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公开(公告)号：US20250081083A1
公开(公告)日：2025-03-06
申请号：US18952529
申请日：2024-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seongil HAHM , Pilseop KANG
Abstract: An electronic device may include at least one processor configured to: configure an ad hoc network including the electronic device, a target device, and a transmitting device, based on a request to add an Internet of Things (IoT) device being received; acquire first information on a first change pattern of a first signal; receive second information on a second change pattern of a second signal transmitted to the target device by the transmitting device, from the target device through the communication interface; acquire a value indicating a similarity between the first change pattern and the second change pattern based on the first information and the second information; and identify that the target device is in a same space as the electronic device and register the target device as the IoT device, based on the value indicating the similarity being greater than or equal to a threshold value.
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公开(公告)号：US20250081031A1
公开(公告)日：2025-03-06
申请号：US18814408
申请日：2024-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Peshal Nayak , Boon Loong Ng , Rubayet Shafin , Vishnu Vardhan Ratnam , Yue Qi , Elliot Jen
Abstract: A first device associated with a second device in a wireless network, the first device comprising at least one station (STA) affiliated with the first device and a processor coupled to the at least one STA, the processor configured to perform a relay operation for a second STA that relays a frame between the second STA and a third STA, determine a change in an operational status of the first STA that is indicative of an overload condition of the first STA, determine to suspend the relay operation for the second STA based on the operational status, and transmit, to the second STA, a relay suspension message that indicates a suspension of the relay operation for the second STA.
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公开(公告)号：US20250081000A1
公开(公告)日：2025-03-06
申请号：US18726699
申请日：2023-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Weiwei WANG , Hong WANG , Lixiang XU
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Embodiments of the present invention provide a communication method and apparatus in a wireless communication system, an electronic device and a storage medium. The method can be executed by a first network node. The method includes receiving a first message including address information for data transmission with a second network node, and obtain the address information for the data transmission. wherein the address information for the data transmission includes address information of the first network node, and at least one address information corresponding to at least one network entity of a third network node.
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384.发明申请公开(公告)号：US20250080984A1
公开(公告)日：2025-03-06
申请号：US18720873
申请日：2022-12-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Rajavelsamy RAJADURAI , Rohini RAJENDRAN , Vinay Kumar SHRIVASTAVA , Varini GUPTA , Nivedya Parambath SASI
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. Method and system for supporting protection of MBS traffic in wireless network. Embodiments herein disclose a method and a system for supporting protection of Multi-cast Broadcast Service (MBS) traffic in a wireless network. The method includes receiving security information in a MBS announcement by user equipment (UE) (100). The method includes determining if MBS traffic protection is applied or not over the service layer; determining whether security capability of the MBS supports handling of the MBS traffic protected at the service layer, when the MBS traffic protection is applied over the service layer; joining a MBS session by sending a Non-access stratum (NAS) request message to a session management function (SMF) device (200), and requesting for the 5GC individual traffic delivery method by including an indication in the NAS request message, if the security capability of the MBS does not support handling of the MBS traffic protected at the service layer; and receiving the MBS traffic via 5GC individual traffic delivery method.
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385.发明申请公开(公告)号：US20250080798A1
公开(公告)日：2025-03-06
申请号：US18932163
申请日：2024-10-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Namhyun KIM , Gaeun Kim , Kyungwoo Kim , Kyumin Kim , Bora Park , Kangsik Yoon , Duhe Jang
IPC: H04N21/4402 , H04N21/426 , H04N21/434
Abstract: A transmission device includes a communication interface configured to perform communications with an external device and at least one display device, a memory configured to store analog data received from the external device, a signal processor, and a processor configured to control the signal processor to decode the analog data, separate the decoded analog data into analog audio data, analog video data, and analog additional data, convert the analog audio data, the analog video data, and the analog additional data, separated from one another, respectively, to digital audio data, digital video data, and digital additional data, configure a digital transport stream including a plurality of packets by separately packetizing the digital audio data, the digital video data, and the digital additional data, respectively, and transmit, using the communication interface, the digital transport stream to the at least one display device.
