公开(公告)号：USD582951S1

公开(公告)日：2008-12-16

申请号：US29290753

申请日：2008-01-10

申请人： Yoshihiro Yamaguchi ,  Kazuhiro Kuraoka

设计人： Yoshihiro Yamaguchi ,  Kazuhiro Kuraoka

公开(公告)号：US07400007B2

公开(公告)日：2008-07-15

申请号：US11305202

申请日：2005-12-19

申请人： Syotaro Ono ,  Yusuke Kawaguchi ,  Yoshihiro Yamaguchi ,  Hirobumi Matsuki ,  Kiyotaka Arai

发明人： Syotaro Ono ,  Yusuke Kawaguchi ,  Yoshihiro Yamaguchi ,  Hirobumi Matsuki ,  Kiyotaka Arai

IPC分类号： H01L27/108

CPC分类号： H01L29/7813 ,  H01L29/0696

摘要： A power MOSFET includes an n-type drift layer and a p-type base layer formed in a layered manner on the n-type drift layer. Trench gates are formed to penetrate the p-type base layer to reach the n-type drift layer. On the p-type base layer, n+-type source regions and p+-type regions are formed. These n+-type source regions and p+-type regions are arranged alternately along a longitudinal direction of the trench gates. The n+-type source regions and the p+-type regions are arranged with a slant with respect to the longitudinal direction of the trench gates.

摘要翻译： 功率MOSFET包括在n型漂移层上分层形成的n型漂移层和p型基极层。 形成沟槽栅极以穿透p型基极层以到达n型漂移层。 在p型基底层上形成n + +型源区和p + + +型区。 这些n + + +型源极区域和p + + +区域沿沟槽栅极的纵向方向交替布置。 相对于沟槽栅极的纵向方向，n + P +型源极区域和p + H +型区域以倾斜的方式排列。

公开(公告)号：US20080116512A1

公开(公告)日：2008-05-22

申请号：US11943181

申请日：2007-11-20

申请人： Yusuke Kawaguchi ,  Miwako Akiyama ,  Yoshihiro Yamaguchi

发明人： Yusuke Kawaguchi ,  Miwako Akiyama ,  Yoshihiro Yamaguchi

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7811 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7813

摘要： A semiconductor device includes a first conductivity type layer and a second conductivity type layer, which are alternately and repeatedly positioned, adjacent to each other, in a column-like fashion on a first conductivity type substrate. The balance of the net charge amount of the impurity between the first conductivity type layer formed under a second conductivity type base layer in the termination region of the semiconductor device and the second conductivity type layer adjacent to the first conductivity type layer is imbalanced in comparison to the balance of the net charge amount of the impurity between the first conductivity type layer in the device-forming region of the semiconductor device and the second conductivity type layer adjacent to the first conductivity type layer.

摘要翻译： 半导体器件包括在第一导电类型衬底上以列状方式彼此相邻地交替地和重复地定位的第一导电类型层和第二导电类型层。 半导体器件的端接区域内的第二导电型基底层下方形成的第一导电型层与第一导电型层相邻的第二导电型层之间的杂质的净电荷量的平衡与第 半导体器件的器件形成区域中的第一导电型层与第一导电型层相邻的第二导电型层之间的杂质的净电荷量的平衡。

公开(公告)号：US20080099837A1

公开(公告)日：2008-05-01

申请号：US11924175

申请日：2007-10-25

申请人： Miwako AKIYAMA ,  Akio Nakagawa ,  Yusuke Kawaguchi ,  Syotaro Ono ,  Yoshihiro Yamaguchi

发明人： Miwako AKIYAMA ,  Akio Nakagawa ,  Yusuke Kawaguchi ,  Syotaro Ono ,  Yoshihiro Yamaguchi

IPC分类号： H01L29/94

CPC分类号： H01L29/7813 ,  H01L29/0623 ,  H01L29/0634 ,  H01L29/1095 ,  H01L29/41766

摘要： This semiconductor device an epitaxial layer of a first conductivity type formed on a surface of the first semiconductor layer, and a base layer of a second conductivity type formed on a surface of the epitaxial layer. A diffusion layer of a first conductivity type is selectively formed in the base layer, and a trench penetrates the base layer to reach the epitaxial layer. A gate electrode is formed in the trench through the gate insulator film formed on the inner wall of the trench. A first buried diffusion layer of a second conductivity type is formed in the epitaxial layer deeper than the bottom of the gate electrode. A second buried diffusion layer connects the first buried diffusion layer and the base layer and has a resistance higher than that of the first buried diffusion layer.

