摘要:
A system and method which is capable of compensating for unintended elevations in process temperatures induced in a substrate during a semiconductor fabrication process in order to reduce or eliminate disparities in critical dimensions of device features. The system may be a plasma etching system comprising a process chamber containing an electrostatic chuck (ESC) for supporting a wafer substrate. A chiller outside the process chamber includes a main coolant chamber, which contains a main coolant fluid, as well as an compensation coolant chamber, which contains an compensation coolant fluid. A main circulation loop normally circulates the main coolant fluid from the main coolant chamber through the electrostatic chuck to maintain the chuck at a desired set point temperature.
摘要:
A system and method for forming a resistor system is provided. An embodiment comprises a resistor formed in a U-shape. The resistor may comprise multiple layers of conductive materials, with a dielectric layer filling the remainder of the U-shape. The resistor may be integrated with a dual metal gate manufacturing process or may be integrated with multiple types of resistors.
摘要:
In an embodiment, an oligoaniline exfoliating agent, as shown in Formula (I), is provided. In Formula (I), R is —H or —NH2, and n is 3 to 30. In another embodiment, exfoliated platelet-shaped clay including the oligoaniline exfoliating agent and a method for preparing the exfoliated platelet-shaped clay are provided.
摘要:
A memory device comprises a memory array, a status register coupled with the memory array, and a security register coupled with the memory array and the status register. The memory array contains a number of memory blocks configured to have independent access control. The status register includes at least one protection bit indicative of a write-protection status of at least one corresponding block of the memory blocks that corresponds to the protection bit. The security register includes at least one register-protection bit. The register-protection bit is programmable to a memory-protection state for preventing a state change of at least the protection bit of the status register. The register-protection bit is configured to remain in the memory-protection state until the resetting of the memory device.
摘要:
A sense amplifying method, applied in a memory having a memory cell and a reference cell, includes: charging the memory cell and the reference cell to have a cell current and a reference current, respectively; duplicating the cell current and the reference current to respectively generate a mirrored cell current via a first current path and a mirrored reference current via a second current path and equalizing a first voltage drop generated as the mirrored cell current flows by the first current path and a second voltage drop generated as the mirrored reference current flows by the second current path; and removing the equalization of the first voltage drop and the second voltage drop and adjusting first voltage drop and the second voltage drop according to a first current flowing by the first current path and a second current flowing by the second current path.
摘要:
An output buffer circuit has a variable output drive strength, depending on a buffer enable signal. Multiple output buffer circuits have a variable combined output drive strength, depending on a set of buffer enable signals.
摘要:
A semiconductor structure comprising an SRAM/inverter cell and a method for forming the same are provided, wherein the SRAM/inverter cell has an improved write margin. The SRAM/inverter cell includes a pull-up PMOS device comprising a gate dielectric over the semiconductor substrate, a gate electrode on the gate dielectric wherein the gate electrode comprises a p-type impurity and an n-type impurity, and a stressor formed in a source/drain region. The device drive current of the pull-up PMOS device is reduced due to the counter-doping of the gate electrode.
摘要:
Various embodiments increase the speed of communication over a multi-mode bus by communicating data over multiple pins in the same direction. The bus includes multiple data communication pins communicating over the bus. The bus includes a chip select pin indicating whether communication is occurring between the integrated circuit and another integrated circuit. The bus includes a clock pin. The bus includes a mode control circuit. In one mode, two of the data communication pins communicate in opposite directions between the integrated circuit and another integrated circuit. In another mode, two of the data communication pins communicate in a same direction between the integrated circuit and another integrated circuit. In some embodiments, the bus follows a Serial Peripheral Interface standard. In various embodiments, data is communicated from the integrated circuit to another integrated circuit, or from another integrated circuit to the integrated circuit.
摘要:
A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.
摘要:
A detachable projection module and an electronic device having the same integrate an optical engine and an image processing unit into an independent detachable module, where the module case is fixedly connected to a device body of the electronic device, so that projection module can receive image signals from the electronic device and convert the received image signals into projection signals to be projected onto a surface near the device body of the electronic device. Through a dedicated or generic connector interface, the detachable projection module may be removed from one electronic device and be mounted to another electronic device, giving an electronic device capability of equipping a projection module to extend the electronic device with a secondary display or empower an electronic device, which has no display at first, with display ability.