公开(公告)号：US07425822B2

公开(公告)日：2008-09-16

申请号：US11747216

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US06246581B1

公开(公告)日：2001-06-12

申请号：US09415740

申请日：1999-10-12

申请人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： H05K720

CPC分类号： H05K1/0212 ,  H01L23/345 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K2201/09263 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1115 ,  H05K2203/1121 ,  H05K2203/165 ,  H01L2924/00

摘要： A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing and attached to a printed circuit board through an interconnect including a heating element embedded therein.

摘要翻译： 一种用于集成电路芯片模块的冷却组件，其中蒸发器冷却的IC模块封装在绝缘壳体内，并通过包括嵌入其中的加热元件的互连件附接到印刷电路板。

公开(公告)号：US06233960B1

公开(公告)日：2001-05-22

申请号：US09417187

申请日：1999-10-12

申请人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： F25D2312

CPC分类号： H01L23/445 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

摘要翻译： 一种用于集成电路芯片模块的冷却组件，其中点冷却蒸发器与模块内的集成芯片相对的位置安装在模块的帽子上。

公开(公告)号：US6125036A

公开(公告)日：2000-09-26

申请号：US415755

申请日：1999-10-12

申请人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2224/16 ,  H01L2924/00014

摘要： A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.

摘要翻译： 一种用于集成电路芯片模块的冷却组件，其中蒸发器冷却的IC模块封装在其外壁表面上具有防潮层的绝缘壳体内。

公开(公告)号：US6122926A

公开(公告)日：2000-09-26

申请号：US415653

申请日：1999-10-12

申请人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

发明人： Sukhvinder Kang ,  Howard Victor Mahaney, Jr. ,  Roger R. Schmidt ,  Prabjit Singh

IPC分类号： H01L23/427 ,  F25D23/12

CPC分类号： H01L23/427 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/3011

摘要： A cooling assembly for an integrated circuit (IC) chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a low thermal conductivity barrier between its inner and outer walls of insulation.

摘要翻译： 一种用于集成电路（IC）芯片模块的冷却组件，其中蒸发器冷却的IC模块封装在绝缘壳体内，其绝缘体的内壁和外壁之间具有低导热性阻挡层。

公开(公告)号：US5808236A

公开(公告)日：1998-09-15

申请号：US827745

申请日：1997-04-10

申请人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

发明人： Johnny Roy Brezina ,  John Saunders Corbin, Jr. ,  Howard Victor Mahaney, Jr. ,  James Robert Taylor

IPC分类号： H01L23/40 ,  H01L23/26

CPC分类号： H01L23/4093 ,  H01L2924/0002

摘要： An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

摘要翻译： 因此，装置和方法将不同散热器的阵列安装到在数据处理系统内使用的数据处理元件的紧密排列的阵列。 该装置包括在底部具有多个孔的金属框架，以允许接近将提供散热器的装置的顶部。 金属框架具有允许访问下面的数据处理元件的顶部的多个孔。 金属框架用作用于多个散热器的容纳车辆，并且还将其中设备附接到印刷电路板的拐角的特别脆弱的附近的印刷电路板提供刚性。