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    LED lamp and method of making the same
    22.
    发明授权
    LED lamp and method of making the same 有权
    LED灯及其制作方法

    公开(公告)号：US08414160B2

    公开(公告)日：2013-04-09

    申请号：US13158962

    申请日：2011-06-13

    Applicant: Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    Inventor： Chih-Hsuan Sun ,  Wei-Yu Yeh ,  Tien-Ming Lin

    IPC: F21V29/00

    CPC classification number: F21V29/74 ,  F21K9/232 ,  F21K9/90 ,  F21V3/02 ,  F21Y2101/00 ,  F21Y2115/10 ,  Y10T29/49002

    Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

    Abstract translation: 照明装置包括具有朝向外侧的中心部分的小面的多面散热器。 小面形成中央封闭部分，并且散热器还具有多个翅片，其中每个翅片放置在相邻小面之间并从散热器向外突出。 照明装置还具有安装有半导体发射体的多个电路板。 每个电路板安装在散热器的相应面上。 所述照明装置还具有覆盖所述多个电路板的光扩散壳体，与所述电路板连通并可操作以将功率转换为与所述半导体发射体兼容的功率模块，以及与所述电力电连通的电源连接器组件 模块。

    Lighting device for direct and indirect lighting
    24.
    发明授权
    Lighting device for direct and indirect lighting 有权
    直接和间接照明的照明设备

    公开(公告)号：US09140421B2

    公开(公告)日：2015-09-22

    申请号：US13209258

    申请日：2011-08-12

    Applicant: Wei-Yu Yeh ,  Pei-Wen Ko

    Inventor： Wei-Yu Yeh ,  Pei-Wen Ko

    IPC: F21V21/00 ,  F21V29/00 ,  F21S8/04 ,  F21V7/00 ,  F21Y101/02

    CPC classification number: F21S8/04 ,  F21V7/0016 ,  F21V29/20 ,  F21V29/70 ,  F21Y2115/10 ,  Y10T29/4913 ,  Y10T29/49146

    Abstract: A lighting device includes a first heat sink having a first surface and a second surface opposite the first surface, a second heat sink having a third surface and a fourth surface opposite the third surface. The third surface of the second heat sink is bonded to the second surface of the first heat sink. The lighting device further includes a plurality of first light emitting diode (LED) modules mounted on the first surface of the first heat sink; and a plurality of second light emitting diode (LED) modules mounted on the fourth surface of the second heat sink. One or more the first LED modules generally radiates lights in a first direction. One or more the second LED modules generally radiates lights in a second direction. The first and second LED modules are covered by respective non-reflective caps. The first LED module and the second LED module are configured to be selectively turned on or off according to a predefined algorithm. The first LED modules are arranged on an outer region of the lighting device, and the second LED modules are arranged on an inner region of the lighting device. The inner region is circumferentially surrounded by the outer region.

    Abstract translation: 照明装置包括具有第一表面和与第一表面相对的第二表面的第一散热器，第二散热器具有与第三表面相对的第三表面和第四表面。 第二散热器的第三表面结合到第一散热器的第二表面。 照明装置还包括安装在第一散热器的第一表面上的多个第一发光二极管（LED）模块; 以及安装在第二散热器的第四表面上的多个第二发光二极管（LED）模块。 一个或多个第一LED模块通常沿第一方向辐射灯。 一个或多个第二LED模块通常沿第二方向辐射灯。 第一和第二LED模块被相应的非反射盖覆盖。 第一LED模块和第二LED模块被配置为根据预定义的算法选择性地打开或关闭。 第一LED模块布置在照明装置的外部区域上，并且第二LED模块布置在照明装置的内部区域上。 内部区域由外部区域周向地包围。

    Color temperature adjustment for LED lamps using switches
    25.
    发明授权
    Color temperature adjustment for LED lamps using switches 有权
    使用开关的LED灯的色温调节

    公开(公告)号：US08669722B2

    公开(公告)日：2014-03-11

    申请号：US13209327

    申请日：2011-08-12

    Applicant: Wei-Yu Yeh ,  Chih-Hsuan Sun

    Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

    IPC: H05B37/00 ,  H05B39/00 ,  H05B41/00 ,  H05B37/02 ,  H05B39/04 ,  H05B41/36 ,  G05F1/00 ,  G01J5/60

    CPC classification number: H05B33/0863 ,  H05B33/0824 ,  H05B33/0869

    Abstract: A light-emitting diode (LED) lamp includes a number of different color LEDs that can be turned on and off in different combinations using an external switch operable by a user. A user or a controller can adjust the color temperature of light output by the lamp. The color temperature change may be a user preference and can compensate for decreased phosphor efficiency over time.

