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111 条记录 (耗时 0.016 秒)

    CYLINDRICAL-COMPONENT GRINDING DEVICE, AND WORKPIECE ADVANCING APPARATUS AND GRINDING METHOD THEREOF
    23.
    发明申请
    CYLINDRICAL-COMPONENT GRINDING DEVICE, AND WORKPIECE ADVANCING APPARATUS AND GRINDING METHOD THEREOF 审中-公开

    公开(公告)号：US20170274494A1

    公开(公告)日：2017-09-28

    申请号：US15619498

    申请日：2017-06-11

    申请人： TIANJIN UNIVERSITY

    发明人： Chengzu REN ,  Xiaofan DENG ,  Yinglun HE ,  Guang CHEN ,  Xinmin JIN

    IPC分类号： B24B37/02 ,  B24B37/34

    CPC分类号： B24B37/022 ,  B23Q7/06 ,  B24B37/02 ,  B24B37/025 ,  B24B37/04 ,  B24B37/08 ,  B24B37/16 ,  B24B37/26 ,  B24B37/345

    摘要： A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

    Method of polishing a substrate using a polishing tape having fixed abrasive
    24.
    发明授权
    Method of polishing a substrate using a polishing tape having fixed abrasive 有权
    使用具有固定磨料的研磨带研磨基材的方法

    公开(公告)号：US08926402B2

    公开(公告)日：2015-01-06

    申请号：US13303485

    申请日：2011-11-23

    申请人： Masayuki Nakanishi ,  Masaya Seki ,  Kenji Kodera

    发明人： Masayuki Nakanishi ,  Masaya Seki ,  Kenji Kodera

    IPC分类号： B24B1/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/02

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B37/02

    摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.

    摘要翻译： 提供了研磨基板周边部分的方法。 该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。 抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。

    Apparatus and method for chamfering wafer with loose abrasive grains
    25.
    发明授权
    Apparatus and method for chamfering wafer with loose abrasive grains 失效
    具有松散磨粒的倒角晶片的装置和方法

    公开(公告)号：US5944584A

    公开(公告)日：1999-08-31

    申请号：US914751

    申请日：1997-08-20

    申请人： Kohei Toyama

    发明人： Kohei Toyama

    IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B37/02 ,  B24B57/00 ,  B24D13/18 ,  B24B1/00

    CPC分类号： B24B9/065 ,  B24B37/02 ,  B24B57/00 ,  B24D13/18

    摘要： Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, is disposed in a place, the polisher having a periphery shaping edge on a peripheral side surface, wherein the polishing device is moved in a radial direction of the wafer so as to position the periphery shaping edge close to the periphery of the wafer, and the wafer and the polishing device are rotated relatively to each other, while slurry containing suspension of abrasive grains is supplied to a narrow space therebetween from a slurry supply nozzle.

    摘要翻译： 在半导体硅晶片倒角时，裂纹层的裂纹层分散在地表面上的分散减少。 半导体硅晶片由可自由旋转的夹持装置夹持，并且具有自由旋转的抛光装置内置的具有环形的抛光机设置在一个位置，抛光机具有周边成形边缘 周边侧表面，其中所述抛光装置沿所述晶片的径向移动，以将所述周边成形边缘定位成靠近所述晶片的周边，并且所述晶片和所述抛光装置相对旋转，同时包含 磨料颗粒的悬浮液从浆料供给喷嘴供给到其间的狭窄空间。

    Means and method for fabrication of grazing incidence optics
    26.
    发明授权
    Means and method for fabrication of grazing incidence optics 失效
    用于制造掠射入射光学的方法和方法

    公开(公告)号：US5752874A

    公开(公告)日：1998-05-19

    申请号：US375057

    申请日：1995-01-19

    申请人： George W. Meyer, Jr. ,  Steven S. Chuang

    发明人： George W. Meyer, Jr. ,  Steven S. Chuang

    IPC分类号： B24B13/00 ,  B24B13/015 ,  B24B13/02 ,  B24B37/02 ,  B24B47/04 ,  B24B11/00

    CPC分类号： B24B13/015 ,  B24B13/02 ,  B24B37/02

    摘要： A grazing incidence optic is fabricated by grinding, polishing, or both, using a tapered, barrel-shaped tool. The optic surface to be ground or polished is placed in contact with a selected portion of the grinding or polishing surface of the tool, and the tool is rotated about its longitudinal axis. The optic is subjected to a reciprocating grinding movement along the length of the barrel tool. A helical groove in the tool allows slurry to pass between the optic surface being worked and the tool surface. Air is forced between the optic surface and the tool surface to release the optic from the tool.

