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公开(公告)号：US08098011B2
公开(公告)日：2012-01-17
申请号：US12819544
申请日：2010-06-21
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , F21K9/23 , F21K9/64 , F21L4/027 , F21S8/08 , F21W2131/103 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.
摘要翻译： 用于发光二极管的磷光体层布置。 一方面，提供了一种发光二极管装置，其包括至少一个发光二极管，覆盖至少一个发光二极管的封装，具有形成在底表面上的荧光体层的透镜，所述透镜被定位成至少覆盖 封装的一部分，以及荧光体层和封装之间的气隙。 一方面，提供一种发光二极管灯，其包括封装，至少一个发光二极管，覆盖所述至少一个发光二极管的封装，具有形成在底表面上的荧光体层的透镜，其中所述透镜是 定位成覆盖至少一部分封装，以及荧光体层和封装之间的气隙。
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公开(公告)号：US08089085B2
公开(公告)日：2012-01-03
申请号：US12393559
申请日：2009-02-26
申请人： Wei Shi
发明人： Wei Shi
CPC分类号： H01L33/648 , F21K9/64 , F21Y2115/10 , H01L33/483 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/19107 , H01L2924/00
摘要： An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a finned heat sink, can attach the heat sink base to the lens. Heat from the LED die can flow through the heat sink base to the heat sink, from which the heat can be dissipated. Similarly, heat from phosphors can flow through the lens to the heat sink, from which the heat can be dissipated. By removing heat from the LED die, more current can be used to drive the LED die, thus providing brighter light. By removing heat from the phosphors, desired colors can be more reliably provided.
摘要翻译： LED组件可以包括散热器基座，附接到散热器基座的至少一个LED管芯和透镜。 可以在透镜上形成一层或多层磷光体。 诸如散热片的散热器可以将散热器底座附接到透镜。 来自LED模具的热量可以通过散热器底座流到散热器，从而散热。 类似地，来自磷光体的热可以通过透镜流到散热器，热量可从该散热器消散。 通过从LED芯片去除热量，可以使用更多的电流来驱动LED管芯，从而提供更亮的光线。 通过从磷光体去除热量，可以更可靠地提供所需的颜色。
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公开(公告)号：US08076693B2
公开(公告)日：2011-12-13
申请号：US12893422
申请日：2010-09-29
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/644 , H01L25/0753 , H01L33/38 , H01L33/507 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.
摘要翻译： 用于LED的散热器可以包括导热和光学透明构件。 散热器的底侧可以被配置为附着到LED的发光侧。 散热器的顶表面和/或底表面可以在其上形成荧光体层。 散热器可以被配置为将热量从LED传导到包装。 散热器可以被配置为将热量从磷光体传导到封装。 通过促进从LED和磷光体去除热量，可以使用更多的电流来驱动LED。 使用更多的电流有助于构建更亮的LED，其可以用于诸如手电筒，显示器和一般照明的应用中。 通过促进从磷光体去除热量，可以更好地提供所需的颜色。
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公开(公告)号：US07980865B2
公开(公告)日：2011-07-19
申请号：US11315854
申请日：2005-12-22
申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
发明人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
IPC分类号： H01R12/00
CPC分类号： H05K7/1061 , Y10T29/49117
摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.
摘要翻译： 可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。 侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。 在一些实施例中，凸起边缘可以具有闭合的几何形状。 然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。 此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。 这增加了连接的电效率及其安全性。
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公开(公告)号：US20110092003A1
公开(公告)日：2011-04-21
申请号：US12978913
申请日：2010-12-27
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , F21K9/23 , F21K9/64 , F21L4/027 , F21S8/08 , F21W2131/103 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.
摘要翻译： 用于发光二极管的磷光体层布置。 一方面，提供了一种发光二极管装置，其包括至少一个发光二极管，覆盖至少一个发光二极管的封装，具有形成在底表面上的荧光体层的透镜，所述透镜被定位成至少覆盖 封装的一部分，以及荧光体层和封装之间的气隙。 一方面，提供一种发光二极管灯，其包括封装，至少一个发光二极管，覆盖所述至少一个发光二极管的封装，具有形成在底表面上的荧光体层的透镜，其中所述透镜是 定位成覆盖至少一部分封装，以及荧光体层和封装之间的气隙。
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公开(公告)号：US07892870B2
公开(公告)日：2011-02-22
申请号：US12701366
申请日：2010-02-05
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L21/00
CPC分类号： F21V29/713 , F21K9/00 , H01L24/32 , H01L33/385 , H01L33/483 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2924/12041 , H01L2924/15747 , H01L2924/00
摘要： A method and system for removing heat from an LED facilitates the fabrication of LEDs having enhanced brightness. A thermally conductive interposer can be attached to the top of the LED. Heat can flow through the top of the LED and into the interposer. The interposer can carry the heat away from the LED. Light can exit the LED though an at least partially transparent substrate of the LED. By removing heat from an LED, the use of more current through the LED is facilitated, thus resulting in a brighter LED.