    Abstract translation: 发光二极管（LED）灯包括许多不同颜色的LED，可以使用可由用户操作的外部开关以不同的组合打开和关闭。 用户或控制器可以调节灯输出的光的色温。 色温变化可能是用户偏好，并且可以补偿随时间降低的磷光体效率。

    Light emitting diode light bar module with electrical connectors formed by injection molding
    26.
    发明授权
    Light emitting diode light bar module with electrical connectors formed by injection molding 有权
    具有电连接器的发光二极管灯条模块，通过注射成型形成

    公开(公告)号：US08591251B2

    公开(公告)日：2013-11-26

    申请号：US13557315

    申请日：2012-07-25

    Applicant: Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    Inventor： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC: H01R13/00

    CPC classification number: B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

    Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

    Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

    CHANGING LED LIGHT OUTPUT DISTRIBUTION THROUGH COATING CONFIGURATION
    27.
    发明申请
    CHANGING LED LIGHT OUTPUT DISTRIBUTION THROUGH COATING CONFIGURATION 有权
    通过涂层配置更改LED光输出分布

    公开(公告)号：US20130242550A1

    公开(公告)日：2013-09-19

    申请号：US13420927

    申请日：2012-03-15

    Applicant: Dong Jung Suen ,  Chih-Hsun Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu

    Inventor： Dong Jung Suen ,  Chih-Hsun Sun ,  Wei-Yu Yeh ,  Hsueh-Hung Fu

    IPC: F21V7/00 ,  H05K13/00 ,  F21V11/00

    CPC classification number: F21K9/56 ,  F21K9/64 ,  F21V3/049 ,  F21V3/10 ,  F21V7/005 ,  F21V29/673 ,  F21Y2115/10 ,  H01L33/504 ,  Y10T29/49002

    Abstract: The present disclosure provides a lighting instrument. The lighting instrument includes a recessed light fixture, for example a troffer light or a batten light. The light fixture includes a plurality of light-emitting diode (LED) devices located on a board. The light fixture also includes a diffuser cap located on the board and housing the LED devices therein. The diffuser cap includes a plurality of coating regions. Each coating region is coated by a film containing white particles. The white particles can reflect and diffuse light emitted by the LED devices. The film in each coating region has a different white particle concentration level than other coating regions.

    Abstract translation: 本公开提供了一种照明器具。 照明器具包括凹入的灯具，例如灯光或灯条灯。 灯具包括位于板上的多个发光二极管（LED）装置。 灯具还包括位于板上的扩散器帽，并将LED器件容纳在其中。 扩散器盖包括多个涂覆区域。 每个涂层区域被含有白色颗粒的膜包覆。 白色颗粒可以反射和漫射由LED器件发出的光。 每个涂层区域中的膜具有与其它涂覆区域不同的白色颗粒浓度水平。

    LED THERMAL PROTECTION STRUCTURES
    29.
    发明申请
    LED THERMAL PROTECTION STRUCTURES 有权
    LED热保护结构

    公开(公告)号：US20130187571A1

    公开(公告)日：2013-07-25

    申请号：US13353572

    申请日：2012-01-19

    Applicant: Wei-Yu Yeh

    Inventor： Wei-Yu Yeh

    IPC: H05B37/02 ,  H01L33/64

    CPC classification number: H01L25/167 ,  H01L33/64 ,  H01L2924/0002 ,  H05B33/089 ,  Y02B20/341 ,  H01L2924/00

    Abstract: The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. A light-emitting device disposed on a first region of the substrate. The apparatus includes a thermistor disposed on a second region of the substrate. The second region is substantially spaced apart from the first region. The thermistor is thermally and electrically coupled to the light-emitting device. The present disclosure also discloses a method of thermally protecting an LED device. The method includes providing a substrate having a light-emitting diode (LED) die disposed thereon. The method includes detecting a temperature of the LED die using a negative temperature coefficient (NTC) thermistor. The NTC thermistor is positioned on a region of the substrate substantially away from the LED die. The method includes adjusting an electrical current of the LED die in response to the detecting.

    Abstract translation: 本公开公开了一种用于热保护LED装置的装置。 该装置包括基板。 1.一种发光器件，其设置在所述基板的第一区域上。 该装置包括设置在基板的第二区域上的热敏电阻。 第二区域与第一区域基本间隔开。 热敏电阻热电耦合到发光器件。 本公开还公开了一种热保护LED器件的方法。 该方法包括提供具有设置在其上的发光二极管（LED）裸片的衬底。 该方法包括使用负温度系数（NTC）热敏电阻检测LED管芯的温度。 NTC热敏电阻位于基板远离LED管芯的区域上。 该方法包括响应于检测来调整LED管芯的电流。

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