Abstract:
The generation of a Hall voltage within a semiconductor film of an integrated Hall effect sensor uses the flow of a current within the semiconductor film when subjected to a magnetic field. The film is disposed on top of an insulating layer, referred to as buried layer, which is itself disposed on top of a carrier substrate containing a buried electrode that is situated under the insulating layer. A biasing voltage is applied to the buried electrode.
Abstract:
A semiconductor electro-optical phase shifter may include a first optical action zone having a minimum doping level, a first lateral zone and a central zone flanking the first optical action zone along a first axis, doped respectively at first and second conductivity types so as to form a P-I-N junction between the first lateral zone and the central zone. The phase shifter may include a second optical action zone having a threshold doping level, and a second lateral zone flanking the second optical action zone with the central zone along the first axis doped at the first conductivity type so as to form a P-I-N junction between the second lateral zone and the central zone.
Abstract:
An integrated circuit is produced on a bulk semiconductor substrate in a given CMOS technology and includes a semiconductor device for protection against electrostatic discharges. The semiconductor device has a doublet of floating-gate thyristors coupled in parallel and head-to-tail. Each thyristor has a pair of electrode regions. The two thyristors respectively have two separate gates and a common semiconductor gate region. The product of the current gains of the two transistors of each thyristor is greater than 1. Each electrode region of at least one of the thyristors has a dimension, measured perpendicularly to the spacing direction of the two electrodes of the corresponding pair, which is adjusted so as to impart to the thyristor an intrinsic triggering voltage less than the breakdown voltage of a transistor to be protected, and produced in the CMOS technology.
Abstract:
The invention relates to an integrated circuit comprising: a block comprising: first (38) and second (40) oppositely doped semiconductor wells; standard cells (42, 43) placed next to one another, each standard cell (42) comprising first transistors (60, 62), and a clock tree cell (30) encircled by standard cells, the clock tree cell (30) comprising: a third semiconductor well (104) having the same doping type as the doping of the first well (38); second transistors (100, 102); a semiconductor strip (106) extending continuously around the third well (104), and having the opposite doping type to the doping of the third well, so as to electrically isolate the third well (104) from the first well (38).
Abstract:
A simulation method for a P-I-N junction photodiode uses a model that may include a diode model configured to characterize electrical behavior of the P-I-N junction photodiode, and an input for applying a fictitious electrical signal representing optical power received by the P-I-N junction photodiode. A current source model may be coupled to the diode model and may have a transient response to a variation of the fictitious electrical signal, based upon a sum of a first first-order transient response with a time constant based upon to a transit time of carriers in a depletion region of the P-I-N junction, and a second first-order transient response with a time constant based upon a diffusion time of carriers outside of the depletion region. The first and second responses may be respectively weighted by a length of the depletion region and a length of the P-I-N junction outside the depletion region.
Abstract:
A method for manufacturing a wafer on which are formed resonators, each resonator including, above a semiconductor substrate, a stack of layers including, in the following order from the substrate surface: a Bragg mirror; a compensation layer made of a material having a temperature coefficient of the acoustic velocity of a sign opposite to that of all the other stack layers; and a piezoelectric resonator, the method including the successive steps of: a) depositing the compensation layer; and b) decreasing thickness inequalities of the compensation layer due to the deposition method, so that this layer has a same thickness to within better than 2%, and preferably to within better than 1%, at the level of each resonator.
Abstract:
A MOS transistor protected against overvoltages formed in an SOI-type semiconductor layer arranged on an insulating layer itself arranged on a semiconductor substrate including a lateral field-effect control thyristor formed in the substrate at least partly under the MOS transistor, a field-effect turn-on region of the thyristor extending under at least a portion of a main electrode of the MOS transistor and being separated there-from by said insulating layer, the anode and the cathode of the thyristor being respectively connected to the drain and to the source of the MOS transistor, whereby the thyristor turns on in case of a positive overvoltage between the drain and the source of the MOS transistor.
Abstract:
An integrated circuit may include a digital output port including a buffer stage that includes subassemblies of MOSFET transistors. One subassembly may include two pull-up transistors having sources connected to a common high voltage, and having drains connected to a common node connected to the output terminal. Another subassembly may include pull-down transistors having sources connected to a common low voltage, and having drains connected to the common node. The pull-up and pull-down transistors are formed in a thin semiconductor layer of an FDSOI substrate. The substrate may include a thick semiconductor layer and an oxide layer separating the thin and thick semiconductor layers. Areas of the thick semiconductor layer facing the pull-up and pull-down transistors may be connected to a circuit configured to vary a threshold voltage of the pull-up and pull-down transistors.
Abstract:
A power switch includes first and second MOS transistors in series between first and second nodes. Both the first and second transistors have a gate coupled to its substrate. First and second resistive elements are coupled between the gate of the first transistor and the first node, and between the gate of the second transistor and the second node, respectively. A triac is coupled between the first and second nodes. The gate of the triac is coupled to a third node common to the first and second transistors. A third MOS transistor has a first conduction electrode coupled to the gate of the first transistor and a second conduction electrode coupled to the gate of the second transistor.
Abstract:
Method of elementary updating a check node of a non-binary LDPC code during a decoding of a block encoded with said LDPC code, comprising receiving a first input message (U) and a second input message (V) each comprising nm doublets having a symbol and an associated metric, delivering an output message (S) possessing nm output doublets by computing a matrix of nm2 combined doublets on the basis of a combination of the doublets of the two input messages (U,V), and reducing the number of the combined doublets so as to obtain the nm output doublets of the output message (S) possessing the nm largest or lowest metrics. The method further includes tagging redundant symbols within each input message (U, V) and fixing same at a reference value, the value of the metric of each combined doublet resulting from a combination of at least one doublet comprising a tagged redundant symbol.