公开(公告)号：US20130205677A1

公开(公告)日：2013-08-15

申请号：US13789099

申请日：2013-03-07

Applicant: US Synthetic Corporation

Inventor： Kenneth E. Bertagnolli ,  David P. Miess ,  Jiang Qian ,  Jason K. Wiggins ,  Michael A. Vail ,  Debkumar Mukhopadhyay

IPC: B24D18/00

CPC classification number: E21B10/36 ,  B22F7/08 ,  B22F2998/00 ,  B24D18/00 ,  C22C26/00 ,  E21B10/5735 ,  F16C33/043 ,  F16C2352/00 ,  Y10T428/24612 ,  Y10T428/24996 ,  Y10T428/249967 ,  C22C29/08

Abstract: In an embodiment, a method of fabricating a polycrystalline diamond compact is disclosed. The method includes sintering a plurality of diamond particles in the presence of a metal-solvent catalyst to form a polycrystalline diamond body; leaching the polycrystalline diamond body to at least partially remove the metal-solvent catalyst therefrom, thereby forming an at least partially leached polycrystalline diamond body; and subjecting an assembly of the at least partially leached polycrystalline diamond body and a cemented carbide substrate to a high-pressure/high-temperature process at a pressure to infiltrate the at least partially leached polycrystalline diamond body with an infiltrant. The pressure of the high-pressure/high-temperature process is less than that employed in the act of sintering of the plurality of diamond particles.

Abstract translation: 在一个实施例中，公开了一种制造多晶金刚石致密体的方法。 该方法包括在金属 - 溶剂催化剂的存在下烧结多个金刚石颗粒以形成多晶金刚石体; 浸出多晶金刚石体至少部分地从其中去除金属 - 溶剂催化剂，从而形成至少部分浸出的多晶金刚石体; 以及使所述至少部分浸出的多晶金刚石体和硬质合金基底的组件在压力下经受高压/高温过程，以浸润剂渗透至少部分浸出的多晶金刚石体。 高压/高温过程的压力小于在多个金刚石颗粒的烧结过程中使用的压力。

公开(公告)号：US20210262295A1

公开(公告)日：2021-08-26

申请号：US17183478

申请日：2021-02-24

Applicant: US SYNTHETIC CORPORATION

Inventor： Kenneth E. Bertagnolli ,  David P. Miess ,  Jiang Qian ,  Jason K. Wiggins ,  Michael A. Vail ,  Debkumar Mukhopadhyay

IPC: E21B10/567 ,  B22F7/08 ,  C22C26/00 ,  E21B10/573 ,  E21B10/46 ,  E21B10/55 ,  E21B10/36

Abstract: In an embodiment, a method of fabricating a polycrystalline diamond compact is disclosed. The method includes sintering a plurality of diamond particles in the presence of a metal-solvent catalyst to form a polycrystalline diamond body; leaching the polycrystalline diamond body to at least partially remove the metal-solvent catalyst therefrom, thereby forming an at least partially leached polycrystalline diamond body; and subjecting an assembly of the at least partially leached polycrystalline diamond body and a cemented carbide substrate to a high-pressure/high-temperature process at a pressure to infiltrate the at least partially leached polycrystalline diamond body with an infiltrant. The pressure of the high-pressure/high-temperature process is less than that employed in the act of sintering of the plurality of diamond particles.

公开(公告)号：US10293467B2

公开(公告)日：2019-05-21

申请号：US15359019

申请日：2016-11-22

Applicant: US SYNTHETIC CORPORATION

Inventor： David P. Miess

IPC: B24D3/02 ,  B24D18/00 ,  B24D3/00 ,  B24D11/00 ,  C09K3/14

Abstract: Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

公开(公告)号：US09533398B2

公开(公告)日：2017-01-03

申请号：US14463587

申请日：2014-08-19

Applicant: US SYNTHETIC CORPORATION

Inventor： David P. Miess

IPC: B24D3/00 ,  B24D3/02 ,  B24D11/00 ,  B24D18/00 ,  C09K3/14

CPC classification number: B24D18/0009 ,  B22F3/14 ,  B22F5/085 ,  B22F7/06 ,  B22F2005/001 ,  B23B51/00 ,  B23B2226/315 ,  B23C5/10 ,  B23C2226/315 ,  B23G5/06 ,  B23G2225/165 ,  B24D99/005 ,  C22C26/00 ,  E21B10/573

