公开(公告)号：US20230322170A1

公开(公告)日：2023-10-12

申请号：US17717855

申请日：2022-04-11

Applicant: STMICROELECTRONICS, INC.

Inventor： Mahaveer JAIN ,  Mahesh CHOWDHARY

IPC: B60R16/023 ,  B60R16/03 ,  B60W40/10

CPC classification number: B60R16/0232 ,  B60R16/03 ,  B60W2520/00 ,  B60W2400/00 ,  B60W40/10

Abstract: The present disclosure is directed to a device and method for detection of motion events including towing of the vehicle, jacking of the vehicle, and the vehicle being hit by another object. Processing is split between an MCU and a sensor unit. After the vehicle is turned off and before the MCU enters a sleep mode, the MCU calculates a gravity vector of the vehicle using accelerometer data, calculates threshold values based on the gravity vector, and saves the threshold values. After the MCU enters the sleep mode, the sensor unit subsequently monitors and detects motion events with the saved threshold values.

公开(公告)号：US20230314138A1

公开(公告)日：2023-10-05

申请号：US17712718

申请日：2022-04-04

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l.

Inventor： Yamu HU ,  Naren K. SAHOO ,  Pavan NALLAMOTHU ,  Deyou FANG ,  David MCCLURE ,  Marco GARBARINO

IPC: G01C19/5726 ,  G01C19/5762

CPC classification number: G01C19/5726 ,  G01C19/5762

Abstract: At start-up of a microelectromechanical system (MEMS) gyroscope, the drive signal is inhibited, and the phase, frequency and amplitude of any residual mechanical oscillation is sensed and processed to determine a process path for start-up. In the event that the sensed frequency of the residual mechanical oscillation is a spurious mode frequency and a quality factor of the residual mechanical oscillation is sufficient, an anti-phase signal is applied as the MEMS gyroscope drive signal in order to implement an active dampening of the residual mechanical oscillation. A kicking phase can then be performed to initiate oscillation. Also, in the event that the sensed frequency of the residual mechanical oscillation is a resonant mode frequency with sufficient drive energy, a quadrature phase signal with phase lock loop frequency control and amplitude controlled by the drive energy is applied as the MEMS gyroscope drive signal in order to induce controlled oscillation.

公开(公告)号：US11756582B1

公开(公告)日：2023-09-12

申请号：US17742202

申请日：2022-05-11

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l.

Inventor： Paolo Pulici ,  Dennis Hogg ,  Michele Bartolini ,  Enrico Sentieri ,  Enrico Mammei

IPC: G11B5/60 ,  G11B21/10

CPC classification number: G11B5/6017 ,  G11B21/106

Abstract: A system for determining a fly height includes a first head of a disk drive, a second head of the disk drive, a capacitive sensor circuit coupled to the first head and the second head, and a logic device coupled to the capacitive sensor circuit. The capacitive sensor circuit is configured to measure a first capacitance between the first head and the first disk, remove noise from the first capacitance using a second capacitance between the second head and the second disk, and based thereon determine a corrected first capacitance. The logic device is configured to determine the fly height between the first head and the first disk using the corrected first capacitance.

公开(公告)号：US20230253213A1

公开(公告)日：2023-08-10

申请号：US18303471

申请日：2023-04-19

Applicant: STMicroelectronics, Inc.

Inventor： Rennier RODRIGUEZ ,  Maiden Grace MAMING ,  Jefferson Sismundo TALLEDO

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/49513 ,  H01L23/562 ,  H01L23/49548 ,  H01L24/29 ,  H01L23/49503 ,  H01L23/49541

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US11716317B2

公开(公告)日：2023-08-01

申请号：US17196884

申请日：2021-03-09

Applicant: STMicroelectronics, Inc.

Inventor： Sean Newton ,  John Tran ,  David Tamagno

IPC: H04L9/40 ,  G03G15/08 ,  G03G21/18 ,  G06F21/31

CPC classification number: H04L63/0823 ,  G03G15/0863 ,  G03G21/1878 ,  G06F21/31 ,  G03G2215/0697 ,  G03G2221/1823 ,  G06F2221/2129 ,  H04L63/06

Abstract: An electronic component includes a processor and a memory. The electronic component has a secure platform capable of storing at least one dual key pair and a corresponding digital signature. There is also a system including a host machine and an electronic component capable of being operated by the host machine. The electronic component has a processor, a memory, and a secure platform capable of storing at least one dual key pair and a corresponding digital signature. Another aspect describes a method, which includes reading a public key from an electronic component by a host machine, verifying the public key against a stored key in the host machine, digitally signing data using a private key from the electronic component, verifying the signed data against the stored key, and using the electronic component by the host machine only if the signed data and the public key are verified.

