公开(公告)号：US20100051330A1

公开(公告)日：2010-03-04

申请号：US12447977

申请日：2007-07-18

申请人： Kenichi Yamashita ,  Yoshiki Nakatani ,  Akitsugu Hatano

发明人： Kenichi Yamashita ,  Yoshiki Nakatani ,  Akitsugu Hatano

IPC分类号： H05K1/03

CPC分类号： H05K3/323 ,  C09J9/02 ,  G02F1/13452 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K1/0366 ,  H05K3/361 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/0665 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wiring board formed by mounting an IC chip on a mounting substrate includes a resin substrate and a wiring pattern. The resin substrate includes having a reinforcing material obtained by impregnating glass fibers with a resin and an organic layer provided on a surface of the reinforcing material. The wiring pattern is disposed on a surface of the resin substrate through a coating layer. The IC chip includes a bump electrode for connection with the wiring pattern. The resin substrate includes a fiber exposure portion through which the reinforcing material is exposed, and the IC chip is fixed to the mounting substrate through an ACF adhered to the fiber exposure portion with the connection electrode being connected to the wiring pattern.

摘要翻译： 通过将IC芯片安装在安装基板上而形成的布线基板包括树脂基板和布线图案。 树脂基板包括具有通过用设置在增强材料的表面上的树脂和有机层浸渍玻璃纤维而获得的增强材料。 布线图案通过涂层设置在树脂基板的表面上。 IC芯片包括用于与布线图案连接的凸块电极。 树脂基板包括曝光了增强材料的光纤曝光部，并且通过连接电极与布线图案连接的光纤曝光部分的ACF将IC芯片固定在安装基板上。

公开(公告)号：US08316907B2

公开(公告)日：2012-11-27

申请号：US12527932

申请日：2007-11-13

申请人： Akitsugu Hatano ,  Yoshiki Nakatani ,  Hisao Ochi

发明人： Akitsugu Hatano ,  Yoshiki Nakatani ,  Hisao Ochi

IPC分类号： B65H69/00

CPC分类号： B65H19/1852 ,  B29C65/02 ,  B29C65/48 ,  B29C65/5042 ,  B29C66/1142 ,  B29C66/43 ,  B29C66/71 ,  B29C66/8322 ,  B29C66/853 ,  B29C2035/0827 ,  B29K2079/08 ,  B65H19/28 ,  B65H19/30 ,  B65H20/30 ,  B65H23/048 ,  B65H2301/414227 ,  Y10T156/1712 ,  B29K2081/06 ,  B29K2069/00 ,  B29K2067/003 ,  B29K2067/00 ,  B29K2033/08

摘要： Substrate material processing equipment includes: a substrate material conveying section receiving a substrate material from a first line and conveying it to a second line; a first substrate material dividing section dividing the substrate material; a substrate material recovery section recovering the substrate material from its start edge formed by division; a substrate material supply section supplying a substrate material to an end edge of the substrate material which is formed by division; a first substrate material joining section joining the end edge of the substrate material to a start edge of the substrate material supplied from the substrate material supply section; a second substrate material dividing section provided between the substrate material supply section and the first substrate material joining section; a third substrate material dividing section provided between the first line and the substrate material recovery section; and a second substrate material joining section joining a start edge of the substrate material which is formed by division by the third substrate material dividing section to an end edge of the substrate material which is formed by division by the second substrate material dividing section.

摘要翻译： 基板材料加工设备包括：基板材料输送部分，从第一线路接收基板材料并将其输送到第二线路; 分割所述基板材料的第一基板材料分割部; 基板材料回收部，从通过分割形成的起始边缘回收所述基板材料; 基板材料供给部，其将基板材料供给到通过分割而形成的基板材料的端部边缘; 将基板材料的端缘连接到从基板材料供给部供给的基板材料的起始边缘的第一基板材料接合部; 第二基板材料分割部，设置在所述基板材料供给部与所述第一基板材料接合部之间; 第三基板材料分割部，设置在第一线和基板材料回收部之间; 以及第二基板材料接合部，其将通过由第三基板材料分割部分割形成的基板材料的起始边缘接合到由第二基板材料分割部分分割形成的基板材料的端部边缘。

公开(公告)号：US6069674A

公开(公告)日：2000-05-30

申请号：US649298

申请日：1996-05-17

申请人： Shigeru Aomori ,  Yoshiki Nakatani

发明人： Shigeru Aomori ,  Yoshiki Nakatani

IPC分类号： G02F1/133 ,  G02F1/1335 ,  G02F1/1339 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/135

CPC分类号： G02F1/1335 ,  G02F1/13318 ,  G02F1/13394 ,  G02F1/136 ,  G02F1/136277

摘要： The liquid crystal display apparatus of the invention includes a device-formed substrate, a counter substrate, and a liquid crystal layer interposed therebetween. The device-formed substrate includes: a plurality of display electrodes for applying display voltages to the liquid crystal layer; a plurality of active devices for supplying the display voltages to the plurality of display electrodes, respectively; and image inputting devices for inputting an image. In the liquid crystal display apparatus, image processing means is provided for processing the image input by the image inputting devices.

摘要翻译： 本发明的液晶显示装置包括器件形成基板，对置基板和夹在其间的液晶层。 所述器件形成衬底包括：用于向液晶层施加显示电压的多个显示电极; 多个用于将显示电压分别提供给多个显示电极的有源器件; 以及用于输入图像的图像输入装置。 在液晶显示装置中，提供图像处理装置，用于处理由图像输入装置输入的图像。