公开(公告)号：US20190054658A1

公开(公告)日：2019-02-21

申请号：US16116132

申请日：2018-08-29

申请人： LatticeGear, LLC

发明人： Gal Moyal

IPC分类号： B28D5/00 ,  B26D5/00 ,  B26F3/00

CPC分类号： B28D5/0011 ,  B26D5/007 ,  B26F3/002 ,  B28D5/0023 ,  B28D5/0052

摘要： A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis perpendicular to the top surface of the sample; providing a breaking pin located under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, a cleaving bar for applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin. Further, the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

公开(公告)号：US20150191846A1

公开(公告)日：2015-07-09

申请号：US14422077

申请日：2013-08-16

申请人： GTAT Corporation

发明人： Ian T. Witting ,  Vikram Singh ,  Ning Duanmu

IPC分类号： C30B11/14 ,  C30B29/06 ,  C30B11/02

CPC分类号： C30B11/14 ,  B28D5/0023 ,  C30B11/02 ,  C30B29/06 ,  C30B33/06 ,  C30B35/00

摘要： Systems and methods that reduce the overall cost of producing a silicon ingot are provided herein. More specifically, one or more surface pieces may be sliced from a silicon boule in relation to a plurality of nodes at a particular orientation. These one or more surface pieces may then be formed into one or more seeds having a specific length, width and thickness usable in a silicon ingot growth process. By utilizing these pieces to form one or more seeds, pieces of a boule which would have been previously discarded may now be used to form high quality seeds for use in a silicon ingot grow process.

摘要翻译： 本文提供了降低生产硅锭的总成本的系统和方法。 更具体地，一个或多个表面片可以相对于多个节点在特定方位从硅晶片切片。 然后可以将这些一个或多个表面片形成为具有可用于硅锭生长过程中的特定长度，宽度和厚度的一个或多个种子。 通过利用这些片形成一个或多个种子，可以使用先前已经丢弃的块的块来形成用于硅锭生长过程的高质量种子。

公开(公告)号：US20150125988A1

公开(公告)日：2015-05-07

申请号：US14511127

申请日：2014-10-09

申请人： Samsung SDI Co., Ltd.

发明人： Dong-Ho Lee ,  Jung-Gyu Nam ,  Kwang-Soo Huh ,  Su-Jin Kim

IPC分类号： H01L31/18 ,  H01L31/0232 ,  H01L31/0224 ,  B26D3/08

CPC分类号： H01L31/022425 ,  B26D3/085 ,  B28D5/0023 ,  B28D5/0088 ,  H01L31/0463 ,  H01L31/18 ,  H01L31/1884 ,  Y02E10/50 ,  Y10T83/0333

摘要： A scribing apparatus for manufacturing a solar cell, and a method of manufacturing a solar cell using the same are provided. The scribing apparatus includes a stage part configured to support a substrate having at least one thin film layer, a scribing unit configured to scribe on the at least one thin film layer, and a moving unit configured to move at least one of the stage part and the scribing unit during the scribing process. A method of manufacturing a solar cell using the scribing apparatus includes scribing a first pattern onto a reflective electrode layer using the scribing apparatus, the reflective electrode layer being on the substrate, the scribing apparatus further including a needle installation part having a first needle configured to scribe on one side of the reflective electrode layer, and a second needle configured to scribe on a side surface of the reflective electrode layer.

摘要翻译： 提供一种太阳能电池的制造用划线装置及使用其的太阳能电池的制造方法。 划线装置包括：台架部，其被配置为支撑具有至少一个薄膜层的基板;划线单元，被配置为在所述至少一个薄膜层上划线;以及移动单元，被配置为移动所述台架部分和 划线过程中的划线单位。 使用划线装置制造太阳能电池的方法包括使用划线装置将第一图案划分到反射电极层上，反射电极层位于基板上，划线装置还包括针安装部，该针安装部具有第一针， 在反射电极层的一侧划线，以及第二针，被配置为在反射电极层的侧表面上刻划。

公开(公告)号：US08991673B2

公开(公告)日：2015-03-31

申请号：US13293772

申请日：2011-11-10

申请人： Olivier Rayssac ,  Fabrice Letertre

发明人： Olivier Rayssac ,  Fabrice Letertre

IPC分类号： B26F3/00 ,  H01L21/762 ,  B28D5/00 ,  H01L21/20

CPC分类号： H01L21/76254 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  Y10T29/53274 ,  Y10T83/0267 ,  Y10T83/04 ,  Y10T83/364 ,  Y10T156/1059 ,  Y10T156/1184 ,  Y10T156/1189 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/307 ,  Y10T225/35 ,  Y10T225/386

摘要： An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.