摘要翻译： 用于从LED去除热量的方法和系统有助于制造具有增强的亮度的LED。 导热插入件可以连接到LED的顶部。 热量可以流过LED的顶部并进入插入器。 插入器可以将热量从LED中散发出来。 光可以通过LED的至少部分透明的基板离开LED。 通过从LED去除热量，便于使用通过LED的更多电流，从而产生更亮的LED。
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公开(公告)号：US07851819B2
公开(公告)日：2010-12-14
申请号：US12393491
申请日：2009-02-26
申请人： Wei Shi
发明人： Wei Shi
IPC分类号： H01L33/00
CPC分类号： H01L33/644 , H01L25/0753 , H01L33/38 , H01L33/507 , H01L33/58 , H01L33/62 , H01L33/642 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader for an LED can include a thermally conductive and optically transparent member. The bottom side of the heat spreader can be configured to attach to a light emitting side of the LED. The top and/or bottom surface of the heat spreader can have a phosphor layer formed thereon. The heat spreader can be configured to conduct heat from the LED to a package. The heat spreader can be configured to conduct heat from the phosphors to the package. By facilitating the removal of heat from the LED and phosphors, more current can be used to drive the LED. The use of more current facilitates the construction of a brighter LED, which can be used in applications such as flashlights, displays, and general illumination. By facilitating the removal of heat from the phosphors, desired colors can be better provided.
摘要翻译： 用于LED的散热器可以包括导热和光学透明构件。 散热器的底侧可以被配置为附着到LED的发光侧。 散热器的顶表面和/或底表面可以在其上形成荧光体层。 散热器可以被配置为将热量从LED传导到包装。 散热器可以被配置为将热量从磷光体传导到封装。 通过促进从LED和磷光体去除热量，可以使用更多的电流来驱动LED。 使用更多的电流有助于构建更亮的LED，其可以用于诸如手电筒，显示器和一般照明的应用中。 通过促进从磷光体去除热量，可以更好地提供所需的颜色。
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公开(公告)号：US20100253248A1
公开(公告)日：2010-10-07
申请号：US12819544
申请日：2010-06-21
申请人： Wei Shi
发明人： Wei Shi
CPC分类号： H01L33/507 , F21K9/23 , F21K9/64 , F21L4/027 , F21S8/08 , F21W2131/103 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.
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公开(公告)号：US20100213808A1
公开(公告)日：2010-08-26
申请号：US12393559
申请日：2009-02-26
申请人： Wei Shi
发明人： Wei Shi
CPC分类号： H01L33/648 , F21K9/64 , F21Y2115/10 , H01L33/483 , H01L33/507 , H01L33/58 , H01L2924/0002 , H01L2924/19107 , H01L2924/00
摘要： An LED assembly can include a heat sink base, at least one LED die attached to the heat sink base, and a lens. One or more layers of phosphor can be formed upon the lens. A heat sink, such as a finned heat sink, can attach the heat sink base to the lens. Heat from the LED die can flow through the heat sink base to the heat sink, from which the heat can be dissipated. Similarly, heat from phosphors can flow through the lens to the heat sink, from which the heat can be dissipated. By removing heat from the LED die, more current can be used to drive the LED die, thus providing brighter light. By removing heat from the phosphors, desired colors can be more reliably provided.
摘要翻译： LED组件可以包括散热器基座，附接到散热器基座的至少一个LED管芯和透镜。 可以在透镜上形成一层或多层磷光体。 诸如散热片的散热器可以将散热器底座附接到透镜。 来自LED模具的热量可以通过散热器底座流到散热器，从而散热。 类似地，来自磷光体的热可以通过透镜流到散热器，热量可从该散热器消散。 通过从LED芯片去除热量，可以使用更多的电流来驱动LED管芯，从而提供更亮的光线。 通过从磷光体去除热量，可以更可靠地提供所需的颜色。
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公开(公告)号：US20100141182A1
公开(公告)日：2010-06-10
申请号：US12705216
申请日：2010-02-12
申请人： Wei Shi
发明人： Wei Shi
CPC分类号： H01L33/507 , F21K9/23 , F21K9/64 , F21L4/027 , F21S8/08 , F21W2131/103 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.
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