公开(公告)号：US20100172612A1

公开(公告)日：2010-07-08

申请号：US12389399

申请日：2009-02-20

Applicant: Abdul Jaleel K. Moidu

Inventor： Abdul Jaleel K. Moidu

IPC: G02B6/26 ,  G02B26/08

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2201/045 ,  B81B2203/058 ,  G02B6/2931 ,  G02B6/3518 ,  G02B6/356 ,  G02B6/357 ,  G02B6/3584

Abstract: A two-axis tiltable linear array of MEMS micromirrors is described. The individual micromirrors of the array are flexibly suspended over a common substrate by using two pairs of serpentine hinges coupled by a gimbal ring and are actuated by using tilt and roll electrodes. The tilt actuator regions of the micromirrors are disposed within the gimbal rings, the roll hinges connecting the tilt actuator regions to the micromirrors, which provides for decoupling of the tilt and the roll of the micromirror. The structure allows for considerable decoupling of the tilt and the roll and, or the pistoning effects observed upon micromirror actuation. The structure is suitable for application in a wavelength selective optical switch.

Abstract translation: 描述了MEMS微镜的两轴可倾斜线性阵列。 通过使用由万向环联接的两对蛇形铰链，阵列的各个微镜可以灵活地悬挂在共同的基板上，并通过使用倾斜和滚动电极来驱动。 微镜的倾斜致动器区域设置在万向环内，辊铰链将倾斜致动器区域连接到微镜，其提供微镜的倾斜和辊的解耦。 该结构允许倾斜和辊的显着解耦，或者在微镜驱动时观察到的活塞效应。 该结构适用于波长选择光开关。

公开(公告)号：US07675671B2

公开(公告)日：2010-03-09

申请号：US12215401

申请日：2008-06-27

Applicant: Yasuhiro Ohmori

Inventor： Yasuhiro Ohmori

IPC: G02B26/00 ,  G02B26/12

CPC classification number: G02B26/0841 ,  B81B3/0086 ,  B81B2201/045 ,  B81B2203/019 ,  B81B2203/0384 ,  H02N1/002

Abstract: An aspect of the embodiment, a MEMS device includes a rotating unit, a first hinge, a first frame and an actuator. The actuator has a plurality of electrodes for rotating the rotating unit. The first frame has one of the electrodes. A portion of silicon layer by the electrode of the frame is chamfered.

Abstract translation: 在该实施例的一个方面，MEMS器件包括旋转单元，第一铰链，第一框架和致动器。 致动器具有用于旋转旋转单元的多个电极。 第一框架具有一个电极。 通过框架的电极的一部分硅层被倒角。

公开(公告)号：US20100033856A1

公开(公告)日：2010-02-11

申请号：US12085487

申请日：2006-12-26

Applicant: Shingo Uchiyama ,  Makoto Sato ,  Fusao Shimokawa

Inventor： Shingo Uchiyama ,  Makoto Sato ,  Fusao Shimokawa

IPC: G02B7/182 ,  F16F3/02

CPC classification number: B81B3/004 ,  B81B2201/042 ,  B81B2201/045 ,  F16F1/027 ,  F16F2230/34 ,  G02B26/0833 ,  G02B26/0841

Abstract: A total length of members (11, 13, 15, 17, 19, 21, 23, 25) formed in an X-axis direction of a spring (1) is larger than a spring length of the spring (1) and larger than a total length of members (12, 14, 16, 18, 20, 22, 24) formed in a Y-axis direction. With this arrangement, spring constants of respective axes can be increased, and a spring constant in a direction R can be set appropriately and freely within a wider range.

Abstract translation: 在弹簧（1）的X轴方向上形成的构件（11,13,15,17,19,21,23,25）的总长度大于弹簧（1）的弹簧长度，大于 在Y轴方向上形成的构件（12,14,16,18,20,22,24）的总长度。 通过这种布置，可以增加各轴的弹簧常数，并且可以在更宽的范围内适当且自由地设定方向R上的弹簧常数。

公开(公告)号：US20090146228A1

公开(公告)日：2009-06-11

申请号：US12315363

申请日：2008-12-01

Applicant: Keiichi Mori ,  Yoshichika Kato ,  Satoshi Yoshida ,  Kenji Kondou ,  Yoshihiko Hamada ,  Osamu Imaki