Abstract: Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Abstract translation: 本发明的实施方案涉及制造具有结合到基材表面的多晶金刚石的部分的制品的方法和使用其制造的多晶金刚石压块。 在一个实施例中，公开了一种用于形成切割工具的模制技术，其包括结合到基底的外表面的多晶金刚石部分。

公开(公告)号：US20160230471A1

公开(公告)日：2016-08-11

申请号：US15134158

申请日：2016-04-20

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/567 ,  B24D18/00 ,  E21B4/00 ,  F16C33/04 ,  E21B10/55 ,  E21B10/573

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C17/02 ,  F16C17/04 ,  F16C33/04 ,  F16C33/043 ,  F16C33/26 ,  F16C2206/04 ,  F16C2352/00

Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.

Abstract translation: 通过划分PDC的底物，PDC的PCD表或两者，至少部分地减轻多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中的应力的方法的实施方案。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 还公开了包括至少一个应力释放分隔件的PDC实施例。

公开(公告)号：US20150314483A1

公开(公告)日：2015-11-05

申请号：US14266437

申请日：2014-04-30

Applicant: US Synthetic Corporation

Inventor： David P. Miess ,  Michael James Gleason ,  Samuel Earl Wilding ,  Regan Leland Burton ,  Paul Douglas Jones

IPC: B28D1/18 ,  E21C25/10 ,  E01C23/12 ,  E21C35/18 ,  E01C23/088

Abstract: Embodiments of the invention are directed to cutting tool assemblies, material-removing machines that include cutting tool assemblies, and methods of use and operation thereof. In some embodiments, the cutting tool assemblies described herein may be used in material-removing machines that may remove target material. For example, the cutting tool assemblies may include one or more superhard working surfaces and/or one or more shields.

Abstract translation: 本发明的实施例涉及切割工具组件，包括切割工具组件的材料去除机器，其使用方法和操作方法。 在一些实施例中，本文所述的切削工具组件可用于可移除目标材料的材料去除机器中。 例如，切割工具组件可以包括一个或多个超硬工作表面和/或一个或多个屏蔽件。

公开(公告)号：US09091132B1

公开(公告)日：2015-07-28

申请号：US13965851

申请日：2013-08-13

Applicant: US Synthetic Corporation

Inventor： Craig H. Cooley ,  Timothy N. Sexton ,  David P. Miess ,  Jeffrey B. Lund

IPC: E21B10/573

CPC classification number: E21B10/5673 ,  E21B10/42 ,  E21B10/55 ,  E21B10/573 ,  E21B10/5735 ,  E21B10/633 ,  E21B2010/562 ,  E21B2010/624

Abstract: A cutting element assembly for use on a rotary drill bit for forming a borehole in a subterranean formation. A cutting element assembly includes a cutting element having a substrate. The cutting element assembly additionally includes a superabrasive material bonded to the substrate. The substrate extends from an end surface to a back surface. A base member is also coupled to the back surface of the substrate. Additionally, a recess is defined in the base member and a structural element is coupled to the base member. The cutting element assembly also includes a biasing element configured to selectively bias the structural element.

Abstract translation: 一种在旋转钻头上用于在地层中形成钻孔的切割元件组件。 切割元件组件包括具有基底的切割元件。 切割元件组件另外包括结合到基底的超级磨料。 基板从端面延伸到后表面。 基底构件也耦合到衬底的背面。 此外，在基底构件中限定凹部，并且结构元件联接到基底构件。 切割元件组件还包括被配置为选择性地偏置结构元件的偏置元件。

公开(公告)号：US20140367177A1

公开(公告)日：2014-12-18

申请号：US14452206

申请日：2014-08-05

Applicant: US SYNTHETIC CORPORATION

Inventor： Jair J. Gonzalez ,  Kenneth E. Bertagnolli ,  Debkumar Mukhopadhyay ,  David P. Miess ,  Mark P. Chapman ,  Ronald W. Ward ,  Nicholas Christensen ,  Damon B. Crockett ,  Mohammad N. Sani