公开(公告)号：US11675406B2

公开(公告)日：2023-06-13

申请号：US17567742

申请日：2022-01-03

Applicant: STMICROELECTRONICS, INC.

Inventor： Alan Osamu Kobayashi

IPC: G06F1/00 ,  G06F1/26 ,  H04N21/41 ,  H04N21/4363 ,  H01R11/00 ,  H04N7/173 ,  G06F13/40 ,  G06F13/10 ,  G06F13/42 ,  G06F1/3203 ,  G06F1/3209

CPC classification number: G06F1/266 ,  G06F1/26 ,  G06F13/102 ,  G06F13/4081 ,  G06F13/4269 ,  H01R11/00 ,  H04N7/173 ,  H04N21/4122 ,  H04N21/43632 ,  G06F1/3203 ,  G06F1/3209

Abstract: A passive cable adaptor for connecting a data source device with a display device is described. The adaptor has a packet-based interface connector at one end, the connector having a positive main link pin, a negative main link pin, a positive auxiliary channel pin, and a negative auxiliary channel pin. At the other end is a micro serial interface connector, wherein multimedia content is transmitted over the cable adaptor and electrical power is supplied over the cable adaptor simultaneously. The cable adaptor has an auxiliary and hot plug detect (HPD) controller utilized to map the auxiliary channel and HPD signals of the packet-based digital display to the micro serial interface ID signal.

公开(公告)号：US20230179457A1

公开(公告)日：2023-06-08

申请号：US17538803

申请日：2021-11-30

Applicant: STMICROELECTRONICS, INC.

Inventor： Andrea Lorenzo VITALI

IPC: H04L27/06

CPC classification number: H04L27/06

Abstract: An electronic device receives wireless signals encoded with data in an amplitude-shift keying format. The electronic device passes the wireless signals through a low-pass filter. The low-pass filter has a cutoff frequency between a first frequency associated with data values of a first type and a second frequency associated with data values of a second type. The low-pass filter has the effect of changing the wireless signal from the amplitude-shift keying format to an on-off keying format without losing the data. The electronic device decodes the data from the wireless signal in the on-off keying format.

公开(公告)号：US20230036201A1

公开(公告)日：2023-02-02

申请号：US17811804

申请日：2022-07-11

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey Juralbal ARELLANO

IPC: H01L23/495 ,  H01L23/31

Abstract: A semiconductor package device having a porous copper adhesion promoter layer is provided. The porous copper adhesion promoter layer developed via de-metallization of the intermetallic compound layer grown after the thermal treatment of a thin metal layer plated on the copper base material. The highly selective de-metallization of the intermetallic compound layer ensures that the plated surfaces are not affected and does not create wire-bondability issues. The porous copper layer solves the delamination between the carrier and the epoxy molding compound by providing mechanical interlock features. Further, increasing the surface area of contact between the carrier and the epoxy molding compound improves the mechanical interlock features.

公开(公告)号：US20230032490A1

公开(公告)日：2023-02-02

申请号：US17884492

申请日：2022-08-09

Applicant: STMICROELECTRONICS, INC.

Inventor： Cheng PENG ,  Xiaoyong YANG

IPC: B25J9/16 ,  B25J19/02

Abstract: A robotic device including one or more proximity sensing systems coupled to various portions of a robot body. The proximity sensing systems detect a distance of an object about the robot body and the robotic device reacts based on the detected distance. The proximity sensing systems obtain a three-dimensional (3D) profile of the object to determine a category of the object. The distance of the object is detected multiple times in a sequence to determine a movement path of the object.

公开(公告)号：US11557548B2

公开(公告)日：2023-01-17

申请号：US17137262

申请日：2020-12-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Aaron Cadag ,  Lester Joseph Belalo ,  Ela Mia Cadag

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A semiconductor package formed utilizing multiple etching steps includes a lead frame, a die, and a molding compound. The lead frame includes leads and a die pad. The leads and the die pad are formed from a first conductive material by the multiple etching steps. More specifically, the leads and the die pad of the lead frame are formed by at least three etching steps. The at least three etching steps including a first etching step, a second undercut etching step, and a third backside etching step. The second undercut etching step forming interlocking portions at an end of each lead. The end of the lead is encased in the molding compound. This encasement of the end of the lead with the interlocking portion allows the interlocking portion to mechanically interlock with the molding compound to avoid lead pull out. In addition, by utilizing at least three etching steps the leads can be formed to have a height that is greater than the die pad of the lead frame. This differential in height reduces the span of wires used to form electrical connections within the semiconductor package. These reductions in the span of the wires reduces the chances of wire to wire and wire to die short circuiting because the wire sweep of the wires is reduced when the molding compound is placed.