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Patent Agency Ranking
386.发明申请公开(公告)号：US20250080142A1
公开(公告)日：2025-03-06
申请号：US18676949
申请日：2024-05-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： HEESOO KIM , SANGYUN LEE , JEONGYEOL BAE , JIYOUNG LEE , SANGMIN YOO , JONGSOO LEE
Abstract: An RF circuit including: first and second ports receiving first and second RF signals; a (1-1)-th amplification stage and a (1-2)-th amplification stage connected to the first port and a first ground to amplify the first RF signal; a (2-1)-th amplification stage and a (2-2)-th amplification stage connected to the second port and a second ground to amplify the second RF signal; a (1-1)-th switch connected to the (1-1)-th amplification stage and the second ground, and a (1-2)-th switch connected to the (1-2)-th amplification stage and the second ground; a (2-1)-th switch connected to the (2-1)-th amplification stage and the first ground, and a (2-2)-th switch connected to the (2-2)-th amplification stage and the first ground; and a mixer to mix the first RF signal or the second RF signal with an LO signal, and mix the first RF signal or the second RF signal with the LO signal.
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公开(公告)号：US20250080135A1
公开(公告)日：2025-03-06
申请号：US18953753
申请日：2024-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu SEOL , Jiyoup KIM , Hyejeong SO , Myoungbo KWAK , Pilsang YOON , Sucheol LEE , Youngdon CHOI , Junghwan CHOI
Abstract: Encoding and decoding apparatuses and methods for implementing multi-mode coding are provided. The apparatus includes a transmitter and a receiver connected to a data bus. When data bursts are converted by the transmitter into codewords each including a plurality of symbols and/or a codeword received by the receiver is recovered as data bursts, maximum transition avoidance (MTA) codeword mappings in which no maximum transition (MT) event occurs between the plurality of symbols and minimum DC current (MDC) codeword mappings related to minimum power consumption of the plurality of symbols are used.
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公开(公告)号：US20250079421A1
公开(公告)日：2025-03-06
申请号：US18757626
申请日：2024-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihyun Lim , Yoonyoung Jeon
IPC: H01L25/16 , H01L23/00 , H01L23/498
Abstract: Provided is a semiconductor package including a first wiring structure, a second wiring structure disposed on the first wiring structure, an expanded layer electrically connecting the first wiring structure and the second wiring structure to each other, and including an expanded base layer and a plurality of via structures, a semiconductor chip disposed in the expanded layer and between the first wiring structure and the second wiring structure, and a buried capacitor structure including a plurality first through-holes spaced apart from each other that penetrate the expanded base layer adjacent to the semiconductor chip, and extend in a first horizontal direction along a side surface of the semiconductor chip, and a plurality of electrode layers disposed on sidewalls of the plurality of first through-holes.
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公开(公告)号：US20250079393A1
公开(公告)日：2025-03-06
申请号：US18748354
申请日：2024-06-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Cheon PARK , Un-Byoung KANG , Ku Young KIM , Jun Woo MYUNG , Seung-Jin LEE , Ji-Seok HONG
IPC: H01L23/00 , H01L23/28 , H01L23/48 , H01L23/498 , H01L25/065 , H10B80/00
Abstract: A semiconductor package includes: a first semiconductor chip including a first substrate and a first through electrode passing through the first substrate, wherein the first substrate has a first active surface and a first non-active surface; a chip structure including a plurality of second semiconductor chips stacked on the first semiconductor chip, wherein each second semiconductor chip includes a second substrate and a second through electrode passing through the second substrate; and a third semiconductor chip disposed on the chip structure, and including a third substrate, wherein the first substrate has a first width and a first thickness, wherein the second substrate has a second width and a second thickness, and the third substrate has a third width and a third thickness, wherein the third thickness is thicker than the second thickness, and the third width is greater than the second width.
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公开(公告)号：US20250079382A1
公开(公告)日：2025-03-06
申请号：US18807488
申请日：2024-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeean Lee , Dongwon Kang , Dahee Kim , Changyeon Song , Sunguk Lee
IPC: H01L23/00 , H01L23/31 , H01L23/538
Abstract: Provided is a semiconductor package including a lower package substrate including lower insulating layers, a first semiconductor device mounted on the lower package substrate, a core layer on the lower package substrate to be laterally spaced apart from the first semiconductor device, an encapsulation material surrounding the first semiconductor device and covering an upper portion of the core layer, an upper package substrate disposed on the encapsulation material, the upper package substrate including a first upper redistribution layer and a second upper redistribution layer; wherein a first line width and a first line spacing of a first fine pattern of the first upper redistribution pattern are greater than or equal to a corresponding second line width and a corresponding second line spacing of a second fine pattern of the second upper redistribution pattern, respectively.
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