摘要翻译： 描述了用于切割组件的自动切割装置。 组件包括其中具有弱化区的材料，其限定有用层并且附接到源基底。 切割装置包括切割机构和与切割机构可操作地相关联的保持和定位机构。 保持定位机构使材料定位，使得切割机构沿着弱化区域从源基板分离出层。 该切割装置还包括一个控制机构，用于在分离该层期间调节组件的至少两个不同部分，以便于更精确的拆卸。

公开(公告)号：US20130119106A1

公开(公告)日：2013-05-16

申请号：US13664125

申请日：2012-10-30

申请人： LatticeGear, LLC

发明人： Gal Moyal

IPC分类号： B28D5/04 ,  B26D3/08

CPC分类号： B28D1/225 ,  B26D5/007 ,  B26F3/002 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0041 ,  B28D5/0076 ,  B28D7/02 ,  Y10T83/0333 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371

摘要： A device and method for cleaving a sample includes: Creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; Providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; And, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin. Further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

摘要翻译： 用于切割样品的装置和方法包括：通过沿垂直轴施加向下的力，垂直于样品的顶表面布置的轴在样品的顶表面上创建凹痕; 提供断开销并将破碎销布置在样品下方以在与压痕直接相对的位置处接触样品的底表面; 并且，通过提供一个左侧和右侧的断路器销向下施加向下的力，其中向下的力包括通过左侧的断路器销延伸的左侧的向下的力和通过右侧的断路器销的右侧向下的力 。 此外，提供左侧和右侧向下力的销设置在断路器杆上并且布置成位于延伸穿过顶表面上的凹陷的垂直轴线的相对侧上。

公开(公告)号：US20060016443A1

公开(公告)日：2006-01-26

申请号：US11183828

申请日：2005-07-19

申请人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

发明人： Naoki Ohmiya ,  Yusuke Nagai ,  Masaru Nakamura

IPC分类号： B28D1/02

CPC分类号： B28D5/0052 ,  B23K26/40 ,  B23K26/53 ,  B23K26/57 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0023 ,  Y10T225/325

摘要： A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed on the front surface in a lattice pattern, along the dividing lines, comprising: a tape affixing step for affixing a protective tape to one surface side of the wafer; a holding step for positioning a first suction-holding member and a second suction-holding member on both sides of a dividing line and suction-holding the wafer on the first suction-holding member and the second suction-holding member through the protective tape; and a dividing step for moving the first suction-holding member and the second suction-holding member in a direction for separating them from each other to exert tensile force in a direction perpendicular to the dividing line.

公开(公告)号：US20050009297A1

公开(公告)日：2005-01-13

申请号：US10886436

申请日：2004-07-06

申请人： Olivier Rayssac ,  Fabrice Letertre

发明人： Olivier Rayssac ,  Fabrice Letertre

IPC分类号： B28D5/04 ,  B28D5/00 ,  H01L21/20 ,  H01L21/762 ,  G01N13/00 ,  H01L21/30 ,  H01L21/46

CPC分类号： B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  H01L21/76254 ,  Y10T83/364 ,  Y10T156/1126 ,  Y10T156/1184 ,  Y10T156/1928 ,  Y10T156/1967 ,  Y10T156/1972

摘要： A method is presented for cutting an assembly that includes two layers of material having a first surface and a second surface. The method includes providing a weakened interface between the two layers that defines an interface ring about the periphery of the assembly, providing a high-pressure zone at the interface ring, and providing at least one controllable low-pressure zone in the vicinity of at least one of the first surface and the second surface. The technique also includes supplying the high-pressure zone with a controllable high-pressure force, and attacking the interface ring with at least one mechanical force in combination with the high-pressure force to cut the assembly.

