公开(公告)号：US11192347B2

公开(公告)日：2021-12-07

申请号：US15896526

申请日：2018-02-14

申请人： Guangzhou Newlife Mew Material Co., LTD

发明人： Xiaoming Wang ,  Ronggen Ye ,  Guoming Wu ,  Zhiqiang Chen

IPC分类号： B32B27/14 ,  C09J7/38 ,  B32B5/16 ,  B32B27/36 ,  B32B37/15 ,  B32B29/04 ,  B32B27/32 ,  C09J183/04 ,  C09J7/29 ,  B32B37/12

摘要： The invention discloses a high performance plastic magnetic material, comprising a low surface energy layer, a magnetic layer and a printable layer, wherein the magnetic layer and the printable layer are arranged successively on a first side of the low surface energy layer; the low surface energy layer is an organic silicon pressure sensitive adhesive layer. The invention further discloses a preparation method, comprising the following steps: pretreating a magnetic powder with a coupling agent; mixing the pretreated magnetic powder with matrix components and auxiliaries to gain a mixture; extrusion compositing the gained mixture with a printable layer to gain composite paper having the printable layer and a magnetic layer; and applying a low surface energy layer on a side of the magnetic layer, opposite the printable layer. As no UV layer and no adhesive residue, the material of the invention is environmentally friendly and highly reliable.

公开(公告)号：US11183415B2

公开(公告)日：2021-11-23

申请号：US16313370

申请日：2017-06-13

申请人： NISSAN CHEMICAL CORPORATION

发明人： Hiroshi Ogino ,  Tomoyuki Enomoto ,  Tetsuya Shinjo ,  Kazuhiro Sawada ,  Shunsuke Moriya

IPC分类号： H01L21/683 ,  C09J5/06 ,  C09J183/04 ,  H01L21/304 ,  H01L21/768 ,  C09J11/06

摘要： An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

公开(公告)号：US11174420B2

公开(公告)日：2021-11-16

申请号：US17259224

申请日：2020-01-15

申请人： Dow Silicones Corporation

发明人： Jingui Jiang ,  Zhihua Liu ,  Ruihua Lu ,  Qing Cao ,  Chengrong Zhu ,  Jiayin Zhu

IPC分类号： C09J183/04 ,  C09J7/38 ,  C08G77/08 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08K5/05 ,  C08K5/5425 ,  C08K5/5435 ,  C08G77/44 ,  C08G77/20

摘要： A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

公开(公告)号：US11168234B2

公开(公告)日：2021-11-09

申请号：US16750719

申请日：2020-01-23

申请人： International Business Machines Corporation

发明人： James L. Hedrick ,  Robert D. Miller ,  Deborah A. Neumayer ,  Sampath Purushothaman ,  Mary E. Rothwell ,  Willi Volksen ,  Roy R. Yu

IPC分类号： C09J9/00 ,  H01L23/48 ,  H01L23/00 ,  H01L21/683 ,  H01L21/768 ,  C09J11/04 ,  H01L25/00 ,  H01L25/065 ,  C09J183/04 ,  C09J179/08 ,  C09J179/04 ,  C09J11/06 ,  H01L23/60 ,  B82Y30/00 ,  B82Y40/00 ,  C08K5/544 ,  C08K5/548 ,  C08K5/5425 ,  C08K5/5465 ,  C08K7/24 ,  C08K3/04

摘要： The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

公开(公告)号：US20210324252A1

公开(公告)日：2021-10-21

申请号：US17274503

申请日：2019-09-10

申请人： DOW SILICONES CORPORATION

发明人： Martijn BEUKEMA ,  Thierry COOREMANS ,  François DE BUYL ,  Kevin VAN TIGGELEN

IPC分类号： C09J183/04 ,  C09J4/06 ,  C09J7/38 ,  C09J7/28 ,  C09J7/25 ,  G02B1/04 ,  B29C45/14

摘要： A method for producing an optical silicone assembly is disclosed. The method comprises the steps of: i) treating a surface of a substrate with an optically clear silicone adhesive composition; ii) placing the substrate obtained by step i) into a mold; iii-a) injecting an optically clear moldable silicone composition into the mold, and/or iii-b) overmolding the optically clear moldable silicone composition onto the substrate; and then iv) heating the optically clear moldable silicone composition to form the optical silicone assembly. The optical silicone assembly produced by the method of this disclosure is characterized by excellent adhesion of an optical silicone product to various types of substrates.