摘要翻译： 该半导体器件形成在第一半导体层的表面上的第一导电类型的外延层和形成在外延层的表面上的第二导电类型的基极层。 在基底层中选择性地形成第一导电类型的扩散层，并且沟槽穿透基底层以到达外延层。 通过形成在沟槽内壁上的栅极绝缘膜，在沟槽中形成栅电极。 在比栅电极的底部更深的外延层中形成第二导电类型的第一掩埋扩散层。 第二掩埋扩散层连接第一掩埋扩散层和基底层，并且具有比第一掩埋扩散层的电阻高的电阻。

公开(公告)号：US20080093347A1

公开(公告)日：2008-04-24

申请号：US11907838

申请日：2007-10-18

申请人： Yoshihiro Yamaguchi ,  Takahiro Iriyama

发明人： Yoshihiro Yamaguchi ,  Takahiro Iriyama

IPC分类号： H05H1/36 ,  B23K9/10 ,  H05H1/26

CPC分类号： H05H1/36

摘要： In a main circuit 11 of the plasma cutter power supply device 6, a plurality of DC power units 14-1, . . . 14-n of low capacity are connected in parallel on their DC output sides, and are connected to a plasma torch 20. Each power unit 14-1, . . . 14-n can operate asynchronously and independently from each other. The power supply control device 6 controls the number of power units to be operated, and the intensity of output electrical current at which each of them is to be operated, according to the cutting conditions (the nature of the material to be cut, its thickness, and the cutting speed) and according to the number of power units which can be operated. If some of the power units are faulty, the power supply control device 6 controls the cutting conditions which can be accepted, according to the number of normal power units.

摘要翻译： 在等离子切割器电源装置6的主电路11中，多个直流电力单元14-1， 。 。 14 -n的低容量在其直流输出侧并联连接，并连接到等离子体焰炬20。 每个电源单元14-1，。 。 。 14 -n可以彼此异步和独立地操作。 电源控制装置6根据切割条件（待切割材料的性质，其厚度等）来控制要操作的功率单元的数量和要各自操作的输出电流的强度 ，切割速度）以及可以操作的动力单元的数量。 如果一些动力单元有故障，则电源控制装置6根据正常功率单元的数量来控制可以接受的切割条件。

公开(公告)号：US20080066596A1

公开(公告)日：2008-03-20

申请号：US11596677

申请日：2005-05-20

申请人： Yoshihiro Yamaguchi ,  Satoshi Ohnishi

发明人： Yoshihiro Yamaguchi ,  Satoshi Ohnishi

IPC分类号： B26D5/02 ,  B23K26/08 ,  B23K7/10 ,  B26D1/00 ,  B26D5/00

CPC分类号： F16P3/147 ,  B23K7/002 ,  B23K7/10 ,  B23K10/00 ,  B23K10/006 ,  B23K26/0876 ,  B23K26/142 ,  B23K26/38 ,  B23K26/702 ,  B23K37/006 ,  B23K2101/18 ,  B23Q15/08 ,  F16P3/141 ,  F16P3/144 ,  G05B2219/43124 ,  G05B2219/45044 ,  G05B2219/49074 ,  Y10T83/05 ,  Y10T83/081 ,  Y10T83/8726

摘要： In a thermal cutting machine such as plasma cutting machine or a laser cutting machine, control of the moving speed of a cutting head (24) is improved so as to increase throughput of the cutting machine with increase in cost restricted. Products are cut out one by one from a plate member (14) while a cutting head (24) is moved relative to the plate member (14) on a table (12). In this process, when the cutting head (24) is fast-forwarded without performing cutting to a position at which cutting of each product starts, the speed of movement in the direction (Y-axis direction) along a short side of the table (12) is controlled at a speed higher than that of the movement in the direction (X-axis direction) along a long side of the table. The pattern of a sequence of cutting out the products from the plate member (14) is a meandering pattern in which reciprocation in the Y-axis direction dominates and the movement in the X-direction is one time one way. Exhaust chambers are arranged in the X-axis direction in the table (12), and the exhaust chambers are driven as the cutting head (24) moves in the X-axis direction.

