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    METHOD OF CONTROLLING PROCESS PARAMETERS FOR SEMICONDUCTOR MANUFACTURING APPARATUS
    21.
    发明申请
    METHOD OF CONTROLLING PROCESS PARAMETERS FOR SEMICONDUCTOR MANUFACTURING APPARATUS 失效
    控制半导体制造装置工艺参数的方法

    公开(公告)号：US20090177310A1

    公开(公告)日：2009-07-09

    申请号：US12052024

    申请日：2008-03-20

    申请人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D. Nguyen ,  Chunlei Zhang

    发明人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D. Nguyen ,  Chunlei Zhang

    IPC分类号： G06F17/00 ,  G05D23/32

    CPC分类号： G05D23/1904 ,  G05B11/42 ,  H01L21/67098 ,  H01L21/67248

    摘要： Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.

    摘要翻译： 半导体制造设备中自动控制工艺参数的方法和系统。 一个实施例提供了PID控制器在配方步骤中的增益调度。 一个实施例提供了一种用于在半导体制造过程中控制卡盘温度的方法，该方法在PID控制器中采用第一组比例积分微分（PID）值来控制第一设定点的卡盘温度， 一个过程配方，并且在该PID控制器中采用第二组PID值来控制在第二设定点不同于第一设定点的卡盘温度。 方法和系统提供了减少的控制器响应时间，其中过程配方的步骤之间的过程参数设定范围广泛。

    Convertible combination of attire and backpack with network communication and intelligent sensing features
    22.
    发明授权
    Convertible combination of attire and backpack with network communication and intelligent sensing features 有权

    公开(公告)号：US11470948B2

    公开(公告)日：2022-10-18

    申请号：US17166253

    申请日：2021-02-03

    申请人： Chunlei Zhang ,  Yin Sheng Zhang

    发明人： Chunlei Zhang ,  Yin Sheng Zhang

    IPC分类号： A45F3/04 ,  H04W84/18 ,  G16Y40/35 ,  G06F1/16 ,  G16Y30/00 ,  A45F3/00

    摘要： The application introduces the technology of Internet of Things into field of attire design, and creates a communicative and sensitive device: the composite and convertible attire with network communication and intelligent sensitive features, referred to as COMS Attire, its purpose is to liberate mobile devices from “hand-held” mode, and use the convertibility of attire to protect and enhance intelligent elements. Attire is big in size, large in capacity, deformable in shape, attachable and detachable in structure, and its carried items can be exposed and concealed at will. Attire is a daily necessity in people's lives, and the most suitable place for development of new generation of mobile intelligent device to replace the miniaturized traditional mobile one; the technical achievements of hardware “miniaturization” make COMS attire more intelligent, more fashionable and popular with users. COMS attire increases the choice of chip types, and expands the installation space of intelligent components.

    Methods and apparatus for rapidly responsive heat control in plasma processing devices
    25.
    发明授权
    Methods and apparatus for rapidly responsive heat control in plasma processing devices 有权
    等离子体处理装置中快速响应热控制的方法和装置

    公开(公告)号：US09155134B2

    公开(公告)日：2015-10-06

    申请号：US12253657

    申请日：2008-10-17

    申请人： Chunlei Zhang ,  Richard Fovell ,  Ezra Robert Gold ,  Ajit Balakrishna ,  James P. Cruse

    发明人： Chunlei Zhang ,  Richard Fovell ,  Ezra Robert Gold ,  Ajit Balakrishna ,  James P. Cruse

    IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H05B7/18 ,  H01J37/32 ,  H01L21/67

    CPC分类号： H05B7/18 ,  H01J37/32724 ,  H01J2237/2001 ,  H01L21/67069

    摘要： Methods and apparatus for regulating the temperature of a component in a plasma-enhanced process chamber are provided herein. In some embodiments, an apparatus for processing a substrate includes a process chamber and an RF source to provide RF energy to form a plasma in the process chamber. A component is disposed in the process chamber so as to be heated by the plasma when formed. A heater is configured to heat the component and a heat exchanger is configured to remove heat from the component. A chiller is coupled to the heat exchanger via a first flow conduit having an on/off flow control valve disposed therein and a bypass loop to bypass the flow control valve, wherein the bypass loop has a flow ratio valve disposed therein.

    摘要翻译： 本文提供了用于调节等离子体增强处理室中的组分的温度的方法和装置。 在一些实施例中，用于处理衬底的装置包括处理室和RF源，以提供RF能量以在处理室中形成等离子体。 一个部件设置在处理室中，以便在形成时被等离子体加热。 加热器被配置为加热部件并且热交换器被配置成从部件移除热量。 冷却器通过具有设置在其中的开/关流量控制阀的第一流动管道和旁路循环来耦合到热交换器，旁路回路绕过流量控制阀，其中旁路回路具有设置在其中的流量比阀。

    Methods and apparatus for tuning matching networks
    26.
    发明授权
    Methods and apparatus for tuning matching networks 有权
    调整匹配网络的方法和装置

    公开(公告)号：US08513889B2

    公开(公告)日：2013-08-20

    申请号：US12899048

    申请日：2010-10-06

    申请人： Chunlei Zhang ,  Sergio F. Shoji ,  Andrey Semenin ,  Kartik Ramaswamy ,  James P. Cruse ,  Bryan Liao

    发明人： Chunlei Zhang ,  Sergio F. Shoji ,  Andrey Semenin ,  Kartik Ramaswamy ,  James P. Cruse ,  Bryan Liao

    IPC分类号： H03H7/38

    CPC分类号： H03H7/40 ,  H01J37/32183 ,  H01J37/32935 ,  H05H1/46

    摘要： Methods and apparatus for tuning matching networks are provided herein. A method of tuning a matching network includes providing a matching network coupling an RF source to a load, the matching network having a tunable element disposed at a first set point; increasing a value of the tunable element by a first step above the first set point; sensing a first adjusted value of a reflected RF power; decreasing the value of the tunable element by the first step below the first set point; sensing a second adjusted value of the reflected RF power; comparing the first and the second adjusted values of the reflected RF power; and moving the tunable element to a second set point that corresponds to a position having a lowest adjusted value of the reflected RF power. The method may be repeated until the reflected RF power falls within an acceptable reflected RF power range.

    摘要翻译： 本文提供了用于调整匹配网络的方法和装置。 调整匹配网络的方法包括提供将RF源耦合到负载的匹配网络，所述匹配网络具有设置在第一设定点处的可调谐元件; 通过在第一设定点之上的第一步增加可调元件的值; 感测反射RF功率的第一调整值; 将可调谐元件的值降低到低于第一设定点的第一步; 感测反射RF功率的第二调整值; 比较反射RF功率的第一和第二调整值; 以及将所述可调元件移动到对应于具有所述反射RF功率的最低调整值的位置的第二设定点。 可以重复该方法，直到反射的RF功率落在可接受的反射RF功率范围内。