IPC: E21B10/567 ,  B24D18/00 ,  B24D3/06 ,  E21B10/55 ,  F16C33/04

CPC classification number: E21B10/567 ,  B24D18/00 ,  E21B4/003 ,  E21B10/55 ,  E21B10/5673 ,  E21B10/5676 ,  E21B10/5735 ,  F16C33/04 ,  F16C33/043 ,  F16C2206/04 ,  F16C2352/00

Abstract: Embodiments of methods for at least partially relieving stress within a polycrystalline diamond (“PCD”) table of a polycrystalline diamond compact (“PDC”) by partitioning the substrate of the PDC, the PCD table of the PDC, or both. Partitioning may be achieved through grinding, machining, laser cutting, electro-discharge machining, or combinations thereof. PDC embodiments including at least one stress relieving partition are also disclosed.

Abstract translation: 通过划分PDC的底物，PDC的PCD表或两者，至少部分地减轻多晶金刚石（“PDC”）的多晶金刚石（“PCD”）表中的应力的方法的实施方案。 分割可以通过研磨，机加工，激光切割，放电加工或其组合来实现。 还公开了包括至少一个应力释放分隔件的PDC实施例。

公开(公告)号：US12044075B2

公开(公告)日：2024-07-23

申请号：US17183478

申请日：2021-02-24

Applicant: US SYNTHETIC CORPORATION

Inventor： Kenneth E. Bertagnolli ,  David P. Miess ,  Jiang Qian ,  Jason K. Wiggins ,  Michael A. Vail ,  Debkumar Mukhopadhyay

IPC: E21B10/567 ,  B22F7/08 ,  C22C26/00 ,  E21B10/36 ,  E21B10/46 ,  E21B10/55 ,  E21B10/573 ,  B24D18/00 ,  F16C17/02 ,  F16C17/04 ,  F16C17/10 ,  F16C33/04 ,  F16C33/26

CPC classification number: E21B10/567 ,  B22F7/08 ,  C22C26/00 ,  E21B10/36 ,  E21B10/46 ,  E21B10/55 ,  E21B10/5735 ,  B22F2998/00 ,  B24D18/00 ,  F16C17/02 ,  F16C17/04 ,  F16C17/102 ,  F16C33/043 ,  F16C33/26 ,  F16C2352/00 ,  Y10T428/24612 ,  Y10T428/24996 ,  Y10T428/249967 ,  B22F2998/00 ,  C22C29/08

Abstract: In an embodiment, a method of fabricating a polycrystalline diamond compact is disclosed. The method includes sintering a plurality of diamond particles in the presence of a metal-solvent catalyst to form a polycrystalline diamond body; leaching the polycrystalline diamond body to at least partially remove the metal-solvent catalyst therefrom, thereby forming an at least partially leached polycrystalline diamond body; and subjecting an assembly of the at least partially leached polycrystalline diamond body and a cemented carbide substrate to a high-pressure/high-temperature process at a pressure to infiltrate the at least partially leached polycrystalline diamond body with an infiltrant. The pressure of the high-pressure/high-temperature process is less than that employed in the act of sintering of the plurality of diamond particles.

公开(公告)号：US11667011B2

公开(公告)日：2023-06-06

申请号：US16381274

申请日：2019-04-11

Applicant: US SYNTHETIC CORPORATION

Inventor： David P. Miess

IPC: B24D3/02 ,  B24D18/00 ,  B23C5/10 ,  B22F5/08 ,  B24D99/00 ,  C22C26/00 ,  B22F7/06 ,  B22F3/14 ,  B23G5/06 ,  E21B10/573 ,  B24D3/00 ,  B24D11/00 ,  B22F5/00 ,  B23B51/00

CPC classification number: B24D18/0009 ,  B22F3/14 ,  B22F5/085 ,  B22F7/06 ,  B23C5/10 ,  B23G5/06 ,  B24D99/005 ,  C22C26/00 ,  E21B10/573 ,  B22F2005/001 ,  B23B51/00 ,  B23B2226/315 ,  B23C2226/315 ,  B23G2225/165

Abstract: Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.