Abstract:
A high-speed MOS-technology power device integrated structure includes a plurality of elementary functional units formed in a lightly doped semiconductor layer of a first conductivity type, the elementary functional units including channel regions of a second conductivity type covered by a conductive insulated gate layer including a polysilicon layer; the conductive insulated gate layer also including a highly conductive layer superimposed over the polysilicon layer and having a resistivity much lower than the resistivity of the polysilicon layer, so that a resistance introduced by the polysilicon layer is shunted with a resistance introduced by the highly conductive layer and the overall resistivity of the insulated gate layer is lowered.
Abstract:
The present invention relates to an electronic power on reset circuit of the type including a comparator having at least two inputs and one output for receiving a first reference signal from a generator block and a second signal proportional to a supply voltage from a divider block and for producing an output initialization signal. Advantageously the output is connected to a third turn off enablement input of the comparator through the series of an inverter pair. The generator block and the divider block also include respective turn off enablement inputs connected downstream of the inverter pair.
Abstract:
The electronic interface circuit can perform ratiometric processing and driving of a signal generated by a fuel-level detector of a vehicle. The circuit uses a current mirror configured so as to send one half of the output current to the input resistance and one half of the output current to earth. The current mirror is controlled by a voltage taken from the input resistance and by a voltage taken from a resistive divider, the latter voltage having been filtered by a low-pass filter, so as to achieve ratiometric processing of the input signal.
Abstract:
A process for simultaneously fabricating memory cells, transistors, and diodes for protecting the tunnel oxide layer of the cells, using the DPCC process wherein the first polysilicon layer is not removed from the transistor area, and the gate regions of the transistors are formed by shorted first and second polysilicon layers. To form the diodes, the polyl layer is removed from the active areas in which the diodes are to be formed, using the same mask employed for shaping polyi; the interpoly dielectric layer and the gate oxide layer are removed from the active areas of the diodes, using the same mask employed for removing the dielectric layer from the transistor area; a second polysilicon layer is deposited directly on to the active areas of the diodes; and the poly2 doping ions penetrate the active areas to form N+ regions which, together with the substrate, constitute the protection diodes. The diodes are thus formed prior to shaping poly2, and are connected to the control gates of the cells by the second polycrystalline silicon layer strips forming the word lines.
Abstract:
A circuit for controlling the reserve lamp of a vehicle's fuel level indicator instrument. The circuit uses a switch controlled by an extremely asymmetric clock signal periodically to switch, for a very short time, the signal provided by the level sensor coupled to a comparator operable to compare this signal with a threshold value for the purpose of determining the state of the reserve lamp.
Abstract:
Circuit for immunizing an integrated circuit from noise affecting external enable signals of the integrated circuit generated during switching of circuit blocks internal to the integrated circuit, comprising first means for detecting a switching of said circuit blocks and for driving second means for forcedly activating internal enable signals of the integrated circuit depending on said external enable signals, in order to forcedly maintain said internal control signals activated during said switching of said circuit blocks.
Abstract:
A MOS-gated power device includes a plurality of elementary functional units, each elementary functional unit including a body region of a first conductivity type formed in a semiconductor material layer of a second conductivity type having a first resistivity value. Under each body region a respective lightly doped region of the second conductivity type is provided having a second resistivity value higher than the first resistivity value.
Abstract:
An SQTV processor is for converting a video signal received at an interlaced scanning frequency of 50 or 60 Hz to an interlaced scanning frequency of 100 or 120 Hz, respectively, and implementing algorithms for noise filtering and of edge definition. The process includes: an analog-digital converter (ADC) of analog input signals of luminance and chrominance; at least a field memory (FIELD MEMORY.sub.-- 1), or more preferably two similar field memories, where digital blocks of luminance (Y) value and blocks of values of each one of the two chrominance (U, V) components of the converted video signals are stored; one "First-In-First-Out" (LINE MEMORY) register for digital values read from the field memory containing the pixels of a whole line of each field; a noise filtering block (NOISE REDUCTION); a sampling frequency converter (SRC) of the fields from 50 or 60 Hz to 100 or 120 Hz; a conversion circuit for the vertical format (VFC), an edge definition (PE) enhancement circuit; and a digital-to-analog converter (DAC) of the processed luminance and chrominance (YUV) signals. The processor further includes a compressing and coding circuit for the converted video signals according to an adaptive differential pulse code modulation (ADPCM) scheme of the digital values to be stored in the field memory (FIELD MEMORY.sub.-- 1) and an ADPCM decoding and decompressing circuit for data read from the field memory (FIELD MEMORY.sub.-- 1). The significative reduction of the total memory requisite produced by the ADPCM pre-compression makes the entire system more readily integratable on a single chip.
Abstract:
A high-speed MOS-technology power device integrated structure includes a plurality of elementary functional units formed in a lightly doped semiconductor layer of a first conductivity type, the elementary functional units including channel regions of a second conductivity type covered by a conductive insulated gate layer including a polysilicon layer; the conductive insulated gate layer also including a highly conductive layer superimposed over the polysilicon layer and having a resistivity much lower than the resistivity of the polysilicon layer, so that a resistance introduced by the polysilicon layer is shunted with a resistance introduced by the highly conductive layer and the overall resistivity of the conductive insulated gate layer is lowered.
Abstract:
The chemoresistive gas sensor comprises a heating element integrated in a dedicated SOI substrate having an air gap in the intermediate oxide layer between two wafers of monocrystalline silicon. A sensitive element of tin oxide is formed over the heating element and separated from it by a dielectric insulating and protective layer. A trench formed at the end of the fabrication of the device, extends from the surface of the wafer in which the heating element is integrated, up to the air gap to mechanically separate and insulate the sensitive element from the rest of the chip, thereby improving the mechanical characteristics sensitivity and response of the sensor.