摘要翻译： 在诸如等离子切割机或激光切割机之类的热切割机中，提高了切割头（24）的移动速度的控制，从而在成本受到限制的情况下增加切割机的生产量。 当切割头（24）相对于板构件（14）移动到工作台（12）上时，从板构件（14）逐个切割产品。 在该过程中，当切割头（24）不进行切割到每个产品的切割开始的位置而快进时，沿着桌子的短边方向（Y轴方向）的移动速度 12）以比桌子长边方向（X轴方向）移动速度高的速度进行控制。 从板构件（14）切出产品的顺序的图案是在Y轴方向上的往复运动占主导地位且X方向移动一次的曲折图案。 在台（12）中排列室沿X轴方向排列，当切割头（24）沿X轴方向移动时，排气室被驱动。

公开(公告)号：US07301178B2

公开(公告)日：2007-11-27

申请号：US11212602

申请日：2005-08-29

申请人： Yoshihiro Yamaguchi ,  Kenji Oota

发明人： Yoshihiro Yamaguchi ,  Kenji Oota

IPC分类号： H01L29/74

CPC分类号： H01L29/0661 ,  H01L24/72 ,  H01L29/0615 ,  H01L29/0657 ,  H01L29/32 ,  H01L29/74 ,  H01L2924/0102 ,  H01L2924/1301 ,  H01L2924/00

摘要： A P++-type first diffusion layer is formed by diffusing P-type impurities on a front side of an N−-type semiconductor substrate, and an N-type fourth diffusion layer which is shallower than the first diffusion layer is formed by diffusing N-type impurities on the front side, and a P-type second diffusion layer is locally formed in a ring-shape so as to be exposed on the lateral side by diffusing P-type impurities on the back side, and P-type impurities are diffused on the back side of the substrate and a P+-type third diffusion layer is locally formed so as to be distributed inward from the second diffusion layer and not to be exposed to the lateral side, and the P-type second diffusion layer and the P+-type third diffusion layer are formed in the two-stage structure, thereby various characteristics can be improved.

摘要翻译： AP ++类型的第一扩散层是通过在N +型半导体衬底的正面扩散P型杂质形成的，N型第四扩散层 通过在前侧扩散N型杂质而形成比第一扩散层浅的层，并且P型第二扩散层局部形成为环状，以便通过扩散P而暴露在侧面 型杂质，P型杂质扩散到基板的背面，局部地形成P +型第三扩散层，以从第二层向内分布 扩散层并且不暴露于侧面，并且P型第二扩散层和P + +型第三扩散层形成在两级结构中，因此可以有各种特性 改进。

公开(公告)号：US20070262410A1

公开(公告)日：2007-11-15

申请号：US11742133

申请日：2007-04-30

申请人： Syotaro Ono ,  Yusuke Kawaguchi ,  Yoshihiro Yamaguchi ,  Miwako Akiyama

发明人： Syotaro Ono ,  Yusuke Kawaguchi ,  Yoshihiro Yamaguchi ,  Miwako Akiyama

IPC分类号： H01L29/00

CPC分类号： H01L29/872 ,  H01L27/0727 ,  H01L29/66143 ,  H01L29/8725

摘要： A semiconductor device includes: a semiconductor layer of a first conductivity type, a plurality of trenches provided on a major surface side of the semiconductor layer, an insulating film provided on an inner wall surface and on top of the trench, a conductive material surrounded by the insulating film and filling the trench, a first semiconductor region of a second conductivity type provided between the trenches, a second semiconductor region of the first conductivity type provided in a surface portion of the first semiconductor region, a mesa of the semiconductor layer provided between the trenches of a Schottky barrier diode region adjacent to a transistor region including the first semiconductor region and the second semiconductor region, a control electrode connected to the conductive material filling the trench of the transistor region and a main electrode provided in contact with a surface of the first semiconductor region, the second semiconductor region, a surface of the mesa and a part of the conductive material filling the trench of the Schottky barrier diode region. The part is exposed through the insulating film.

