摘要:
A chemical-mechanical polishing process includes the steps of providing a semiconductor substrate having a first conductive line thereon, and then forming at least one dielectric layer over the substrate and the first conductive line. Next, a chemical-mechanical polishing method is used to polish the surface of the dielectric layer. Thereafter, a cap layer is formed over the polished dielectric layer. The method of forming the cap layer includes depositing silicon oxide using a chemical vapor deposition method with silicane (SiH4) or tetra-ethyl-ortho-silicate (TEOS) as the main reactive agent. Alternatively, the cap layer can be formed by depositing silicon nitride using a chemical vapor deposition method with silicane or silicon dichlorohydride (SiH2Cl2) as the main reactive agent. Finally, a via opening is formed through the dielectric layer and the cap layer, and a second conductive line that couples electrically with the first conductive line through the via opening.
摘要:
A chemical-mechanical polishing process for forming a conductive interconnect includes the steps of providing a semiconductor substrate having a first conductive line thereon, and then forming at least one dielectric layer over the substrate and the first conductive line. Next, a chemical-mechanical polishing method is used to polish the surface of the dielectric layer. Thereafter, a cap layer is formed over the polished dielectric layer. The method of forming the cap layer includes depositing silicon oxide using a chemical vapor deposition method with silicane (SiH.sub.4) or tetra-ethyl-ortho-silicate (TEOS) as the main reactive agent. Alternatively, the cap layer can be formed by depositing silicon nitride using a chemical vapor deposition method with silicane or silicon dichlorohydride (SiH.sub.2Cl.sub.2) as the main reactive agent. Finally, a via opening is formed through the dielectric layer and the cap layer, and a second conductive line that couples electrically with the first conductive line through the via opening.
摘要:
A monitor method for testing probe pins is described in this invention. In accordance with the method of the present invention, a particular probe pin with short, deformity or unstable contact is identified.
摘要:
A method for forming enhanced field oxide (FOX) region of low voltage devices in a high voltage process is disclosed. The method includes providing a semiconductor structure comprising a substrate, two field oxide regions on the substrate, a well between the two field oxide regions in the substrate and a silicon nitride layer between the two field oxide regions above the well. As a key step, nitrogen is implanted into the semiconductor structure, and the silicon nitride layer is then removed. Then, a gate oxide layer on the well and silicon oxynitride layer on the field oxide regions are all formed in-situ.
摘要:
A method for fabricating a photodiode is described in which a pad oxide layer and a silicon nitride layer are sequentially formed on a provided substrate. The silicon nitride layer, and the pad oxide layer and the substrate are sequentially patterned to form an opening in the substrate. A spacer is formed on the sidewall of the opening. With the spacer and the silicon nitride layer serving as a mask, the substrate is etched forming a trench in the substrate. An oxide plug is then formed filling the trench and the opening using the conventional shallow trench fabrication method. A P-well region and an N-well region are formed respectively on two sides of the trench. An N+ type region and a P+ type region are formed respectively on two sides of the opening; wherein the N+ type region is located above the P-well region and the P+ type region is located above the N-well region
摘要:
A method of fabricating a shallow trench isolation includes formation of a trench in a substrate. An oxide layer is formed on the substrate to fill the trench. A barrier layer and a coating layer are formed in sequence over the substrate. A first etching step is performed to remove a portion of the coating layer and the oxide layer to at least expose the oxide layer on the mask layer. A second etching step is performed to remove the other portion of the coating layer and the oxide layer until exposing the mask layer. Thus, micro-scratches and defects do not happen and thus the invention prevents the occurrence of bridging effect and short circuits.
摘要:
A method for manufacturing mixed-mode devices that can eliminate watermarks resulting from the formation of residues at the dead corner space of an inverted trapezium-shaped structure at the upper end of a shallow trench during dual gate-oxide processing operation. This method uses the same chemical processing conditions for etching the oxide layer and the removal of photoresist layer, so that no watermarks remain after the etching and cleaning processes. MOS transistors are formed over the thin gate oxide layer region and the thick gate oxide region are of, two types, each having a different gate oxide layer thickness so that each has a different operating voltage.
摘要:
A method of forming a via. A substrate having a first conductive layer thereon is provided. An inter-metal dielectric layer is formed over the substrate layer by high density plasma chemical vapor deposition. An etch stop layer is formed on the inter-metal dielectric layer. An oxide layer is formed on the etch stop layer. The oxide layer is defined, so that a shallow opening aligned with the first conductive layer is formed to exposed the inter-metal dielectric layer. The inter-metal dielectric layer is etched away within the shallow opening until the first conductive layer is exposed. The opening is filled with a second conductive layer. The oxide layer is defined by photolithography and etching with a first selectivity, with which the oxide layer has a comparable etching rate to the etch stop layer. The inter-metal dielectric layer is etched with a second selectivity, with which the inter-metal dielectric layer has an etching rate higher than the etch stop layer.
摘要:
A method for forming a double spacer structure comprising the steps of first providing a semiconductor substrate that has a first gate and a second gate already formed thereon, wherein the gate length of the second gate is greater than the gate length of the first gate. Then, a first insulating layer is formed over the substrate and the gates. Next, a photoresist layer is formed over the first insulating layer above the second gate while exposing the first insulating layer above the first gate. Subsequently, a first etching operation is performed to establish a first spacer structure along the sidewalls of the first gate, and then the photoresist layer is removed leaving the first insulating layer over the second gate. Thereafter, a second insulating layer is formed over the substrate, the first gate and the first insulating layer, and then a second etching operation is performed to establish a second spacer structure along the sidewalls of the second gate. Therefore, a second spacer that has a width greater than the first spacer does is finally obtained.
摘要:
A manufacturing method applicable for forming a via connection to the thin film transistor in a SRAM unit which resolves the problems arising from a conventional method for forming a via for linking up the drain of a load transistor with the gate of a driver transistor in a SRAM unit by changing the processing sequence and also by forming a plug instead of a via.