公开(公告)号：US20210309899A1

公开(公告)日：2021-10-07

申请号：US17259224

申请日：2020-01-15

申请人： Dow Silicones Corporation

发明人： Jingui Jiang ,  Zhihua Liu ,  Ruihua Lu ,  Qing Cao ,  Chengrong Zhu ,  Jiayin Zhu

IPC分类号： C09J183/04 ,  C09J7/38 ,  C08G77/08 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08K5/05 ,  C08K5/5425 ,  C08K5/5435 ,  C08G77/44

摘要： A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

公开(公告)号：US11111341B2

公开(公告)日：2021-09-07

申请号：US16669924

申请日：2019-10-31

申请人： CHEM LINK, INC.

发明人： Baljinder Kaur ,  Jonathan Ballema

IPC分类号： C08J3/24 ,  C09K3/10 ,  C09J201/10 ,  C09D201/10 ,  C08G63/91 ,  C09J183/00 ,  C09J183/04 ,  C09J185/00 ,  C09J183/10 ,  C08G77/20 ,  C08G77/12

摘要： The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.

公开(公告)号：US11104828B1

公开(公告)日：2021-08-31

申请号：US17055631

申请日：2018-06-29

申请人： Dow Silicones Corporation

发明人： Qing Cao ,  Yan Zhou ,  Chao Ma

IPC分类号： C09J183/04 ,  C09J7/38 ,  C09J11/06 ,  C09J5/02

摘要： A solventless silicone pressure sensitive adhesive composition includes: (A) a polydiorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (B) a branched polyorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (C) a polyorganosilicate resin, (D) an olefinic reactive diluent, (E) a polyorganohydrogensiloxane, (F) a hydrosilylation reaction catalyst, and (G) an anchorage additive. This solventless silicone pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

公开(公告)号：US20210261405A1

公开(公告)日：2021-08-26

申请号：US17288536

申请日：2020-06-11

申请人： Nanjing University of Aeronautics and Astronautics ,  Nanjing Li-Hang Industry Institute of Bionic Technology Limited Company

发明人： Zhendong DAI ,  Keju JI ,  Enhua CUI ,  Jian CHEN ,  Cong YUAN ,  Yiqiang TANG

IPC分类号： B81C1/00 ,  C09J183/04 ,  C09J133/08 ,  C09J109/00 ,  B81B1/00 ,  B81C99/00 ,  B29C33/38 ,  C25D7/00

摘要： A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

公开(公告)号：US11066586B2

公开(公告)日：2021-07-20

申请号：US15737229

申请日：2016-06-13

申请人： DAICEL CORPORATION

发明人： Hiroki Tanaka ,  Naoko Tsuji ,  Akira Yamakawa

IPC分类号： C09J183/06 ,  C09J183/12 ,  C09J183/04 ,  C09J163/00 ,  C08L83/06 ,  C08L83/04 ,  C08L83/12 ,  C08G77/04 ,  C08K5/17 ,  C08K5/34 ,  B32B27/28

摘要： Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.0, includes a constitutional unit represented by Formula (1), has a ratio of a constitutional unit represented by Formula (I) to a constitutional unit represented by Formula (II) of 5 or more, and has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55 to 100 mole percent of all siloxane constitutional units. [R1SiO3/2] (1), [RaSiO3/2] (I), [RbSiO2/2(ORc)] (II), [R1SiO2/2(ORc)] (4), where R1 represents an epoxy-containing group; Ra and Rb are each selected from an epoxy-containing group, substituted or unsubstituted aryl, substituted or unsubstituted aralkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted alkyl, substituted or unsubstituted alkenyl, and hydrogen; and Rc is selected from hydrogen and C1-C4 alkyl.