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公开(公告)号：US20120268931A1
公开(公告)日：2012-10-25
申请号：US13537936
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
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22.发明授权Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination 有权具有串联连接用于一般照明的LED的固态光片或条带的制造方法公开(公告)号：US08198109B2
公开(公告)日：2012-06-12
申请号：US13044456
申请日：2011-03-09
IPC分类号： H01L21/00
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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23.发明申请公开(公告)号：US20110193106A1
公开(公告)日：2011-08-11
申请号：US13079717
申请日：2011-04-04
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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24.发明申请Solid State Light Sheet for General Illumination Having Substrates for Creating Series Connection of Dies 有权用于一般照明的固态照明板，具有用于创建连接模块的基板公开(公告)号：US20110193105A1
公开(公告)日：2011-08-11
申请号：US13079706
申请日：2011-04-04
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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公开(公告)号：US20120268932A1
公开(公告)日：2012-10-25
申请号：US13538093
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
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26.发明申请Manufacturing Methods for Solid State Light Sheet or Strip with LEDs Connected in Series for General Illumination 有权固态灯片或带状LED的制造方法，串联连接用于一般照明公开(公告)号：US20110193114A1
公开(公告)日：2011-08-11
申请号：US13044456
申请日：2011-03-09
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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公开(公告)号：US08210716B2
公开(公告)日：2012-07-03
申请号：US12917319
申请日：2010-11-01
IPC分类号： F21S4/00
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
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28.发明申请Solid State Light Sheet Having Wide Support Substrate and Narrow Strips Enclosing LED Dies In Series 有权具有广泛支撑衬底和窄带的固态灯片封装LED模组系列公开(公告)号：US20110204390A1
公开(公告)日：2011-08-25
申请号：US13100231
申请日：2011-05-03
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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公开(公告)号：US20110198632A1
公开(公告)日：2011-08-18
申请号：US13096846
申请日：2011-04-28
IPC分类号： H01L27/15
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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公开(公告)号：US08461602B2
公开(公告)日：2013-06-11
申请号：US13018330
申请日：2011-01-31
IPC分类号： H01L29/00
CPC分类号： H01L25/0753 , F21K9/27 , F21S8/06 , F21Y2103/10 , F21Y2115/10 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
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