N21/94 ,  G01N21/9501 ,  H01J37/023 ,  H01J37/256 ,  H01J2237/20228 ,  H01L21/6719 ,  H01L21/67213

摘要： A substrate processing system which enables a minute pieces of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

摘要翻译： 能够检测附着于基板表面的微小的异物的基板处理系统，适用于大量生产基板。 基板处理系统具有对基板进行预定处理的基板处理装置。 基板处理系统包括具有流体供给单元的基板表面处理装置，该流体供给单元向基板的表面供给包含改变在基板的表面露出的物质的变质物质的流体，以及检查基板表面检查装置 已经供应流体的基底的表面。

公开(公告)号：US08608422B2

公开(公告)日：2013-12-17

申请号：US10959197

申请日：2004-10-07

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Teruyuki Hayashi ,  Kaoru Fujihara

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Teruyuki Hayashi ,  Kaoru Fujihara

IPC分类号： H01L21/677 ,  H01L21/67 ,  C23C16/00

CPC分类号： H01L21/67069 ,  H01J2237/0048 ,  H01L21/67028

摘要： In order to prevent particles within a unit from sticking to a substrate in a substrate processing process, an ion generator charges the particles. At the same time, a direct current voltage of the same polarity as the charged polarity of the particles is applied from a direct current power source to the substrate. In order to prevent generation of particles when producing gas plasma, a high-frequency voltage is applied to the upper and lower electrodes at multiple stages to produce plasma. In other words, at a first step, a minimum high-frequency voltage at which plasma can be ignited is applied to the upper and lower electrodes, thereby producing a minimum plasma. Thereafter, the applied voltage is increased in stages to produce predetermined plasma.

摘要翻译： 为了防止单元中的颗粒在基板处理工艺中粘附到基板上，离子发生器对颗粒进行充电。 同时，从直流电源向衬底施加与粒子的带电极性相同极性的直流电压。 为了防止在产生气体等离子体时产生颗粒，在多个阶段向上下电极施加高频电压以产生等离子体。 换句话说，在第一步骤中，将等离子体可点燃的最小高频电压施加到上电极和下电极，从而产生最小等离子体。 此后，施加的电压分级地增加以产生预定的等离子体。

公开(公告)号：US07976637B2

公开(公告)日：2011-07-12

申请号：US11683164

申请日：2007-03-07

申请人： Hiroshi Nagaike ,  Tsuyoshi Moriya

发明人： Hiroshi Nagaike ,  Tsuyoshi Moriya

IPC分类号： B08B6/00 ,  C25F1/00

CPC分类号： H01L21/67161 ,  G01N21/91 ,  G01N21/94 ,  G01N21/9501 ,  H01J37/023 ,  H01J37/256 ,  H01J2237/20228 ,  H01L21/6719 ,  H01L21/67213

摘要： A substrate processing system which enables a minute pieces of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

摘要翻译： 能够检测附着于基板表面的微小的异物的基板处理系统，适用于大量生产基板。 基板处理系统具有对基板进行预定处理的基板处理装置。 基板处理系统包括具有流体供给单元的基板表面处理装置，该流体供给单元向基板的表面供给包含改变在基板的表面露出的物质的变质物质的流体，以及检查基板表面检查装置 已经供应流体的基底的表面。

公开(公告)号：US20050087136A1

公开(公告)日：2005-04-28

申请号：US10959197

申请日：2004-10-07

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Teruyuki Hayashi ,  Kaoru Fujihara

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Teruyuki Hayashi ,  Kaoru Fujihara

IPC分类号： B65G49/06 ,  C23C16/00 ,  H01L21/00 ,  H01L21/30 ,  H01L21/68

CPC分类号： H01L21/67069 ,  H01J2237/0048 ,  H01L21/67028

摘要： In order to prevent particles within a unit from sticking to a substrate in a substrate processing process, an ion generator charges the particles. At the same time, a direct current voltage of the same polarity as the charged polarity of the particles is applied from a direct current power source to the substrate. In order to prevent generation of particles when producing gas plasma, a high-frequency voltage is applied to the upper and lower electrodes at multiple stages to produce plasma. In other words, at a first step, a minimum high-frequency voltage at which plasma can be ignited is applied to the upper and lower electrodes, thereby producing a minimum plasma. Thereafter, the applied voltage is increased in stages to produce predetermined plasma.