摘要翻译： 半导体器件包括：第一导电类型的半导体层，设置在半导体层的主表面侧的多个沟槽，设置在内壁表面上和沟槽顶部上的绝缘膜，由 绝缘膜并填充沟槽，设置在沟槽之间的第二导电类型的第一半导体区域，设置在第一半导体区域的表面部分中的第一导电类型的第二半导体区域，设置在第一半导体区域之间的半导体层的台面 与包括第一半导体区域和第二半导体区域的晶体管区域相邻的肖特基势垒二极管区域的沟槽，连接到填充晶体管区域的沟槽的导电材料的控制电极和与第一半导体区域和第二半导体区域的表面接触的主电极 第一半导体区域，第二半导体区域，台面的表面 以及填充肖特基势垒二极管区域的沟槽的导电材料的一部分。 该部件通过绝缘膜曝光。

公开(公告)号：US20070241083A1

公开(公告)日：2007-10-18

申请号：US11630141

申请日：2005-06-20

申请人： Yoshihiro Yamaguchi ,  Tetsuya Kabata ,  Ikuo Kamada

发明人： Yoshihiro Yamaguchi ,  Tetsuya Kabata ,  Ikuo Kamada

IPC分类号： B23K26/08 ,  B23K10/00

CPC分类号： B23P23/00 ,  B23K10/006 ,  B23K26/0093 ,  B23K26/0876 ,  B23K26/38 ,  B23K28/02 ,  B23K37/0229 ,  B23K37/0235 ,  B23K2101/18

摘要： A hybrid thermal cutting apparatus has both a laser head and a plasma torch, both of which can be controlled independently, can perform both laser processing and plasma processing, thus reducing the running costs. A large number of cutting lines for cutting out various types of manufactured products from plate materials are classified into a laser cutting type and a plasma cutting type, according to the cutting length, whether they are the external periphery of manufactured products or apertures, the size of the manufactured products or the apertures, the required process accuracy, the plate thickness, or the like. The lines of the laser cutting type are cut by laser processing, while the lines of the plasma cutting type are cut by plasma processing.

摘要翻译： 混合热切割装置具有激光头和等离子体焰炬，它们都可以独立控制，可以进行激光加工和等离子体处理，从而降低运行成本。 根据切割长度，无论是制造产品或孔的外围，大量用于从板材切割各种类型的制造产品的切割线分为激光切割型和等离子切割型，尺寸 的制造产品或孔，所需的加工精度，板厚等。 通过激光加工切割激光切割类型的线，而通过等离子体处理切割等离子体切割类型的线。

公开(公告)号：US20070066654A1

公开(公告)日：2007-03-22

申请号：US11513174

申请日：2006-08-31

申请人： Shozo Koyama ,  Yoshihiro Yamaguchi

发明人： Shozo Koyama ,  Yoshihiro Yamaguchi

IPC分类号： A61K31/445 ,  A61K31/40 ,  A61K31/13 ,  A61K31/12

CPC分类号： C11D3/0084 ,  A01N35/06 ,  A61K8/35 ,  A61K31/12 ,  A61K31/122 ,  A61K31/13 ,  A61K31/40 ,  A61K31/445 ,  A61Q5/02 ,  A61Q19/00 ,  C08F2/38

摘要： A method for inhibiting or blocking molecular generating and/or inducing functions of molecules using an inhibitory or blocking agent of the formula: wherein R1-6 are as defined herein.

摘要翻译： 使用下式的抑制性或阻断剂抑制或阻断分子产生和/或诱导分子功能的方法：其中R1-6如本文所定义。