摘要翻译： 提出了一种用于切割包括具有第一表面和第二表面的两层材料的组件的方法。 该方法包括在两个层之间提供弱化的界面，其限定围绕组件的周边的界面环，在界面环处提供高压区，并且在至少附近提供至少一个可控制的低压区 第一表面和第二表面之一。 该技术还包括向高压区域供应可控的高压力，并且以至少一个机械力与高压力结合来对接口环进行攻击以切割组件。

公开(公告)号：US20050000649A1

公开(公告)日：2005-01-06

申请号：US10883435

申请日：2004-07-01

申请人： Olivier Rayssac ,  Fabrice Letertre

发明人： Olivier Rayssac ,  Fabrice Letertre

IPC分类号： B28D1/22 ,  B28D5/00 ,  H01L21/20 ,  H01L21/762 ,  B32B35/00

CPC分类号： H01L21/76254 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0052 ,  B28D5/0064 ,  H01L21/2007 ,  Y10T29/53274 ,  Y10T83/0267 ,  Y10T83/04 ,  Y10T83/364 ,  Y10T156/1059 ,  Y10T156/1184 ,  Y10T156/1189 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1972 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/307 ,  Y10T225/35 ,  Y10T225/386

摘要： An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.

摘要翻译： 描述了用于切割组件的自动切割装置。 组件包括其中具有弱化区的材料，其限定有用层并且附接到源基底。 切割装置包括切割机构和与切割机构可操作地相关联的保持和定位机构。 保持定位机构定位材料，使得切割机构沿着弱化区域从源基板分离出层。 切割装置还包括一个控制机构，用于在分离该层期间调节该组件的至少两个不同部分，以便于更精确的拆卸。

公开(公告)号：US06374820B1

公开(公告)日：2002-04-23

申请号：US09670650

申请日：2000-09-27

申请人： Yoshinori Sakamoto ,  Shizuma Tazuke ,  Haruhiko Mori

发明人： Yoshinori Sakamoto ,  Shizuma Tazuke ,  Haruhiko Mori

IPC分类号： B28D104

CPC分类号： B28D1/222 ,  B28D5/0023

摘要： A manufacturing method for a monolithic ceramic part permitting a ceramic laminate to be cut stably and speedily, even if the thickness of the ceramic laminate is large. In order to divide a mother ceramic laminate into individual laminates of monolithic ceramic part units, the ceramic laminate is cut with a cutting blade, using a pair of guides disposed on opposite sides of the cutting blade in the vicinity of one principal plane of the ceramic laminate to control the cutting direction, and then individual ceramic laminates thus obtained by cutting are fired.

摘要翻译： 即使陶瓷层叠体的厚度大，也能够稳定，快速地切断陶瓷层叠体的整体式陶瓷部件的制造方法。 为了将母体陶瓷层压体分成单块陶瓷部件单元的单个叠层体，用切割刀片切割陶瓷层压体，使用设置在切割刀片的相对侧上的一对导轨，该导向件在陶瓷的一个主平面附近 层压体以控制切割方向，然后烧制由此获得的各陶瓷层压体。

公开(公告)号：US20020023725A1

公开(公告)日：2002-02-28

申请号：US09808814

申请日：2001-03-14

发明人： Michael Bryan ,  James K. Kai

IPC分类号： B32B001/00

CPC分类号： B32B43/006 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0064 ,  B28D5/0082 ,  Y10T29/49821 ,  Y10T29/49822 ,  Y10T83/364 ,  Y10T156/1374 ,  Y10T156/1928

摘要： A cleaving tool provides pressurized gas to the edge of a substrate in combination with a sharpened edge to cleave the substrate at a selected interface. The edge of the tool is tapped against the perimeter of a substrate, such as a bonded substrate, and a burst of gas pressure is then applied at approximately the point of contact with the edge of the tool. The combination of mechanical force and gas pressure separates the substrate into two halves at a selected interface, such as a weakened layer in a donor wafer.

摘要翻译： 切割工具将加压气体与锋利的边缘组合地提供到基底的边缘，以在选定的界面处切割基底。 将工具的边缘与衬底的周边（例如键合衬底）相接合，然后在大约与工具边缘的接触点处施加气体压力脉冲。 机械力和气体压力的组合将基板在选定的界面（例如施主晶片中的弱化层）分离成两半。