Inventor： Keiichi Mori ,  Yoshichika Kato ,  Satoshi Yoshida ,  Kenji Kondou ,  Yoshihiko Hamada ,  Osamu Imaki

IPC: H01L29/82

CPC classification number: B81C1/00825 ,  B81B7/0029 ,  B81B2201/045 ,  B81B2203/033 ,  G02B26/0841 ,  Y10T29/49 ,  Y10T29/49002 ,  Y10T307/865

Abstract: A microminiature moving device has disposed on a single-crystal silicon substrate movable elements such as a movable rod and a movable comb electrode that are displaceable in parallel to the substrate surface and stationary parts that are fixedly secured to the single-crystal silicon substrate with an insulating layer sandwiched between. Depressions are formed in the surface regions of the single-crystal silicon substrate where no stationary parts are present and the movable parts are positioned above the depressions. The depressions form gaps large enough to prevent foreign bodies from causing shorts and malfunctioning of the movable parts.

Abstract translation: 微型移动装置设置在单晶硅衬底上，可移动元件如活动杆和可移动梳状电极可平行移动到衬底表面，固定部分固定固定在单晶硅衬底上 绝缘层夹在中间。 在单晶硅衬底的不存在固定部分并且可移动部件位于凹部上方的表面区域中形成凹陷。 凹陷形成足够大的间隙，以防止异物引起可动部件的短路和故障。

公开(公告)号：US07532385B2

公开(公告)日：2009-05-12

申请号：US10807128

申请日：2004-03-24

Applicant: Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

Inventor： Wen-Jian Lin ,  Brian Arbuckle ,  Brian Gally ,  Philip Floyd ,  Lauren Palmateer

IPC: G02B26/00 ,  H01L21/00

CPC classification number: G02B26/001 ,  B81B7/0012 ,  B81B2201/045

Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.

Abstract translation: 第一电极和牺牲层依次形成在基板上，然后在第一电极和牺牲层中形成用于形成支撑件的第一开口。 支撑件形成在第一开口中，然后在牺牲层和支撑件上形成第二电极，从而形成微机电系统结构。 之后，使用粘合剂将保护结构粘附并固定到基底上以形成腔室以包围微机电系统结构，并且至少一个第二开口保留在腔室的侧壁上。 随后采用释放蚀刻工艺以通过第二开口去除牺牲层，以便在光学干涉反射结构中形成空腔。 最后，关闭第二个开口以密封衬底和保护结构之间的光学干涉反射结构。

公开(公告)号：US20080272447A1

公开(公告)日：2008-11-06

申请号：US12136722

申请日：2008-06-10

Applicant: Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

Inventor： Simone Sassolini ,  Mauro Marchi ,  Marco Del Sarto ,  Lorenzo Baldo

IPC: H01L29/84

CPC classification number: H01L21/76898 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C1/00896 ,  B81C2201/019 ,  G02B6/357 ,  G02B6/3584

Abstract: A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.

Abstract translation: 一种具有支撑部件和操作部件的微电子机械装置的制造方法，包括提供具有第一层半导体材料的第一半导体晶片和布置在第一层顶部的第二半导体材料层，形成 在第二层中的装置的第一支撑部分和第一操作部分，在第一层中形成临时锚固件，以及将第一晶片结合到第二晶片，第二层面向第二晶片。 在将第一晶片和第二晶片接合在一起之后，所述器件的第二支撑部件和第二操作部分形成在第一层中。 将临时锚固件从第一层移除以释放其中形成的操作部件。

公开(公告)号：US20070075417A1

公开(公告)日：2007-04-05

申请号：US11543391

申请日：2006-10-04

Applicant: Young-Nam Hwang ,  Yeong-Gyu Lee ,  Suk-Kee Hong ,  Heung-Woo Park

Inventor： Young-Nam Hwang ,  Yeong-Gyu Lee ,  Suk-Kee Hong ,  Heung-Woo Park

IPC: H01L23/12

CPC classification number: B81B7/0077 ,  B81B2201/045

Abstract: A MEMS module package using a sealing cap having heat releasing capability is disclosed, which comprises a lower substrate, a MEMS element mounted on the lower substrate, a driver integrated circuit mounted on the lower substrate adjacently to the MEMS element which operates the MEMS element, and a sealing cap positioned in contact with the lower substrate which has a MEMS-element protrusion portion in physical contact with the MEMS element and has one or more grooves for housing the MEMS element and the driver integrated circuit. The MEMS module package using a sealing cap having heat releasing capability and a manufacturing method thereof according to an aspect of the present invention utilize an effective heat releasing structure to release the heat generated in each element.