摘要翻译： 为了防止单元中的颗粒在基板处理工艺中粘附到基板上，离子发生器对颗粒进行充电。 同时，从直流电源向衬底施加与粒子的带电极性相同极性的直流电压。 为了防止在产生气体等离子体时产生颗粒，在多个阶段向上下电极施加高频电压以产生等离子体。 换句话说，在第一步骤中，将等离子体可点燃的最小高频电压施加到上电极和下电极，从而产生最小等离子体。 此后，施加的电压分级地增加以产生预定的等离子体。

公开(公告)号：US20050039773A1

公开(公告)日：2005-02-24

申请号：US10920367

申请日：2004-08-18

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike

IPC分类号： H05H1/46 ,  B23K9/00 ,  C23C16/44 ,  C25F1/00 ,  C25F3/30 ,  H01J37/32 ,  H01L21/00 ,  H01L21/205 ,  H01L21/304 ,  H01L21/3065

CPC分类号： H01J37/32431 ,  C23C16/4401 ,  H01J2237/022

摘要： A particle removal apparatus for removing particles from a chamber of a plasma processing apparatus, wherein the chamber is connected to a gas exhaust port and a plasma of a processing gas is generated in the chamber to plasma process a substrate to be processed, includes a particle charging control member for positively charging particles generated within the chamber by positive ions of an ion sheath region formed in a region other than the vicinity of the substrate to be processed, wherein positively charged particles are discharged from the chamber via the gas exhaust port. Therefore, there is no plasma disturbance or metal contamination, and thus can be applied to a practical use.

摘要翻译： 一种用于从等离子体处理装置的室中除去颗粒的颗粒去除装置，其中所述室连接到排气口，并且在所述室中产生处理气体的等离子体，以等离子体处理待处理的基板，包括颗粒 充电控制构件，用于通过形成在除被处理基板附近的区域中的离子鞘区域的正离子正向地对室内产生的颗粒进行充电，其中带正电的颗粒经由排气口从室排出。 因此，没有等离子体干扰或金属污染，因此可以应用于实际应用。

公开(公告)号：US08243265B2

公开(公告)日：2012-08-14

申请号：US12617235

申请日：2009-11-12

申请人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Hideaki Yakushiji

发明人： Tsuyoshi Moriya ,  Hiroshi Nagaike ,  Hideaki Yakushiji

IPC分类号： G01N21/00

CPC分类号： H01L21/67288 ,  G01N21/91 ,  G01N21/94 ,  G01N21/9501

摘要： A foreign material detecting method for detecting a foreign material attached to a substrate surface includes a spraying step of spraying an organic solvent or an oil-phase material containing a halogen element to the substrate surface, a condensing step of emphasizing the foreign material by condensing the sprayed organic solvent or oil-phase material around the foreign material attached to the substrate surface by controlling a temperature of the substrate surface, and a surface inspecting step of detecting the foreign material emphasized by the condensation of the organic solvent or the oil-phase material by a surface inspecting device.

摘要翻译： 用于检测附着在基板表面上的异物的异物检测方法包括：向基板表面喷射含有卤素元素的有机溶剂或油相材料的喷射步骤，通过冷凝来强调异物的冷凝步骤 通过控制基板表面的温度，附着于基板表面的异物附近的喷涂有机溶剂或油相材料，以及检测由有机溶剂或油相材料的冷凝强调的异物的表面检查步骤 通过表面检查装置。