    摘要翻译： 通过研磨，抛光或两者使用锥形的桶形工具制造掠入射光学镜。 待研磨或抛光的光学表面与工具的磨削或抛光表面的选定部分接触，并且工具围绕其纵向轴线旋转。 光学元件沿着枪管工具的长度进行往复磨削运动。 工具中的螺旋槽允许浆料在被加工的光学表面和工具表面之间通过。 空气被迫在光学表面和工具表面之间从工具释放光学元件。

    Apparatus for finely working piston rings
    28.
    发明授权
    Apparatus for finely working piston rings 失效
    精巧的活塞环设备

    公开(公告)号：US5168659A

    公开(公告)日：1992-12-08

    申请号：US676278

    申请日：1991-03-28

    申请人： Eberhard Schneider

    发明人： Eberhard Schneider

    IPC分类号： B24B37/02

    CPC分类号： B24B37/02

    摘要： A device is provided for finely working exterior circumferential faces of self-tensioning piston rings which are combined into a packet. The device includes a cylindrical sleeve having an interior wall surface against which the circumferential faces of the rings lie under their own tension. Two discs are disposed between which the rings are arranged in the sleeve with a slight axial spacing. The packet of rings is rotatable relative to the sleeve and movable back and forth within the sleeve, with at least one of the discs being pivotal about the longitudinal axis of the sleeve. A mechanism is provided for pivoting the one disc about a pivot angle that is variable and arrestable for subjecting the rings to a tilting movement with the sleeve.

    摘要翻译： 提供了一种用于精细加工的自张紧活塞环的外周面的装置，其组合成包装。 该装置包括具有内壁表面的圆柱形套筒，环的周向表面在它们自身的张力下面。 两个盘被设置在其间，环之间以轻微的轴向间隔布置在套筒中。 环的包装可相对于套筒旋转并且可在套筒内前后移动，其中至少一个盘围绕套筒的纵向轴线枢转。 提供了一种用于使一个盘绕枢转角度枢转的机构，所述枢轴角度是可变和可阻止的，以使环与套筒一起倾斜运动。

    Gear polishing
    30.
    发明授权
    Gear polishing 失效
    齿轮抛光

    公开(公告)号：US3955327A

    公开(公告)日：1976-05-11

    申请号：US317109

    申请日：1972-12-21

    申请人： Melvin A. Franco

    发明人： Melvin A. Franco

    IPC分类号： B23F19/02 ,  B23F21/03 ,  B24B37/02 ,  B24D7/18 ,  E05D15/40

    CPC分类号： B23F21/03

    摘要： A gear shaped tool formed of a relatively soft elastically deformable material provided with a multiplicity of pores provided in the sides of its teeth by elimination of solid particles exposed at the surface thereof is rotated in mesh under light pressure contact with a work gear, while a very fine abrasive fluid polishing compound is provided. The operation improves the surface finish of the teeth of the work pieces without appreciably affecting the tooth form. The operation may be carried out with the axes of the gear and polishing tool parallel or crossed at a small angle and a relative traverse may be provided between the gear and tool in a direction which occupies a plane parallel to the axes of both the gear and tool, such direction preferably being parallel to the axis of the gear.

    摘要翻译： 由相对柔软的弹性变形材料形成的齿轮形工具通过消除在其表面暴露的固体颗粒而设置在其齿的侧面上的多个孔，与工作齿轮轻压接触地啮合，而 提供非常细的磨料流体抛光化合物。 该操作提高了工件的齿的表面光洁度，而不会明显地影响齿形。 可以以齿轮和抛光工具的轴线以小角度平行或交叉的方式进行操作，并且可以在齿轮和工具之间沿着与平行于齿轮和齿轮的轴线的平面的方向上设置相对横向 工具，这种方向优选地平行于齿轮的轴线。