Abstract translation: 公开了一种使用具有放热能力的密封盖的MEMS模块封装，其包括下基板，安装在下基板上的MEMS元件，安装在下基板上的与驱动MEMS元件的MEMS元件相邻的驱动器集成电路， 以及与所述下基板接触的密封盖，所述密封帽具有与所述MEMS元件物理接触的MEMS元件突出部分，并且具有用于容纳所述MEMS元件和所述驱动器集成电路的一个或多个凹槽。 根据本发明的一个方面的使用具有放热能力的密封盖的MEMS模块封装及其制造方法利用有效的放热结构来释放每个元件中产生的热量。

公开(公告)号：US07145712B2

公开(公告)日：2006-12-05

申请号：US10962445

申请日：2004-10-13

Applicant: Yoshihiro Mizuno ,  Satoshi Ueda ,  Osamu Tsuboi ,  Ippei Sawaki ,  Hisao Okuda ,  Norinao Kouma ,  Hiromitsu Soneda ,  Fumio Yamagishi

Inventor： Yoshihiro Mizuno ,  Satoshi Ueda ,  Osamu Tsuboi ,  Ippei Sawaki ,  Hisao Okuda ,  Norinao Kouma ,  Hiromitsu Soneda ,  Fumio Yamagishi

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81B2201/045 ,  B81B2203/0136 ,  B81C1/00182 ,  B81C2203/0109 ,  Y10S359/904

Abstract: A micro mirror unit includes a moving part carrying a mirror portion, a frame and torsion bars connecting the moving part to the frame. The moving part, the frame and the torsion bars are formed integral from a material substrate. The frame includes a portion thicker than the moving part.

公开(公告)号：US07099066B2

公开(公告)日：2006-08-29

申请号：US11082881

申请日：2005-03-18

Applicant: Osamu Tsuboi ,  Satoshi Ueda ,  Yoshihiro Mizuno ,  Ippei Sawaki ,  Fumio Yamagishi

Inventor： Osamu Tsuboi ,  Satoshi Ueda ,  Yoshihiro Mizuno ,  Ippei Sawaki ,  Fumio Yamagishi

IPC: G02B26/00

CPC classification number: B81C1/00142 ,  B81B3/0078 ,  B81B2201/042 ,  B81B2201/045 ,  B81B2203/0136 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C1/00396 ,  G02B26/0841 ,  Y10S359/904

Abstract: A method is provided for making a micromirror unit which includes a frame, a mirror forming base, and bridges connecting the frame to the mirror forming base. The method includes the following steps. First, a first mask pattern is formed on a substrate for masking portions of the substrate which are processed into the frame and the mirror forming base. Then, a second mask pattern is formed on the substrate for masking portions of the substrate which are processed into the bridges. Then, the substrate is subjected to a first etching process with the first and the second mask patterns present as masking means. Then, the second mask pattern is removed selectively. Then, the substrate is subjected to a second etching process with the first mask pattern present as masking means. Finally, the first mask pattern is removed.

公开(公告)号：US07071520B2

公开(公告)日：2006-07-04

申请号：US10176478

申请日：2002-06-21

Applicant: Jason S. Reid

Inventor： Jason S. Reid

IPC: G01L1/12

CPC classification number: B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118

Abstract: MEMS devices are provided that are capable of movement due to a flexible portion formed of unique materials for this purpose. The MEMS device can have a flexible portion formed of a nitride or oxynitride of at least one transition metal, and formed of a nitride or oxynitride of at least one metalloid or near metalloid; a flexible portion formed of a single transition metal nitride or oxynitride and in the absence of any other metal or metalloid nitrides; a flexible portion formed of one or more late transition metal nitrides or oxynitrides; a flexible portion formed of a single transition metal in nitride form, and an additional metal substantially in elemental form; or a flexible portion formed of at least one metalloid nitride or oxynitride. The MEMS devices can be any device, though preferably one with a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or micromirror arrays for direct view and projection displays. The flexible portion (e.g. the hinge of the micromirror) is preferably formed by sputtering a metal and/or metalloid target in nitrogen ambient so as to result in a sputtered hinge. It is also possible to form other parts of the MEMS device (e.g structural parts that do not flex).